Specific Process Knowledge/Lithography/Espacer: Difference between revisions

Revision as of 11:34, 10 July 2014

We have Espacer in stock and approved for use in the cleanroom. You can find a guideline for a process flow here: Process_Flow_ZEP_ESPACER.docx‎. Technical information of Espacer can be found here: Espacer_300_Technical_Info.pdf‎, Espacer_catalog.pdf‎.

Please contact Lithography if you wish to test this material.

Process	No ESPACER	ESPACER
Resist	AR-P 6200/2 AllResist E-beam resist
Spin Coat	1 min @ 4000 rpm, softbake 2 min @ 150 degC, thickness ~140nm
ESPACER		1 min @ 2000 rpm (no softbake), Manual Spinner 1 (Laurell)
E-beam exposure	2 nA, aperture 5, dose 150-310 muC/cm2, SHOT A,10
Rinse		Rinsed with hand shower in fumehood, dried with N2 gun
Developing	SX-AR 600-54/6 60 sec, 60 sec IPA rinse
Characterization: Nikon ECLIPSE optical microscope, E-5
All doses
230 muC/cm2
219 muC/cm2
Sputter Coated		<10nm Pt at DTU CEN
Zeiss SEM supra 60VP, D-2		230 muC/cm2

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