Specific Process Knowledge/Thin film deposition/Deposition of Titanium: Difference between revisions

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VisualWikitext

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 ! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]])
 |-
 |-style="background:WhiteSmoke; color:black"
-! Batch size
+! General description
-|
+|E-beam deposition of Titanium
-*Up to 1x4" wafers
+|E-beam deposition of Titanium
-*smaller pieces
+|E-beam deposition of Titanium
-|
+|Sputter deposition of Titanium
-*24x2" wafers or
-*6x4" wafers or
-*6x6" wafers
-|
-*12x2" wafers or
-*12x4" wafers or
-*4x6" wafers
-|
-*24x2" wafers or
-*6x4" wafers or
-*6x6" wafers
 |-
 |-style="background:LightGrey; color:black"
 ! Pre-clean
@@ Line 56: / Line 47: @@
 |-
+|-style="background:WhiteSmoke; color:black"
+! Batch size
+|
+*Up to 1x4" wafers
+*smaller pieces
+|
+*24x2" wafers or
+*6x4" wafers or
+*6x6" wafers
+|
+*12x2" wafers or
+*12x4" wafers or
+*4x6" wafers
+|
+*24x2" wafers or
+*6x4" wafers or
+*6x6" wafers
+|-
+|-style="background:LightGrey; color:black"
-|-style="background:WhiteSmoke; color:black"
 ! Allowed substrates
@@ Line 78: / Line 86: @@
 * Pyrex wafers
 |-
-|-style="background:LightGrey; color:black"
+|-style="background:WhiteSmoke; color:black"
 !Allowed materials
 |
@@ Line 112: / Line 120: @@
 * SU-8
 * Metals
-|-style="background:WhiteSmoke; color:black"
+|-style="background:LightGrey; color:black"
 ! Comment
 |
@@ Line 119: / Line 128: @@
 |
 |-
-|-style="background:LightGrey; color:black"
 |}
 '''*'''  ''For thicknesses above 200 nm permission from ThinFilm group (thinfilm@danchip.dtu.dk) is required.''
 == Comments: Choise of equipment ==