Specific Process Knowledge/Thin film deposition: Difference between revisions

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{| {{table}}
{| {{table}}
| align="center" style="background:#f0f0f0;"|''' Parameters'''
| align="center" style="background:#f0f0f0;"|''' Dielectrica'''
| align="center" style="background:#f0f0f0;"|''' Units '''
| align="center" style="background:#f0f0f0;"|''' Semicondutors'''
|-
| align="center" style="background:#f0f0f0;"|''' Metals'''
| Temperature||deg C||
| align="center" style="background:#f0f0f0;"|''' Alloys'''
|-
| align="center" style="background:#f0f0f0;"|''' Polymers'''
| Pressure ||mbar||
|-
| Flow ||sccm||
|-
|-
|  
|  
|}
*Temperature
 
*deg C
 
|  
 
*Pressure
{| style="color: black;" valign="top"
*mbar
|-
|
| style="width: 50%"|
*Flow
 
*sccm
{| style="color: black;" valign="top"
|  
|-
*ert
| style="width: 50%"|
*ert
 
|
{| style="color: black;" valign="top"
*sdfg
|-
*sdf
| style="width: 50%"|
 
{| style="color: black;"
|-
| style="width: 50%"|
 
{| style="color: black;"
|-
|-
| style="width: 50%"|
===Dielectrica===
*[[Specific Process Knowledge/Lithography/Pretreatment#HMDS|HMDS]]
*[[Specific Process Knowledge/Lithography/Pretreatment#BHF|BHF]]
*[[Specific Process Knowledge/Lithography/Pretreatment#250_C_oven_for_pretreatment|250C Oven for Pretreatment]]
*[[Specific Process Knowledge/Lithography/Coaters#SSE Spinner|SSE Spinner]]
*[[Specific Process Knowledge/Lithography/Coaters#Spin Track 1 + 2|Spin Track 1 + 2]]
*[[Specific Process Knowledge/Lithography/Coaters#KS Spinner|KS Spinner]]
*[[Specific Process Knowledge/Lithography/Coaters#Manual Spinner (Polymers)|Manual Spinner (Polymers)]]
*[[Specific Process Knowledge/Lithography/Coaters#Manual Spinner 1 (Laurell)|Manual Spinner 1 (Laurell)]]
*[[Specific Process Knowledge/Lithography/Coaters#III-V Spinner|III-V Spinner]]
*[[Specific_Process_Knowledge/Lithography/Coaters/SprayCoater|Spray Coater]]
*[[Specific Process Knowledge/Lithography/UVExposure#KS Aligner|KS Aligner]]
*[[Specific Process Knowledge/Lithography/UVExposure#Aligner-6inch|Aligner-6inch]]
*[[Specific Process Knowledge/Lithography/UVExposure#III-V Aligner|III-V Aligner]]
*[[Specific Process Knowledge/Lithography/UVExposure#Inclined UV lamp|Inclined UV lamp]]
*[[Specific Process Knowledge/Lithography/Baking#Hotplates|Hotplates]]
*[[Specific Process Knowledge/Lithography/Baking#Ovens|Ovens]]
*[[Specific Process Knowledge/Lithography/Development#Automatic Developer Bench for 4" and 6"|Developer Bench]]
*[[Specific Process Knowledge/Lithography/Strip#Plasma Asher 1|Plasma Asher 1]]
*[[Specific Process Knowledge/Lithography/Strip#Plasma Asher 2|Plasma Asher 2]]
*[[Specific Process Knowledge/Lithography/Strip#III-V Plasma Asher|III-V Plasma Asher]]
*[[Specific Process Knowledge/Lithography/Strip#Rough Acetone Strip|Rough Acetone Strip]]
*[[Specific Process Knowledge/Lithography/Strip#Fine Acetone Strip|Fine Acetone Strip]]
*[[Specific Process Knowledge/Lithography/LiftOff#LiftOffWetBench|Lift-off Wet Bench]]
*[[Specific Process Knowledge/Lithography/LiftOff#LiftOff(4",6")|Lift-off (4", 6")]]
*[[Specific Process Knowledge/Lithography/WaferCleaning#Spindryers|Spin dryers]]
|}
|valign="top"|
===Semiconductors===
*[[Specific Process Knowledge/Lithography/DUVStepper#SÜSS Spinner-Stepper|SÜSS Spinner-Stepper]]
*[[Specific Process Knowledge/Lithography/DUVStepper#Process information|Process information]]
*[[Specific Process Knowledge/Lithography/DUVStepper#DUV Stepper FPA-3000EX4 from Canon|DUV Stepper FPA-3000EX4 from Canon]]
*[[Specific Process Knowledge/Lithography/DUVStepper#Process information|Process information]]
*[[Specific Process Knowledge/Lithography/DUVStepper#Overview of performance|Overview of performance]]
|}
|valign="top"|
===Metals===
*[[Specific Process Knowledge/Lithography/EBeamLithography#Performance of the e-beam writer|Performance]]
*[[Specific Process Knowledge/Lithography/EBeamLithography#Getting started|Getting started]]
*[[Specific Process Knowledge/Lithography/EBeamLithography#E-beam resists and Process Flows|E-beam resists and Process Flows]]
*[[Specific Process Knowledge/Lithography/EBeamLithography#Proximity Error Correction|Proximity Error Correction]]
*[[Specific Process Knowledge/Lithography/EBeamLithography#Charging of non-conductive substrates|Charging of non-conductive substrates]]
|}
|valign="top"|
===Alloys===
*[[Specific Process Knowledge/Lithography/NanoImprintLithography#Molecular Vapour Deposition|Molecular Vapour Deposition]]
*[[Specific Process Knowledge/Lithography/NanoImprintLithography#ObducatNIL|Obducat NIL]]
*[[Specific Process Knowledge/Lithography/NanoImprintLithography#EVG NIL|EVG NIL]]
|}
|valign="top"|
===Polymers===
*[[Specific Process Knowledge/Lithography/3DLithography#2-Photon Polymerization|2-Photon Polymerization]]
|}
|}

Revision as of 13:52, 14 October 2013

3rd Level - Material/Methode

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Choose material to deposit

Dielectrica

Metals/elements

Period/Group

IVB VB VIB VIIIB IB IIIA IVA
3 . . . . . 13 Al Aluminium 14 Si Silicon
4 22 Ti Titanium . 24 Cr Chromium 28 Ni Nickel 29 Cu Copper . 32 Ge Germanium
5 . . 42 Mo Molybdenum 46 Pd Palladium 47 Ag Silver . 50 Sn Tin
6 . 73 Ta Tantalum 74 W Tungsten 78 Pt Platinum 79 Au Gold . .

Alloys


Polymers

  • SU8
  • Antistiction coating
  • Topas
  • PMMA

Choose deposition equipment


Section under construction

Dielectrica Semicondutors Metals Alloys Polymers
  • Temperature
  • deg C
  • Pressure
  • mbar
  • Flow
  • sccm
  • ert
  • ert
  • sdfg
  • sdf
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