Specific Process Knowledge/Thin film deposition/Deposition of Titanium: Difference between revisions

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Titanium deposition

Titanium can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment.

	E-beam evaporation (Alcatel)	E-beam evaporation (Wordentec)	E-beam evaporation (PVD co-sputter/evaporation)	Sputter deposition (Wordentec)
General description	E-beam deposition of Titanium	E-beam deposition of Titanium	E-beam deposition of Titanium	Sputter deposition of Titanium
Pre-clean	RF Ar clean	RF Ar clean	RF Ar clean	RF Ar clean
Layer thickness	10Å to 1µm*	10Å to 1 µm*	10Å to 1000Å	.
Deposition rate	2Å/s to 15Å/s	10Å/s to 15Å/s	About 1Å/s	Depending on process parameters, see here.
Batch size	Up to 1x4" wafers smaller pieces	24x2" wafers or 6x4" wafers or 6x6" wafers	12x2" wafers or 12x4" wafers or 4x6" wafers	24x2" wafers or 6x4" wafers or 6x6" wafers
Allowed substrates	Silicon wafers Quartz wafers Pyrex wafers	Silicon wafers Quartz wafers Pyrex wafers	Silicon wafers Quartz wafers Pyrex wafers	Silicon wafers Quartz wafers Pyrex wafers
Allowed materials	Silicon oxide Silicon (oxy)nitride Photoresist PMMA Mylar SU-8 Metals	Silicon oxide Silicon (oxy)nitride Photoresist PMMA Mylar SU-8 Metals	Silicon oxide Silicon (oxy)nitride Photoresist PMMA Mylar SU-8 Metals	Silicon oxide Silicon (oxy)nitride Photoresist PMMA Mylar SU-8 Metals
Comment			Only very thin layers (up to 100nm).

* For thicknesses above 200 nm permission from ThinFilm group (thinfilm@danchip.dtu.dk) is required.

Comments: Choise of equipment

Thick layers

Comments: Adhesion layer

Ti as adhesion layer

@@ Line 16: / Line 16: @@
 ! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]])
 |-
 |-style="background:WhiteSmoke; color:black"
-! Batch size
+! General description
-|
+|E-beam deposition of Titanium
-*Up to 1x4" wafers
+|E-beam deposition of Titanium
-*smaller pieces
+|E-beam deposition of Titanium
-|
+|Sputter deposition of Titanium
-*24x2" wafers or
-*6x4" wafers or
-*6x6" wafers
-|
-*12x2" wafers or
-*12x4" wafers or
-*4x6" wafers
-|
-*24x2" wafers or
-*6x4" wafers or
-*6x6" wafers
 |-
 |-style="background:LightGrey; color:black"
 ! Pre-clean
@@ Line 56: / Line 47: @@
 |-
+|-style="background:WhiteSmoke; color:black"
+! Batch size
+|
+*Up to 1x4" wafers
+*smaller pieces
+|
+*24x2" wafers or
+*6x4" wafers or
+*6x6" wafers
+|
+*12x2" wafers or
+*12x4" wafers or
+*4x6" wafers
+|
+*24x2" wafers or
+*6x4" wafers or
+*6x6" wafers
+|-
+|-style="background:LightGrey; color:black"
-|-style="background:WhiteSmoke; color:black"
 ! Allowed substrates
@@ Line 78: / Line 86: @@
 * Pyrex wafers
 |-
-|-style="background:LightGrey; color:black"
+|-style="background:WhiteSmoke; color:black"
 !Allowed materials
 |
@@ Line 112: / Line 120: @@
 * SU-8
 * Metals
-|-style="background:WhiteSmoke; color:black"
+|-style="background:LightGrey; color:black"
 ! Comment
 |
@@ Line 119: / Line 128: @@
 |
 |-
-|-style="background:LightGrey; color:black"
 |}
 '''*'''  ''For thicknesses above 200 nm permission from ThinFilm group (thinfilm@danchip.dtu.dk) is required.''
 == Comments: Choise of equipment ==