Specific Process Knowledge/Thin film deposition: Difference between revisions

Revision as of 09:45, 5 November 2014

3rd Level - Material/Method

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Dielectrica	Semicondutors	Metals	Alloys	Transparent conductive oxides	Polymers
Silicon Nitride - and oxynitride Silicon Oxide Titanium Oxide Alumina (Al2O3, Aluminium Oxide) Tantalum (Ta2O5, Tantalum pentoxide) Cromia (Cr2O3, Chromium Oxide)	Silicon Germanium Zinc Oxide (ZnO)	Aluminium Titanium Chromium Cobalt Nickel Copper Molybdenum Palladium Silver Tin Tantalum Tungsten Platinum Gold Iron Magnesium Niobium Ruthenium	TiW alloy (10%/90% by weight) NiCr alloy AlTi alloy NiV alloy AlCu CoFe CuTi FeMn MnIr NiCo NiFe YSZ (Yttrium stabilized Zirconium)	ITO (Tin doped Indium Oxide) AZO (Aluminum doped Zinc Oxide	SU8 Antistiction coating Topas PMMA

PVD	LPCVD	PECVD	ALD	Coaters	Others
Alcatel - E-beam evaporator and sputter tool Lesker - Sputter tool PVD co-sputter/evaporation - E-beam evaporator and multiple wafer tool Wordentec - E-beam evaporator, sputter and thermal evaporator Physimeca - E-beam evaporator (III-V lab) IBE/IBSD Ionfab 300 - Sputter deposition of high quality optical layers and milling/etching Sputter coater Hummer - Gold sputtering system Balzer Sputter coater - Gold sputtering system III-V Dielectric evaporator - E-beam evaporation tool	Furnace LPCVD Nitride (4" and 6") - Deposition of silicon nitride Furnace LPCVD Polysilicon (4" and 6") Deposition of polysilicon Furnace LPCVD TEOS (4") - Deposition of silicon oxide	PECVD - Plasma Enhanced Chemical Vapor deposition Black Magic PECVD - Black Magic PECVD (Carbon)	ALD Picosun R200 - Atomic layer deposition	See the Lithography/Coaters page for coating polymers	MVD - Molecular Vapor Deposition Electroplating-Ni - Electrochemical deposition of nickel MOCVD - Epitaxial growth - Ask the department of photonics

@@ Line 22: / Line 22: @@
 |style="background: #DCDCDC"|
 [[/Deposition of Silicon|Silicon]] <br/>
-[[/Deposition of Germanium|Germanium]]
+[[/Deposition of Germanium|Germanium]] <br/>
 [[/Lesker|Zinc Oxide (ZnO)]]<br/>
 |style="background: LightGray"|
@@ Line 43: / Line 43: @@
 [[/Lesker|Niobium]]<br/>
 [[/Lesker|Ruthenium]]<br/>
-[[/Lesker|/Lesker]]<br/>
-[[/Lesker|Cobalt]]<br/>
-[[/Lesker|Cobalt]]<br/>
-[[/Lesker|Cobalt]]<br/>
 |style="background: #DCDCDC"|
 [[/Deposition of TiW|TiW]] alloy (10%/90% by weight) <br/>
 [[/Deposition of NiCr|NiCr]] alloy  <br/>
 [[/Deposition of AlTi|AlTi]] alloy <br/>
-[[/Deposition of NiV|NiV]] alloy
+[[/Deposition of NiV|NiV]] alloy <br/>
 [[/Lesker|AlCu]]<br/>
 [[/Lesker|CoFe]]<br/>
@@ Line 59: / Line 55: @@
 [[/Lesker|NiCo]]<br/>
 [[/Lesker|NiFe]]<br/>
-[[/Lesker|Cobalt]]<br/>
+[[/Lesker|YSZ (Yttrium stabilized Zirconium)]]<br/>
-[[/Lesker|Cobalt]]<br/>
 |style="background: LightGray"|
-ITO
+[[/Lesker|ITO (Tin doped Indium Oxide)]]<br/>
+[[/Lesker|AZO (Aluminum doped Zinc Oxide]]<br/>
 |style="background: #DCDCDC"|
 [[Specific Process Knowledge/Photolithography/SU8|SU8]]<br/>