Specific Process Knowledge/Back-end processing: Difference between revisions

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{{cc-nanolab}}
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'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Back-end_processing click here]'''  
'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Back-end_processing click here]'''  


'''Unless anything else is stated, everything on this page, text and pictures are made by DTU Nanolab.'''
 
=Back-end processing=


Back-end (or Post-fab) Processing are typical processes used to finish up your wafer/chip. This includes thinning and cutting out the wafer in chips that can be put on a carrier, a board or in a package, attaching the chip to the carrier and connecting it with wires to get electrical access to it.
Back-end (or Post-fab) Processing are typical processes used to finish up your wafer/chip. This includes thinning and cutting out the wafer in chips that can be put on a carrier, a board or in a package, attaching the chip to the carrier and connecting it with wires to get electrical access to it.


These processes are usually carried out a number of different places. We also have a laboratory called PackLab located in building 347 1st floor. It is a class 1000 cleanroom and in here we have equipment commonly used for back-end processing. Some equipment is further placed in the basement of building 346 and some on the 1st floor in building 346.
These processes are usually carried out a number of different places. We also have a laboratory called PackLab located in building 347 1st floor. It is a class 1000 cleanroom and in here we have equipment commonly used for back-end processing. Some equipment is further placed in the basement of building 346 and some on the 1st floor in building 346.
 
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{| {{table} style="background:LightGray"}
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! '''Note! Packlab will be closed from February/March 2023 to Q2 2024 due to the construction of our new PolyFabLab.'''
! '''Note! Packlab is currently under re-construction and planned to re-open in Q2 2025.'''
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| Some of the tools will find new temporary locations in building 346 or building 451. Please ask our staff for more information.  
| Some of the tools will find new temporary locations in building 346 or building 451. Please ask our staff for more information.  
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*Wafer dicing/machining
*Wafer dicing/machining
**[[/Polisher CMP|Polisher CMP - located in the cleanroom]]
**[[/Polisher CMP|Polisher CMP - located in the cleanroom]]
**[[/Polishing machine|Polisher/Lapper machine]]
**[[/Polishing machine|Polisher/Lapper machine]] !! Machine decommissioned end of 2024 !!
**[[/LatticeAxe|LatticeAxe]]
**[[/LatticeAxe|LatticeAxe]]
**[[/FlipScribe|FlipScribe]]
**[[/FlipScribe|FlipScribe]]
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**[[/Laser Micromachining Tool|Laser Micromachining Tool]]
**[[/Laser Micromachining Tool|Laser Micromachining Tool]]
*Molding
*Molding
**[[/Polymer Injection Molder|Polymer Injection Molder]]
**[[/Polymer Injection Molder|Polymer Injection Molder]] !! Machine now owned and moved to DTU Construct !!
**[[/Hot Embosser|Hot Embosser]]
**[[/Hot Embosser|Hot Embosser]]
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*Pick & place
*Pick & place
**[[/Micro Transfer Printer|Micro Transfer Printer]]
**[[/Micro transfer printer|Micro transfer printer]]


== Choose processing method ==
== Choose processing method ==

Latest revision as of 15:03, 6 March 2025

The contents on this page, including all images and pictures, was created by DTU Nanolab staff unless otherwise stated.

Feedback to this page: click here


Back-end processing

Back-end (or Post-fab) Processing are typical processes used to finish up your wafer/chip. This includes thinning and cutting out the wafer in chips that can be put on a carrier, a board or in a package, attaching the chip to the carrier and connecting it with wires to get electrical access to it.

These processes are usually carried out a number of different places. We also have a laboratory called PackLab located in building 347 1st floor. It is a class 1000 cleanroom and in here we have equipment commonly used for back-end processing. Some equipment is further placed in the basement of building 346 and some on the 1st floor in building 346.

Note! Packlab is currently under re-construction and planned to re-open in Q2 2025.
Some of the tools will find new temporary locations in building 346 or building 451. Please ask our staff for more information.


Below you can see a list of equipment for back-end processing that is available at DTU Nanolab.

Choose an equipment

Choose processing method

Lapping/polishing Cutting/cleaving Milling Die bonding Wire bonding
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