Specific Process Knowledge/Lithography/Espacer: Difference between revisions

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We have ESPACER in stock and approved for use in the cleanroom. You can find a guideline for a process flow here: [[media:Process_Flow_ZEP_ESPACER.docx‎|Process_Flow_ZEP_ESPACER.docx‎]]. Technical information of EPSCAER can be found here: [[media:Espacer_300_Technical_Info.pdf‎|Espacer_300_Technical_Info.pdf‎]], [[media:Espacer_catalog.pdf‎|Espacer_catalog.pdf‎]].
We have Espacer in stock and approved for use in the cleanroom. You can find a guideline for a process flow here: [[media:Process_Flow_ZEP_ESPACER.docx‎|Process_Flow_ZEP_ESPACER.docx‎]]. Technical information of Espacer can be found here: [[media:Espacer_300_Technical_Info.pdf‎|Espacer_300_Technical_Info.pdf‎]], [[media:Espacer_catalog.pdf‎|Espacer_catalog.pdf‎]].


Please contact [mailto:lithography@danchip.dtu.dk Lithography] if you wish to test this material.
Please contact [mailto:lithography@danchip.dtu.dk Lithography] if you wish to test this material.

Revision as of 09:25, 10 July 2014

We have Espacer in stock and approved for use in the cleanroom. You can find a guideline for a process flow here: Process_Flow_ZEP_ESPACER.docx‎. Technical information of Espacer can be found here: Espacer_300_Technical_Info.pdf‎, Espacer_catalog.pdf‎.

Please contact Lithography if you wish to test this material.


Process No ESPACER ESPACER
Resist AR-P 6200/2 AllResist E-beam resist
Spin Coat 1 min @ 4000 rpm, softbake 2 min @ 150 degC, thickness ~140nm
ESPACER 1 min @ 2000 rpm (no softbake), Manual Spinner 1 (Laurell)
E-beam exposure 2 nA, aperture 5, dose 150-310 muC/cm2, SHOT A,10
Rinse Rinsed with hand shower in fumehood, dried with N2 gun
Developing SX-AR 600-54/6 60 sec, 60 sec IPA rinse
Characterization Nikon ECLIPSE optical microscope, E-5