Jump to content

Specific Process Knowledge/Etch/Etching of Platinum: Difference between revisions

← Older edit
VisualWikitext
BGE (talk | contribs)
Bureaucrats, danchip, Administrators
2,908 edits
Mbec (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
191 edits
No edit summary
 
(9 intermediate revisions by 4 users not shown)
Line 1: Line 1:
'''Unless anything else is stated, everything on this page, text and pictures are made by DTU Nanolab.'''


=<span style="background:#FF2800">THIS PAGE IS UNDER CONSTRUCTION</span>[[image:Under_construction.png|200px]]=
'''All links to Kemibrug (SDS) and Labmanager Including APV and QC requires login.'''


'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Etch/Etching_of_Platin click here]'''


 
[[Category: Equipment|Etch Wet Platinum]]
 
[[Category: Etch (Wet) bath|Platinum]]
'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Etch/Etching_of_Platin click here]'''


==Etching of Platinum==
==Etching of Platinum==
Line 14: Line 15:
<br clear="all" />
<br clear="all" />


==Comparison of Gold Etch Methods==
==Comparison of Platinum Etch Methods==


{|border="1" cellspacing="1" cellpadding="3" style="text-align:left;"  
{|border="1" cellspacing="1" cellpadding="3" style="text-align:left;"  
Line 22: Line 23:
|-style="background:silver; color:black"
|-style="background:silver; color:black"
!
!
![[Specific Process Knowledge/Etch/Wet Gold Etch|Au wet etch 1]]
![[Specific Process Knowledge/Etch/Wet Platinum Etch|Pt wet etch]]
![[Specific Process Knowledge/Etch/Wet Gold Etch|Au wet etch 2]]
![[Specific_Process_Knowledge/Etch/IBE&frasl;IBSD Ionfab 300|IBE (Ionfab300+)]]
![[Specific_Process_Knowledge/Etch/IBE&frasl;IBSD Ionfab 300|IBE (Ionfab300+)]]
|-
|-
Line 30: Line 30:
|-style="background:WhiteSmoke; color:black"
|-style="background:WhiteSmoke; color:black"
!Generel description
!Generel description
|Wet etch of Au using Iodine based chemistry
|Wet etch of Pt
|Wet etch of Au using Aqua Regina
|Sputtering of Pt
|Sputtering of Au - pure physical etch
|-
|-


Line 39: Line 38:
!Etch rate range
!Etch rate range
|
|
*~100nm/min
*~ 1 - 10 nm/min (not tested yet)
|
|
*~?nm/min - fast etch
*~30nm/min (not tested yet)  
|
*~55nm/min (acceptance test)  
|-
|-


Line 49: Line 46:
|-style="background:WhiteSmoke; color:black"
|-style="background:WhiteSmoke; color:black"
!Etch profile
!Etch profile
|
*Isotropic
|
|
*Isotropic
*Isotropic
Line 60: Line 55:
!Masking material
!Masking material
|
|
*Photoresist
*None (only used for stripping Pt)
|
*None (only used for stipping Au)
|
|
*Any material that is allowed in the chamber, photoresists included  
*Any material that is allowed in the chamber, photoresists included  
Line 72: Line 65:
!Substrate size
!Substrate size
|
|
*Any size and number that can go inside the beaker in use  
*Any size and number that can go inside the beaker in use
|
*Any size and number that can go inside the beaker in use
 
|
|
Smaller pieces glued to carrier wafer
Smaller pieces glued to carrier wafer
Line 88: Line 78:
!'''Allowed materials'''
!'''Allowed materials'''
|
|
No restrictions cross contamination wise as long as you use the right beaker and make sure that they are safe to enter in the chemicals  
No restrictions cross contamination wise as long as you use the right beaker and make sure that they are safe to enter in the chemicals
|
No restrictions cross contamination wise as long as you use the right beaker and make sure that they are safe to enter in the chemicals
|
|
*Silicon  
*Silicon  
Retrieved from "https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Etch/Etching_of_Platinum"