Specific Process Knowledge/Thermal Process/Dope with Phosphorus: Difference between revisions

From LabAdviser
Jump to navigation Jump to search
Line 17: Line 17:
'''  
'''  


To study the coherence between the temperature and time for doping with phosphorus in DTU-Danchip Phosphorus Predep furnace (A4).  
To study the coherence between the temperature of the Predep and dive-in for doping with phosphorus in DTU-Danchip Phosphorus Predep furnace (A4).  


'''
'''
====Study setup====
====Study setup====
'''
'''

Revision as of 11:49, 25 February 2013

The furnace A4 phosphorus predep(N-predep) can be used to predeposit silicon wafers with phosphor. The silicon wafers are positioned in a quarts boat. Phosphor is predeposited in the silicon wafers.

In preparation

THIS PAGE IS UNDER CONSTRUCTIONUnder construction.png

Test of Phosphorus Predep furnace

Purpose

To study the coherence between the temperature of the Predep and dive-in for doping with phosphorus in DTU-Danchip Phosphorus Predep furnace (A4).

Study setup

There was used 20 boron doped wafers (p-type). There was used four wafer to the five different temperature. There was five dummy wafers on each side of the test wafers. The dummy wafer nearest to the test wafers was changed in between the runes.

Run # Temperature Process time with POCl3 Anneal time N2 Wafer #
1 850 oC 15 minutes 20 miuntes 1, 2, 3, 4
2 900 oC 15 minutes 20 miuntes 5, 6, 7, 8
3 950 oC 15 minutes 20 miuntes 9, 10, 11, 12
4 1000 oC 15 minutes 20 miuntes 13, 14, 15, 16
5 1050 oC 15 minutes 20 miuntes 17, 18, 19, 20