Latest revision as of 15:03, 6 March 2025

The contents on this page, including all images and pictures, was created by DTU Nanolab staff unless otherwise stated.

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Back-end processing

Back-end (or Post-fab) Processing are typical processes used to finish up your wafer/chip. This includes thinning and cutting out the wafer in chips that can be put on a carrier, a board or in a package, attaching the chip to the carrier and connecting it with wires to get electrical access to it.

These processes are usually carried out a number of different places. We also have a laboratory called PackLab located in building 347 1st floor. It is a class 1000 cleanroom and in here we have equipment commonly used for back-end processing. Some equipment is further placed in the basement of building 346 and some on the 1st floor in building 346.

Note! Packlab is currently under re-construction and planned to re-open in Q2 2025.
Some of the tools will find new temporary locations in building 346 or building 451. Please ask our staff for more information.

Below you can see a list of equipment for back-end processing that is available at DTU Nanolab.

Choose an equipment

Stylus profilometer measurements
- Stylus Profiler:Dektak150
Chip/die mounting
- Die Bonder (eutectic metal) Will be temporary taken out of service during the PolyFabLab construction.
Wire bonding
- TPT Wire Bonder Will be temporary taken out of service during the PolyFabLab construction.
- Ball Wire Bonder
Wafer dicing/machining
- Polisher CMP - located in the cleanroom
- Polisher/Lapper machine !! Machine decommissioned end of 2024 !!
- LatticeAxe
- FlipScribe
- FlexScribe
- Wafer Scriber
- Dicing Saw Disco DAD 321 (old saw)
- Dicing Saw Disco DAD 3241 (new saw 2021)
- Wafer cleaner DCS 1441 (post dicing)
- Laser Micromachining Tool
Molding
- Polymer Injection Molder !! Machine now owned and moved to DTU Construct !!
- Hot Embosser
Pick & place
- Micro transfer printer

Choose processing method

Lapping/polishing	Cutting/cleaving	Milling	Die bonding	Wire bonding
Polisher/Lapper machine	Wafer Scriber LatticeAxe FlipScribe FlexScribe Dicing Saw Disco DAD 321 (old saw) Dicing Saw Disco DAD 3241 (new saw 2021) Laser Micromachining Tool	Laser Micromachining Tool	Die Bonder (eutectic metal)	TPT Wire Bonder Ball Wire Bonder

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+{{cc-nanolab}}
 <!-- Under construction [[Image:section under construction.jpg|70px]] -->
 '''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Back-end_processing click here]'''
-'''Unless anything else is stated, everything on this page, text and pictures are made by DTU Nanolab.'''
+=Back-end processing=
 Back-end (or Post-fab) Processing are typical processes used to finish up your wafer/chip. This includes thinning and cutting out the wafer in chips that can be put on a carrier, a board or in a package, attaching the chip to the carrier and connecting it with wires to get electrical access to it.
 These processes are usually carried out a number of different places. We also have a laboratory called PackLab located in building 347 1st floor. It is a class 1000 cleanroom and in here we have equipment commonly used for back-end processing. Some equipment is further placed in the basement of building 346 and some on the 1st floor in building 346.
+<BR>
-[[Image:section under construction.jpg|70px|left]]
+<BR>
 {| {{table} style="background:LightGray"}
-! '''Note! Packlab will be closed from February/March 2023 to Q2 2024 due to the construction of our new PolyFabLab.'''
+! '''Note! Packlab is currently under re-construction and planned to re-open in Q2 2025.'''
 |-
 | Some of the tools will find new temporary locations in building 346 or building 451. Please ask our staff for more information.
@@ Line 30: / Line 33: @@
 *Wafer dicing/machining
 **[[/Polisher CMP|Polisher CMP - located in the cleanroom]]
-**[[/Polishing machine|Polisher/Lapper machine]]
+**[[/Polishing machine|Polisher/Lapper machine]] !! Machine decommissioned end of 2024 !!
 **[[/LatticeAxe|LatticeAxe]]
 **[[/FlipScribe|FlipScribe]]
@@ Line 40: / Line 43: @@
 **[[/Laser Micromachining Tool|Laser Micromachining Tool]]
 *Molding
-**[[/Polymer Injection Molder|Polymer Injection Molder]]
+**[[/Polymer Injection Molder|Polymer Injection Molder]] !! Machine now owned and moved to DTU Construct !!
 **[[/Hot Embosser|Hot Embosser]]
 <!--
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 **[[/Focal Spot X-ray system|X-ray Focal Spot inspection system]]
   -->
+*Pick & place
+**[[/Micro transfer printer|Micro transfer printer]]
 == Choose processing method ==
 {| {{table}}
 | align="left" valign="top" style="background:LightGray"|''' Lapping/polishing'''
-| align="left" valign="top"  style="background:LightGray"|''' Cutting'''
+| align="left" valign="top"  style="background:LightGray"|''' Cutting/cleaving'''
 | align="left" valign="top" style="background:#DCDCDC;"|''' Milling'''
 | align="left" valign="top" style="background:LightGray"|''' Die bonding'''