Specific Process Knowledge/Thin film deposition/MVD: Difference between revisions

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'''Feedback to this page''': '''[mailto:photolith@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Thin_film_deposition/MVD click here]'''
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[[Category: Equipment|Thin film MVD]]
[[Category: Thin Film Deposition|MVD]]


== The Molecular Vapor Deposition tool ==
== The Molecular Vapor Deposition tool ==


[[image:Mvd.jpg|200x200px|right|thumb|The MVD is located in cleanroom 1]]
[[image:Mvd.jpg|200x200px|right|thumb|The MVD is located in cleanroom A-1]]
 
The Applied Microstructures MVD 100 system deposits molecular films on surfaces. These films serve a wide range of purposes ranging from antistiction coatings of nanoimprint lithography stamps to protecting MEMS structures. At DTU Nanolab the MVD is an essential tool for nanoimprint lithography, where it is used to create antistiction coatings on the imprint stamps.
 
 
'''The user manual, user APV, and contact information can be found in LabManager:'''
 
[http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=199 MVD in LabManager]
 
==Process information==
*[[Specific Process Knowledge/Thin film deposition/Antistiction Coating|Processing on the MVD]]
*[[Specific Process Knowledge/Thin film deposition/Antistiction Coating#The FLAT recipe|The FLAT recipe]]
*[[Specific Process Knowledge/Thin film deposition/Antistiction Coating#The STAMP recipe|The STAMP recipe]]
 
 
== Equipment performance and process related parameters ==
 
{| border="2" cellspacing="0" cellpadding="2"


The Applied Microstructures MVD 100 system deposits molecular films on surfaces. These films serve a wide range of purposes ranging from antistiction coatings of nanoimprint lithography stamps to protecting MEMS structures. At Danchip the MVD is essential for nanoimprint lithography.
!style="background:silver; color:black;" align="center" width="60"|Purpose
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black"|
*FDTS coating of Si or SiO2 surfaces
*Indirect O2 plasma treatment
|-
!style="background:silver; color:black;" align="center" width="60"|Vapor sources
|style="background:LightGrey; color:black"|Line
*1
*2
*3
*4
|style="background:WhiteSmoke; color:black"|Chemical
*Water
*FDTS (new source, 2013)
*FDTS (old source, contaminated line)
*Available (line probably contaminated, no source heater)
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="1"|Performance
|style="background:LightGrey; color:black"|Contact angle
|style="background:WhiteSmoke; color:black" align="center"|
110° (water)
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Process parameters
|style="background:LightGrey; color:black"|Base pressure
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
20 mTorr
|-
|style="background:LightGrey; color:black"|Chamber temperature
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
35°C
|-
|style="background:LightGrey; color:black"|Chamber volume
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
Approx. 3 liters
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
|style="background:LightGrey; color:black"|Substrate size
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
1" to 8"


'''The user manual, user APV, and contact information can be found in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=313 LabManager]'''
Smaller samples may be processed if fixed to a carrier
|-
| style="background:LightGrey; color:black"|Allowed materials
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
All cleanroom materials except steel and other ferrous materials
|-
|style="background:LightGrey; color:black"|Batch
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
One sample at a time


===Process information===
Two 4" or 6" wafers may be processed simultaneously using cassettes
*[[Specific Process Knowledge/Lithography/Coaters/Spin Track 1 + 2 processing|General Spin Track 1 + 2 process information]]
|-
*[[Specific Process Knowledge/Lithography/Coaters/Spin Track 1 + 2 processing#HMDS priming only|HMDS priming on Spin Track 1 and 2]]
|}


=== Equipment performance and process related parameters ===
<br clear="all" />

Latest revision as of 13:52, 10 May 2023

The contents on this page, including all images and pictures, was created by DTU Nanolab staff unless otherwise stated.

Feedback to this page: click here

The Molecular Vapor Deposition tool

The MVD is located in cleanroom A-1

The Applied Microstructures MVD 100 system deposits molecular films on surfaces. These films serve a wide range of purposes ranging from antistiction coatings of nanoimprint lithography stamps to protecting MEMS structures. At DTU Nanolab the MVD is an essential tool for nanoimprint lithography, where it is used to create antistiction coatings on the imprint stamps.


The user manual, user APV, and contact information can be found in LabManager:

MVD in LabManager

Process information


Equipment performance and process related parameters

Purpose
  • FDTS coating of Si or SiO2 surfaces
  • Indirect O2 plasma treatment
Vapor sources Line
  • 1
  • 2
  • 3
  • 4
Chemical
  • Water
  • FDTS (new source, 2013)
  • FDTS (old source, contaminated line)
  • Available (line probably contaminated, no source heater)
Performance Contact angle

110° (water)

Process parameters Base pressure

20 mTorr

Chamber temperature

35°C

Chamber volume

Approx. 3 liters

Substrates Substrate size

1" to 8"

Smaller samples may be processed if fixed to a carrier

Allowed materials

All cleanroom materials except steel and other ferrous materials

Batch

One sample at a time

Two 4" or 6" wafers may be processed simultaneously using cassettes