Specific Process Knowledge/Back-end processing: Difference between revisions

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'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Back-end_processing click here]'''
{{cc-nanolab}}


Back-end Processing are typical processes used to finish up your wafer/chip. This includes thinning and cutting out the wafer in chips that can be put on a carrier, a board or in a package, attaching the chip to the carrier and connecting it with wires to get electrical access to it.
<!-- Under construction [[Image:section under construction.jpg|70px]] -->
These processes are uasually carried out outside the clean room.
'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Back-end_processing click here]'''
 
 
=Back-end processing=
 
Back-end (or Post-fab) Processing are typical processes used to finish up your wafer/chip. This includes thinning and cutting out the wafer in chips that can be put on a carrier, a board or in a package, attaching the chip to the carrier and connecting it with wires to get electrical access to it.
 
These processes are usually carried out a number of different places. We also have a laboratory called PackLab located in building 347 1st floor. It is a class 1000 cleanroom and in here we have equipment commonly used for back-end processing. Some equipment is further placed in the basement of building 346 and some on the 1st floor in building 346.
<BR>
<BR>
{| {{table} style="background:LightGray"}
! '''Note! Packlab is currently under re-construction and planned to re-open in Q2 2025.'''
|-
| Some of the tools will find new temporary locations in building 346 or building 451. Please ask our staff for more information.
|-
|}
 
<br clear="all">
Below you can see a list of equipment for back-end processing that is available at DTU Nanolab.  


== Choose an equipment ==
== Choose an equipment ==


* Stylus profilometer measurements
**[[Specific Process Knowledge/Characterization/Profiler#Stylus_Profiler:_Dektak150|Stylus Profiler:Dektak150]]
* Chip/die mounting
* Chip/die mounting
**[[/Die Bonder|Die Bonder (eutectic metal)]]
**[[/Die Bonder|Die Bonder (eutectic metal)]] [[Image:section under construction.jpg|70px]] '''Will be temporary taken out of service during the PolyFabLab construction.'''
**[[/Die Bonder#Flip-chip bonder (glue attachment)|Flip-chip Bonder (glue)]]
*Wire bonding
*Wire bonding
**[[/Wire Bonder|TPT Wire Bonder]]
**[[/Wire Bonder|TPT Wire Bonder]] [[Image:section under construction.jpg|70px]] '''Will be temporary taken out of service during the PolyFabLab construction.'''
**[[/Wire Bonder#Ball Wire Bonder K&S 4524|Ball Wire Bonder]]
**[[/Wire Bonder#Ball Wire Bonder K&S 4524|Ball Wire Bonder]]
*Wafer dicing/machining
*Wafer dicing/machining
**[[/Polishing machine|Polisher/Lapper machine]]
**[[/Polisher CMP|Polisher CMP - located in the cleanroom]]
**[[/Polishing machine|Polisher/Lapper machine]] !! Machine decommissioned end of 2024 !!
**[[/LatticeAxe|LatticeAxe]]
**[[/FlipScribe|FlipScribe]]
**[[/FlexScribe|FlexScribe]]
**[[/Wafer Scriber|Wafer Scriber]]  
**[[/Wafer Scriber|Wafer Scriber]]  
**[[/Disco Saw|Disco Saw]]
**[[/Disco Saw|Dicing Saw Disco DAD 321 (old saw)]]
**[[/Disco Saw|Dicing Saw Disco DAD 3241 (new saw 2021)]]
**[[/Disco Saw|Wafer cleaner DCS 1441 (post dicing)]]
**[[/Laser Micromachining Tool|Laser Micromachining Tool]]
**[[/Laser Micromachining Tool|Laser Micromachining Tool]]
**[[/Sandblasting|Sandblasting (at DTU Nanotech).]]
*Molding
*Molding
**[[/Polymer Injection Molder|Polymer Injection Molder]]
**[[/Polymer Injection Molder|Polymer Injection Molder]] !! Machine now owned and moved to DTU Construct !!
**[[/Hot Embosser|Hot Embosser]]
<!--
* X-ray inspection system
**[[/Focal Spot X-ray system|X-ray Focal Spot inspection system]]
-->
*Pick & place
**[[/Micro transfer printer|Micro transfer printer]]
 
== Choose processing method ==
{| {{table}}
| align="left" valign="top" style="background:LightGray"|''' Lapping/polishing'''
| align="left" valign="top"  style="background:LightGray"|''' Cutting/cleaving'''
| align="left" valign="top" style="background:#DCDCDC;"|''' Milling'''
| align="left" valign="top" style="background:LightGray"|''' Die bonding'''
| align="left" valign="top" style="background:LightGray"|''' Wire bonding'''
|-valign="top"
|style="background: LightGray"|
*[[/Polishing machine|Polisher/Lapper machine]]
|style="background: LightGray"|
*[[/Wafer Scriber|Wafer Scriber]]
*[[/LatticeAxe|LatticeAxe]]
*[[/FlipScribe|FlipScribe]]
*[[/FlexScribe|FlexScribe]]
*[[/Disco Saw|Dicing Saw Disco DAD 321 (old saw)]]
*[[/Disco Saw|Dicing Saw Disco DAD 3241 (new saw 2021)]]
*[[/Laser Micromachining Tool|Laser Micromachining Tool]]
|style="background: LightGray"|
*[[/Laser Micromachining Tool|Laser Micromachining Tool]]
<!-- *[https://www.inside.dtu.dk/en/medarbejder/institutter/dtu-nanotech Nanotech milling lab] -->
|style="background: LightGray"|
*[[/Die Bonder|Die Bonder (eutectic metal)]]
<!-- *[[/Die Bonder#Flip-chip bonder (glue attachment)|Flip-chip Bonder (glue)]] -->
|style="background: LightGray"|
*[[/Wire Bonder|TPT Wire Bonder]]
*[[/Wire Bonder#Ball Wire Bonder K&S 4524|Ball Wire Bonder]]
|-
|}

Latest revision as of 15:03, 6 March 2025

The contents on this page, including all images and pictures, was created by DTU Nanolab staff unless otherwise stated.

Feedback to this page: click here


Back-end processing

Back-end (or Post-fab) Processing are typical processes used to finish up your wafer/chip. This includes thinning and cutting out the wafer in chips that can be put on a carrier, a board or in a package, attaching the chip to the carrier and connecting it with wires to get electrical access to it.

These processes are usually carried out a number of different places. We also have a laboratory called PackLab located in building 347 1st floor. It is a class 1000 cleanroom and in here we have equipment commonly used for back-end processing. Some equipment is further placed in the basement of building 346 and some on the 1st floor in building 346.

Note! Packlab is currently under re-construction and planned to re-open in Q2 2025.
Some of the tools will find new temporary locations in building 346 or building 451. Please ask our staff for more information.


Below you can see a list of equipment for back-end processing that is available at DTU Nanolab.

Choose an equipment

Choose processing method

Lapping/polishing Cutting/cleaving Milling Die bonding Wire bonding
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