Specific Process Knowledge/Thin film deposition: Difference between revisions

MVD - Molecular Vapor Deposition
Electroplating of Ni, Cu, Au, etc. - Ask in the department of Mechanical Engineering
MOCVD - Epitaxial growth of InP, GaAs and other III-V materials - Ask DTU Electro if you are interested: Elizaveta Semenova or Kresten Yvind

@@ Line 1: / Line 1: @@
-<center><span style="background:PaleGreen">3rd Level - Material/Method</span></center>
 '''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Thin_film_deposition click here]'''
+<i> Unless otherwise stated, this page is written by <b>DTU Nanolab internal</b></i>
@@ Line 20: / Line 21: @@
 [[/Deposition of Silicon|Silicon]] <br/>
 [[/Deposition of Germanium|Germanium]] <br/>
-[[/DiamondCVD|Diamond]] <br/>
 |style="background: #DCDCDC"|
@@ Line 39: / Line 39: @@
 [[/Deposition of Silicon Nitride|Silicon Nitride]] - ''and oxynitride'' <br/>
 [[/Deposition of Titanium Nitride|Titanium Nitride]] - ''conductive ceramics'' <br/>
+[[/Deposition of Niobium Titanium Nitride| Niobium Titanium Nitride]] - ''superconductors''<br/>
 [[/Deposition of Aluminium Nitride| Aluminum Nitride (Al<sub>x</sub>N<sub>y</sub>)]]<br/>
+[[/Deposition of Scandium Nitride| Scandium Nitride (Sc<sub>x</sub>N<sub>y</sub>)]]<br/>
 |style="background: #DCDCDC"|
 [[/Deposition of Carbon|Carbon]] <br/>
-[[/Deposition of Titanium Carbide|Titanium Carbide (TiC)]]<br/>
+<!-- [[/Deposition of Titanium Carbide|Titanium Carbide (TiC)]]<br/> -->
 [[/Deposition of Silicon Carbide|Silicon Carbide (SiC)]]<br/>
+[[/Sputter deposition of metals and alloys|Tantalum carbide (TaC<sub>x</sub>)]]<br/>
@@ Line 51: / Line 54: @@
 [[/Deposition of Aluminium|Aluminium]] <br/>
 [[/Deposition of Chromium|Chromium]]<br/>
-[[/Sputter deposition of metals and alloys|Cobalt]]<br/>
 [[/Deposition of Copper|Copper]]<br/>
 [[/Deposition of Gold|Gold]]<br/>
@@ Line 68: / Line 70: @@
 [[/Deposition of Tungsten|Tungsten]]<br/>
 [[/Deposition of Zinc|Zinc]]<br/>
+[[/Deposition of Scandium|Scandium]]<br/>
@@ Line 73: / Line 76: @@
 |style="background: #DCDCDC"|
 [[/Sputter deposition of metals and alloys|AlCu]]<br/>
-[[/Sputter deposition of metals and alloys|CoFe]]<br/>
 [[/Sputter deposition of metals and alloys|CuTi]]<br/>
 [[/Sputter deposition of metals and alloys|FeMn]]<br/>
 [[/Sputter deposition of metals and alloys|MnIr]]<br/>
 [[/Cluster-based_multi-chamber_high_vacuum_sputtering_deposition_system#Process information|NbTi]] <br/>
-[[/Sputter deposition of metals and alloys|NiCo]]<br/>
 [[/Deposition of NiFe|NiFe]]<br/>
 [[/Deposition of NiV|NiV]] alloy <br/>
@@ Line 86: / Line 87: @@
 [[/Sputter deposition of oxides and other compounds|YSZ]] (Yttrium stabilized zirconia)<br/>
+[[/Gadolinium Cerium Oxide|Gd<sub>0.2</sub>Ce<sub>0.8</sub>O<sub>2</sub> (GCO)]]
 |style="background: LightGray"|
@@ Line 108: / Line 110: @@
 {| {{table}}
-| align="left" valign="top"  style="background:LightGray"|''' PVD'''
+| align="left" valign="top"  style="background:LightGray"|''' PVD - Physical vapor deposition'''
-| align="left" valign="top" style="background:#DCDCDC;"|''' LPCVD'''
+| align="left" valign="top" style="background:#DCDCDC;"|''' LPCVD - low pressure chemical vapor deposition'''
-| align="left" valign="top" style="background:LightGray"|''' PECVD'''
+| align="left" valign="top" style="background:LightGray"|''' PECVD - plasma enhanced chemical vapor deposition'''
-| align="left" valign="top" style="background:#DCDCDC;"|''' ALD'''
+| align="left" valign="top" style="background:#DCDCDC;"|''' ALD - atomic layer deposition'''
-| align="left" valign="top" style="background:LightGray"|''' Coaters'''
+| align="left" valign="top" style="background:LightGray"|''' Coaters - for polymers'''
 | align="left" valign="top" style="background:#DCDCDC;"|''' Others'''
@@ Line 123: / Line 125: @@
 *[[/Wordentec|Wordentec]] - ''E-beam evaporator, sputter and thermal evaporator''
 *[[/thermalevaporator|Thermal evaporator]]
-*[[/Temescal|E Beam Evaporator (Temescal)]]
+*[[/Temescal|E-Beam Evaporator (Temescal)]]
+*[[/10-pocket e-beam evaporator|E-Beam Evaporator (10 pockets)]]
 *[[/Sputter coater#Sputter_coater_03_(Cressington)|Sputter coater 03]] - ''Gold sputtering system''
 *[[/Sputter coater#Sputter_coater_04_(Agar Scientific)|Sputter coater 04]] - ''Gold sputtering system''
@@ Line 140: / Line 143: @@
 |style="background: LightGray"|
 *[[/PECVD|PECVD]] - ''Plasma Enhanced Chemical Vapor deposition''
-*[[/Black Magic PECVD|Black Magic PECVD]] - ''Black Magic PECVD (Carbon)''
+<!--*[[/DiamondCVD|Seki Diamond CVD]] - ''Microwave Plasma CVD for diamond Growth''-->
-*[[/DiamondCVD|Seki Diamond CVD]] - ''Microwave Plasma CVD for diamond Growth''
 |style="background: #DCDCDC"|
 *[[/ALD Picosun R200|ALD1]] - Atomic Layer Deposition (thermal)
@@ Line 149: / Line 151: @@
 |style="background: #DCDCDC"|
 *[[/MVD|MVD]] - ''Molecular Vapor Deposition''
-*[[/Electroplating-Ni|Electroplating-Ni]] - ''Electrochemical deposition of nickel''
+*Electroplating of Ni, Cu, Au, etc. - ''Ask in the department of Mechanical Engineering''
-*[[/Electroplating-Cu|Electroplating-Cu]] - ''Electrochemical deposition of copper''
+*MOCVD - Epitaxial growth of InP, GaAs and other III-V materials - ''Ask DTU Electro if you are interested: [mailto:esem@dtu.dk Elizaveta Semenova] or [mailto:kryv@dtu.dk Kresten Yvind]''
-*MOCVD - Epitaxial growth - ''Ask the department of photonics if you are interested: [mailto:esem@fotonik.dtu.dk Elizaveta Semenova] or [mailto:kryv@fotonok.dtu.dk Kresten Yvind]''
 |-
 |}