Specific Process Knowledge/Thin film deposition/MVD: Difference between revisions
No edit summary |
|||
| (25 intermediate revisions by 3 users not shown) | |||
| Line 1: | Line 1: | ||
{{cc-nanolab}} | |||
'''Feedback to this page''': '''[mailto:photolith@ | '''Feedback to this page''': '''[mailto:photolith@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Thin_film_deposition/MVD click here]''' | ||
[[Category: Equipment|Thin film MVD]] | |||
[[Category: Thin Film Deposition|MVD]] | |||
== The Molecular Vapor Deposition tool == | == The Molecular Vapor Deposition tool == | ||
[[image:Mvd.jpg|200x200px|right|thumb|The MVD is located in cleanroom 1]] | [[image:Mvd.jpg|200x200px|right|thumb|The MVD is located in cleanroom A-1]] | ||
The Applied Microstructures MVD 100 system deposits molecular films on surfaces. These films serve a wide range of purposes ranging from antistiction coatings of nanoimprint lithography stamps to protecting MEMS structures. At | The Applied Microstructures MVD 100 system deposits molecular films on surfaces. These films serve a wide range of purposes ranging from antistiction coatings of nanoimprint lithography stamps to protecting MEMS structures. At DTU Nanolab the MVD is an essential tool for nanoimprint lithography, where it is used to create antistiction coatings on the imprint stamps. | ||
===Process information | '''The user manual, user APV, and contact information can be found in LabManager:''' | ||
[http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=199 MVD in LabManager] | |||
==Process information== | |||
*[[Specific Process Knowledge/Thin film deposition/Antistiction Coating|Processing on the MVD]] | *[[Specific Process Knowledge/Thin film deposition/Antistiction Coating|Processing on the MVD]] | ||
*[[Specific Process Knowledge/Thin film deposition/Antistiction Coating#The FLAT recipe|The FLAT recipe]] | *[[Specific Process Knowledge/Thin film deposition/Antistiction Coating#The FLAT recipe|The FLAT recipe]] | ||
*[[Specific Process Knowledge/Thin film deposition/Antistiction Coating#The STAMP recipe|The STAMP recipe]] | *[[Specific Process Knowledge/Thin film deposition/Antistiction Coating#The STAMP recipe|The STAMP recipe]] | ||
== Equipment performance and process related parameters == | |||
{| border="2" cellspacing="0" cellpadding="2" | {| border="2" cellspacing="0" cellpadding="2" | ||
| Line 23: | Line 30: | ||
|style="background:LightGrey; color:black"| | |style="background:LightGrey; color:black"| | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
* | *FDTS coating of Si or SiO2 surfaces | ||
* | *Indirect O2 plasma treatment | ||
|- | |- | ||
!style="background:silver; color:black;" align="center" width="60"| | !style="background:silver; color:black;" align="center" width="60"|Vapor sources | ||
|style="background:LightGrey; color:black"| | |style="background:LightGrey; color:black"|Line | ||
|style="background:WhiteSmoke; color:black | *1 | ||
* | *2 | ||
* | *3 | ||
* | *4 | ||
|style="background:WhiteSmoke; color:black"|Chemical | |||
*Water | |||
*FDTS (new source, 2013) | |||
*FDTS (old source, contaminated line) | |||
*Available (line probably contaminated, no source heater) | |||
|- | |- | ||
!style="background:silver; color:black" align="center" valign="center" rowspan="1"|Performance | !style="background:silver; color:black" align="center" valign="center" rowspan="1"|Performance | ||
|style="background:LightGrey; color:black"| | |style="background:LightGrey; color:black"|Contact angle | ||
|style="background:WhiteSmoke; color:black" align="center"| | |style="background:WhiteSmoke; color:black" align="center"| | ||
110° (water) | |||
|- | |- | ||
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Process parameters | !style="background:silver; color:black" align="center" valign="center" rowspan="3"|Process parameters | ||
|style="background:LightGrey; color:black"| | |style="background:LightGrey; color:black"|Base pressure | ||
|style="background:WhiteSmoke; color:black" align="center" colspan="2"| | |style="background:WhiteSmoke; color:black" align="center" colspan="2"| | ||
20 mTorr | |||
|- | |- | ||
|style="background:LightGrey; color:black"| | |style="background:LightGrey; color:black"|Chamber temperature | ||
|style="background:WhiteSmoke; color:black" align="center" colspan="2"| | |style="background:WhiteSmoke; color:black" align="center" colspan="2"| | ||
35°C | |||
|- | |- | ||
|style="background:LightGrey; color:black"| | |style="background:LightGrey; color:black"|Chamber volume | ||
|style="background:WhiteSmoke; color:black" align="center"| | |style="background:WhiteSmoke; color:black" align="center" colspan="2"| | ||
Approx. 3 liters | |||
|- | |- | ||
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates | !style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates | ||
|style="background:LightGrey; color:black"|Substrate size | |style="background:LightGrey; color:black"|Substrate size | ||
|style="background:WhiteSmoke; color:black" align="center" colspan="2"| | |style="background:WhiteSmoke; color:black" align="center" colspan="2"| | ||
1" to 8" | |||
Smaller samples may be processed if fixed to a carrier | |||
|- | |- | ||
| style="background:LightGrey; color:black"|Allowed materials | | style="background:LightGrey; color:black"|Allowed materials | ||
|style="background:WhiteSmoke; color:black" align="center" colspan="2"| | |style="background:WhiteSmoke; color:black" align="center" colspan="2"| | ||
All cleanroom materials except | All cleanroom materials except steel and other ferrous materials | ||
|- | |- | ||
|style="background:LightGrey; color:black"|Batch | |style="background:LightGrey; color:black"|Batch | ||
|style="background:WhiteSmoke; color:black" align="center" colspan="2"| | |style="background:WhiteSmoke; color:black" align="center" colspan="2"| | ||
One sample at a time | |||
Two 4" or 6" wafers may be processed simultaneously using cassettes | |||
|- | |- | ||
|} | |} | ||
<br clear="all" /> | <br clear="all" /> | ||
Latest revision as of 13:52, 10 May 2023
The contents on this page, including all images and pictures, was created by DTU Nanolab staff unless otherwise stated.
Feedback to this page: click here
The Molecular Vapor Deposition tool
The Applied Microstructures MVD 100 system deposits molecular films on surfaces. These films serve a wide range of purposes ranging from antistiction coatings of nanoimprint lithography stamps to protecting MEMS structures. At DTU Nanolab the MVD is an essential tool for nanoimprint lithography, where it is used to create antistiction coatings on the imprint stamps.
The user manual, user APV, and contact information can be found in LabManager:
Process information
| Purpose |
| ||
|---|---|---|---|
| Vapor sources | Line
|
Chemical
| |
| Performance | Contact angle |
110° (water) | |
| Process parameters | Base pressure |
20 mTorr | |
| Chamber temperature |
35°C | ||
| Chamber volume |
Approx. 3 liters | ||
| Substrates | Substrate size |
1" to 8" Smaller samples may be processed if fixed to a carrier | |
| Allowed materials |
All cleanroom materials except steel and other ferrous materials | ||
| Batch |
One sample at a time Two 4" or 6" wafers may be processed simultaneously using cassettes | ||