Latest revision as of 15:03, 6 March 2025

The contents on this page, including all images and pictures, was created by DTU Nanolab staff unless otherwise stated.

Feedback to this page: click here

Back-end processing

Back-end (or Post-fab) Processing are typical processes used to finish up your wafer/chip. This includes thinning and cutting out the wafer in chips that can be put on a carrier, a board or in a package, attaching the chip to the carrier and connecting it with wires to get electrical access to it.

These processes are usually carried out a number of different places. We also have a laboratory called PackLab located in building 347 1st floor. It is a class 1000 cleanroom and in here we have equipment commonly used for back-end processing. Some equipment is further placed in the basement of building 346 and some on the 1st floor in building 346.

Note! Packlab is currently under re-construction and planned to re-open in Q2 2025.
Some of the tools will find new temporary locations in building 346 or building 451. Please ask our staff for more information.

Below you can see a list of equipment for back-end processing that is available at DTU Nanolab.

Choose an equipment

Stylus profilometer measurements
- Stylus Profiler:Dektak150
Chip/die mounting
- Die Bonder (eutectic metal) Will be temporary taken out of service during the PolyFabLab construction.
Wire bonding
- TPT Wire Bonder Will be temporary taken out of service during the PolyFabLab construction.
- Ball Wire Bonder
Wafer dicing/machining
- Polisher CMP - located in the cleanroom
- Polisher/Lapper machine !! Machine decommissioned end of 2024 !!
- LatticeAxe
- FlipScribe
- FlexScribe
- Wafer Scriber
- Dicing Saw Disco DAD 321 (old saw)
- Dicing Saw Disco DAD 3241 (new saw 2021)
- Wafer cleaner DCS 1441 (post dicing)
- Laser Micromachining Tool
Molding
- Polymer Injection Molder !! Machine now owned and moved to DTU Construct !!
- Hot Embosser
Pick & place
- Micro transfer printer

Choose processing method

Lapping/polishing	Cutting/cleaving	Milling	Die bonding	Wire bonding
Polisher/Lapper machine	Wafer Scriber LatticeAxe FlipScribe FlexScribe Dicing Saw Disco DAD 321 (old saw) Dicing Saw Disco DAD 3241 (new saw 2021) Laser Micromachining Tool	Laser Micromachining Tool	Die Bonder (eutectic metal)	TPT Wire Bonder Ball Wire Bonder

@@ Line 1: / Line 1: @@
-'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Back-end_processing click here]'''
+{{cc-nanolab}}
+<!-- Under construction [[Image:section under construction.jpg|70px]] -->
+'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Back-end_processing click here]'''
+=Back-end processing=
 Back-end (or Post-fab) Processing are typical processes used to finish up your wafer/chip. This includes thinning and cutting out the wafer in chips that can be put on a carrier, a board or in a package, attaching the chip to the carrier and connecting it with wires to get electrical access to it.
-These processes are usually carried out outside the clean room.
+These processes are usually carried out a number of different places. We also have a laboratory called PackLab located in building 347 1st floor. It is a class 1000 cleanroom and in here we have equipment commonly used for back-end processing. Some equipment is further placed in the basement of building 346 and some on the 1st floor in building 346.
+<BR>
+<BR>
+{| {{table} style="background:LightGray"}
+! '''Note! Packlab is currently under re-construction and planned to re-open in Q2 2025.'''
+|-
+| Some of the tools will find new temporary locations in building 346 or building 451. Please ask our staff for more information.
+|-
+|}
+<br clear="all">
+Below you can see a list of equipment for back-end processing that is available at DTU Nanolab.
 == Choose an equipment ==
+* Stylus profilometer measurements
+**[[Specific Process Knowledge/Characterization/Profiler#Stylus_Profiler:_Dektak150|Stylus Profiler:Dektak150]]
 * Chip/die mounting
-**[[/Die Bonder|Die Bonder (eutectic metal)]]
+**[[/Die Bonder|Die Bonder (eutectic metal)]] [[Image:section under construction.jpg|70px]] '''Will be temporary taken out of service during the PolyFabLab construction.'''
-**[[/Die Bonder#Flip-chip bonder (glue attachment)|Flip-chip Bonder (glue)]]
 *Wire bonding
-**[[/Wire Bonder|TPT Wire Bonder]]
+**[[/Wire Bonder|TPT Wire Bonder]]  [[Image:section under construction.jpg|70px]] '''Will be temporary taken out of service during the PolyFabLab construction.'''
 **[[/Wire Bonder#Ball Wire Bonder K&S 4524|Ball Wire Bonder]]
 *Wafer dicing/machining
-**[[/Polishing machine|Polisher/Lapper machine]]
+**[[/Polisher CMP|Polisher CMP - located in the cleanroom]]
+**[[/Polishing machine|Polisher/Lapper machine]] !! Machine decommissioned end of 2024 !!
+**[[/LatticeAxe|LatticeAxe]]
+**[[/FlipScribe|FlipScribe]]
+**[[/FlexScribe|FlexScribe]]
 **[[/Wafer Scriber|Wafer Scriber]]
-**[[/Disco Saw|Disco Saw]]
+**[[/Disco Saw|Dicing Saw Disco DAD 321 (old saw)]]
+**[[/Disco Saw|Dicing Saw Disco DAD 3241 (new saw 2021)]]
+**[[/Disco Saw|Wafer cleaner DCS 1441 (post dicing)]]
 **[[/Laser Micromachining Tool|Laser Micromachining Tool]]
-**[[/Sandblasting|Sandblasting (at DTU Nanotech).]]
 *Molding
-**[[/Polymer Injection Molder|Polymer Injection Molder]]
+**[[/Polymer Injection Molder|Polymer Injection Molder]] !! Machine now owned and moved to DTU Construct !!
+**[[/Hot Embosser|Hot Embosser]]
+<!--
 * X-ray inspection system
-**[[/Focal Spot X-ray system|Focal Spot X-ray system]]
+**[[/Focal Spot X-ray system|X-ray Focal Spot inspection system]]
+ -->
+*Pick & place
+**[[/Micro transfer printer|Micro transfer printer]]
 == Choose processing method ==
 {| {{table}}
 | align="left" valign="top" style="background:LightGray"|''' Lapping/polishing'''
-| align="left" valign="top"  style="background:LightGray"|''' Cutting'''
+| align="left" valign="top"  style="background:LightGray"|''' Cutting/cleaving'''
 | align="left" valign="top" style="background:#DCDCDC;"|''' Milling'''
 | align="left" valign="top" style="background:LightGray"|''' Die bonding'''
@@ Line 35: / Line 63: @@
 *[[/Polishing machine|Polisher/Lapper machine]]
 |style="background: LightGray"|
 *[[/Wafer Scriber|Wafer Scriber]]
-*[[/Disco Saw|Disco Saw]]
+*[[/LatticeAxe|LatticeAxe]]
+*[[/FlipScribe|FlipScribe]]
+*[[/FlexScribe|FlexScribe]]
+*[[/Disco Saw|Dicing Saw Disco DAD 321 (old saw)]]
+*[[/Disco Saw|Dicing Saw Disco DAD 3241 (new saw 2021)]]
 *[[/Laser Micromachining Tool|Laser Micromachining Tool]]
 |style="background: LightGray"|
 *[[/Laser Micromachining Tool|Laser Micromachining Tool]]
-*[http://portalen.dtu.dk/Institutter/DTU_Nanotech.aspx Nanotech milling lab]
+<!-- *[https://www.inside.dtu.dk/en/medarbejder/institutter/dtu-nanotech Nanotech milling lab] -->
 |style="background: LightGray"|
 *[[/Die Bonder|Die Bonder (eutectic metal)]]
-*[[/Die Bonder#Flip-chip bonder (glue attachment)|Flip-chip Bonder (glue)]]
+<!-- *[[/Die Bonder#Flip-chip bonder (glue attachment)|Flip-chip Bonder (glue)]] -->
 |style="background: LightGray"|
 *[[/Wire Bonder|TPT Wire Bonder]]
 *[[/Wire Bonder#Ball Wire Bonder K&S 4524|Ball Wire Bonder]]
-|-
-|}
-== Choose material to be processed ==
-{| {{table}}
-| align="left" valign="top"  style="background:LightGray"|''' Dielectrica'''
-| align="left" valign="top" style="background:#DCDCDC;"|''' Semiconductors'''
-| align="left" valign="top" style="background:LightGray"|''' Metals'''
-| align="left" valign="top" style="background:LightGray"|''' Polymers'''
-|-valign="top"
-|style="background: LightGray"|
-*[[/Borofloat back-end process|Borofloat glass (Pyrex)]]
-*[[/Quartz back-end process|Fused silica (quartz)]]
-|style="background: #DCDCDC"|
-*[[/Silicon back-end process|Silicon]]
-*[[/III-V lapping|III-V]]
-|style="background: LightGray"|
-*[[/Aluminium back-end process|Aluminium]]
-*[[/Nickel back-end process|Nickel]]
-*[[/Steel back-end process|Steel]]
-|style="background: LightGray"|
-*[[/PMMA back-end process|PMMA]]
-*[[/TOPAS back-end process|TOPAS]]
-*[[/Polystyrene back-end process|Polystyrene]]
-*[[/Polycarbonate back-end process|Polycarbonate]]
 |-
 |}