Specific Process Knowledge/Characterization: Difference between revisions
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'''Feedback to this page''': '''[mailto:labadviser@ | '''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Characterization click here]''' <br> | ||
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==Overview of characteristics and where to measure it== | |||
{| {{table } } | |||
| width="10" align="center" style="writing-mode: vertical-lr; transform: rotate(180deg);background:#f0f0f0;"| | |||
| width="10" align="center" style="writing-mode: vertical-lr; transform: rotate(180deg);background:#f0f0f0;"|[[Specific_Process_Knowledge/Characterization/Optical_microscope| Optical Micro- scopes]] | |||
| width="10" align="center" style="writing-mode: vertical-lr; transform: rotate(180deg);background:#f0f0f0;"|[[Specific Process Knowledge/Characterization/SEM: Scanning Electron Microscopy|SEM (incl. EDX)]] | |||
| width="10" align="center" style="writing-mode: vertical-lr; transform: rotate(180deg);background:#f0f0f0;"|[[Specific Process Knowledge/Characterization/AFM: Atomic Force Microscopy|AFM]] | |||
| width="10" align="center" style="writing-mode: vertical-lr; transform: rotate(180deg);background:#f0f0f0;"|[[Specific Process Knowledge/Characterization/Profiler|Stylus profiler]] | |||
| width="10" align="center" style="writing-mode: vertical-lr; transform: rotate(180deg);background:#f0f0f0;"|[[Specific_Process_Knowledge/Characterization/Profiler#Optical_Profiler_(Sensofar_S_Neox)|Optical profiler]] | |||
| width="10" align="center" style="writing-mode: vertical-lr; transform: rotate(180deg);background:#f0f0f0;"|[[Specific_Process_Knowledge/Characterization/Optical_characterization#Filmtek_4000|Filmtek (reflec- tometer)]] | |||
| width="10" align="center" style="writing-mode: vertical-lr; transform: rotate(180deg);background:#f0f0f0;"|[[Specific_Process_Knowledge/Characterization/Optical_characterization#Ellipsometer|Ellip- someter]] | |||
| width="10" align="center" style="writing-mode: vertical-lr; transform: rotate(180deg);background:#f0f0f0;"|[[Specific_Process_Knowledge/Characterization/Thickness_Measurer|Thickness stylus]] | |||
| width="10" align="center" style="writing-mode: vertical-lr; transform: rotate(180deg);background:#f0f0f0;"|[[Specific_Process_Knowledge/Characterization/XPS|XPS]] | |||
| width="10" align="center" style="writing-mode: vertical-lr; transform: rotate(180deg);background:#f0f0f0;"|[[Specific_Process_Knowledge/Characterization/PL_mapper|PL mapper]] | |||
| width="10" align="center" style="writing-mode: vertical-lr; transform: rotate(180deg);background:#f0f0f0;"|[[Specific_Process_Knowledge/Characterization/4-Point_Probe|4-point probe]] | |||
| width="10" align="center" style="writing-mode: vertical-lr; transform: rotate(180deg);background:#f0f0f0;"|[[Specific_Process_Knowledge/Characterization/Probe_station|Probe station]] | |||
| width="10" align="center" style="writing-mode: vertical-lr; transform: rotate(180deg);background:#f0f0f0;"|[[Specific_Process_Knowledge/Characterization/XRD|XRD]] | |||
| width="10" align="center" style="writing-mode: vertical-lr; transform: rotate(180deg);background:#f0f0f0;"|[[Specific_Process_Knowledge/Characterization/Lifetime_scanner_MDPmap|Life time scanner]] | |||
| width="10" align="center" style="writing-mode: vertical-lr; transform: rotate(180deg);background:#f0f0f0;"|[[Specific_Process_Knowledge/Characterization/Drop_Shape_Analyzer|Drop shape analyser]] | |||
| width="10" align="center" style="writing-mode: vertical-lr; transform: rotate(180deg);background:#f0f0f0;"|[[Specific_Process_Knowledge/Characterization/Hardness_measurement|Hardness tester]] | |||
| width="10" align="center" style="writing-mode: vertical-lr; transform: rotate(180deg);background:#f0f0f0;"|[[Specific Process Knowledge/Characterization/Particle Scanner Takano|Particle scanner]] | |||
| width="10" align="center" style="writing-mode: vertical-lr; transform: rotate(180deg);background:#f0f0f0;"|IR-camera | |||
| width="10" align="center" style="writing-mode: vertical-lr; transform: rotate(180deg);background:#f0f0f0;"|[[Specific Process Knowledge/Characterization/III-V_ECV-profiler|III-V ECV-profiler]] | |||
| width="10" align="center" style="writing-mode: vertical-lr; transform: rotate(180deg);background:#f0f0f0;"|[[Specific Process Knowledge/Characterization/MicroSpectroPhotometer (Craic 20/30 PV)|Microspectrophotometer (Craic 20/30 PV)]] | |||
|- | |||
|-style="background:#DCDCDC;" align="center" | |||
|align="left"| Breakdown voltage | |||
||||||||||||||||||||||||||||||||||||||| | |||
|- | |||
|-style="background:#C0C0C0;" align="center" | |||
|align="left"| Carrier density/doping profile | |||
|||||||||||||||||||||||||||||||||||||x|| | |||
|- | |- | ||
|-style="background:# | |-style="background:#DCDCDC;" align="center" | ||
| | |align="left"| Charge carrier life time||||||||||||||||||||||||||||x|||||||||||| | ||
|- | |- | ||
|-style="background:# | |-style="background:#C0C0C0;" align="center" | ||
| | |align="left"| Contact angle hydrophobic/hydrophillic||||||||||||||||||||||||||||||x|||||||||| | ||
|- | |- | ||
|-style="background:# | |-style="background:#DCDCDC;" align="center" | ||
| | |align="left"| Crystallinity||||||||||||||||||||||||||x|||||||||||||| | ||
|- | |- | ||
|-style="background:# | |-style="background:#C0C0C0;" align="center" | ||
| | |align="left"| Deposition uniformity||||||||||x||x||x|||||||||||||||||||||||||| | ||
|- | |- | ||
|-style="background:# | |-style="background:#DCDCDC;" align="center" | ||
| | |align="left"|[[Specific_Process_Knowledge/Characterization/Sample_imaging|Dimensions(in plane)]]||x||x||(x)||(x)||x||||||||||||||||||||||||||||||x | ||
|- | |- | ||
|-style="background:# | |-style="background:#C0C0C0;" align="center" | ||
| Dimensions( | |align="left"|[[Specific_Process_Knowledge/Characterization/Topographic_measurement|Dimensions(height)/Topography]]||(x)||(x)||x||x||x|||||||||||||||||||||||||||||| | ||
|- | |- | ||
|-style="background:# | |-style="background:#DCDCDC;" align="center" | ||
| | |align="left"| Electrical conductivity||||||||||||||||||||||||x|||||||||||||||| | ||
|- | |- | ||
|-style="background:# | |-style="background:#C0C0C0;" align="center" | ||
| | |align="left"| [[Specific_Process_Knowledge/Characterization/Element_analysis|Element analysis]]||||x||||||||||||||x||x 4)||||||x 4)|||||||||||||| | ||
|- | |- | ||
|-style="background:# | |-style="background:#DCDCDC;" align="center" | ||
| [[Specific_Process_Knowledge/Characterization/ | |align="left"| [[Specific_Process_Knowledge/Characterization/Stress_measurement|Film stress]]||||||||x||||||||||||||||||x 7)|||||||||||||| | ||
|- | |- | ||
|-style="background:# | |-style="background:#C0C0C0;" align="center" | ||
| | |align="left"|[[Specific_Process_Knowledge/Characterization/Sample_imaging|Imaging]]||x||x||x||||x||||||||||||||||||||||||||||||x | ||
|- | |- | ||
|-style="background:# | |-style="background:#DCDCDC;" align="center" | ||
| | |align="left"| [[Specific_Process_Knowledge/Characterization/Hardness_measurement|Material Hardness]]||||||||||||||||||||||||||||||||x|||||||| | ||
|- | |- | ||
|-style="background:# | |-style="background:#C0C0C0;" align="center" | ||
| | |align="left"| Band gap||||||||||||||x||||x||x|||||||||||||||||||| | ||
|- | |- | ||
|-style="background:# | |-style="background:#DCDCDC;" align="center" | ||
| | |align="left"| Particles||x||x||x||||||||||||||||||||||||||||x||||||x | ||
|- | |- | ||
|-style="background:# | |-style="background:#C0C0C0;" align="center" | ||
| | |align="left"| Phase changes|||||||||||||||||||||||||||||||||||||||| | ||
|- | |- | ||
|-style="background:# | |-style="background:#DCDCDC;" align="center" | ||
| | |align="left"| Reflectivity||||||||||||x||x||||||x 6)||||||||||||||||||||x | ||
|- | |- | ||
|-style="background:# | |-style="background:#C0C0C0;" align="center" | ||
| | |align="left"| [[Specific_Process_Knowledge/Characterization/Measurement_of_film_thickness_and_optical_constants|Refractive index]]||||||||||||x||x|||||||||||||||||||||||||| | ||
|- | |- | ||
|-style="background:# | |-style="background:#DCDCDC;" align="center" | ||
| | |align="left"| Resistivity||||||||||||||||||||||x|||||||||||||||||| | ||
|- | |- | ||
|-style="background:# | |-style="background:#C0C0C0;" align="center" | ||
| | |align="left"| Step coverage||x 1)||x 1)|||||||||||||||||||||||||||||||||||| | ||
|- | |- | ||
|-style="background:# | |-style="background:#DCDCDC;" align="center" | ||
| | |align="left"| Surface roughness||||||x||x||x||||||||||||||||x|||||||||||||| | ||
|- | |- | ||
|-style="background:# | |-style="background:#C0C0C0;" align="center" | ||
| | |align="left"| Thermal conductivity|||||||||||||||||||||||||||||||||||||||| | ||
|- | |- | ||
|-style="background:# | |-style="background:#DCDCDC;" align="center" | ||
| | |align="left"| [[Specific_Process_Knowledge/Characterization/Measurement_of_film_thickness_and_optical_constants|Thin film thickness]]||x 1)||x 1)||x 2)||x 2)||x ||x||x||||||x 5)||x 3)||||x|||||||||||||| | ||
|- | |- | ||
|-style="background:# | |-style="background:#C0C0C0;" align="center" | ||
| | |align="left"| Voids in wafer bonding||x||||||||||||||||||x||||||||||||||||x|||| | ||
|- | |- | ||
|-style="background:# | |-style="background:#DCDCDC;" align="center" | ||
| | |align="left"| [[Specific_Process_Knowledge/Characterization/Thickness_Measurer|Wafer thickness]]||x 1)||x 1)||||||||||||x|||||||||||||||||||||||| | ||
|- | |- | ||
|-style="background:# | |-style="background:#C0C0C0;" align="center" | ||
| | |align="left"| Work function||||||||||||||||||x|||||||||||||||||||||| | ||
|- | |||
|} | |||
# Using the cross section method | # Using the cross section method | ||
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# Only single layer | # Only single layer | ||
# Good for characterization of VCSEL structures and DBR mirrors | # Good for characterization of VCSEL structures and DBR mirrors | ||
# Only for crystalline films | |||
== Choose characterization topic == | == Choose characterization topic == | ||
*[[Specific Process Knowledge/Characterization/III-V_ECV-profiler|Carrier density (doping) profiler]] | |||
*[[Specific_Process_Knowledge/Characterization/Drop_Shape_Analyzer|Contact angle measurement]] | |||
*[[/Element analysis|Element analysis]] | *[[/Element analysis|Element analysis]] | ||
*[[/Measurement of film thickness and optical constants| | *[[/Measurement of film thickness and optical constants|Film thickness and optical constants]] | ||
*[[/Hardness measurement|Hardness measurement]] | |||
*[[/PL mapper|Photoluminescence mapping]] | *[[/PL mapper|Photoluminescence mapping]] | ||
*[[/Four-Point_Probe|Four-Point Probe (Resistivity measurement)]] <!-- [[/Resistivity measurement|Resistivity measurement]] --> | |||
*[[/Sample imaging|Sample imaging]] | *[[/Sample imaging|Sample imaging]] | ||
*[[/Sample preparation|Sample preparation for inspection]] | *[[/Sample preparation|Sample preparation for inspection]] | ||
*[[Specific Process Knowledge/Characterization/SEM: Scanning Electron Microscopy|Scanning Electron Microscopy]] | |||
*[[/Stress measurement|Stress measurement]] | *[[/Stress measurement|Stress measurement]] | ||
*[[/Thickness Measurer|Wafer thickness measurement]] | *[[/Thickness Measurer|Wafer thickness measurement]] | ||
*[[/Topographic measurement|Topographic measurement]] | *[[/Topographic measurement|Topographic measurement]] | ||
*[[Specific Process Knowledge/Characterization/XRD|X-ray diffraction]] | |||
*[[Specific Process Knowledge/Characterization/ | |||
<!-- | <!-- | ||
*[[/Other electrical measurements|Other electrical measurements]] | *[[/Other electrical measurements|Other electrical measurements]] | ||
| Line 132: | Line 143: | ||
===AFM=== | ===AFM=== | ||
*[[/AFM: Atomic Force Microscopy|AFM - ''Atomic Force Microscopy'']] | *[[/AFM: Atomic Force Microscopy|AFM - ''Atomic Force Microscopy'']] | ||
===Electrical measurements=== | |||
*[[/4-Point Probe|4-Point Probe]] | |||
*[[/Probe station|Probe station]] | |||
*[[/III-V ECV-profiler|III-V ECV-profiler (Electrochemical Capacitance-Voltage carrier density profiler)]] | |||
===Element analysis=== | ===Element analysis=== | ||
*[[/SEM Supra 2|SEM with EDX]] | *[[/SEM Supra 2|SEM with EDX]] | ||
*[[/XPS | *[[/XPS|XPS tools ]] | ||
===Optical and stylus profilers=== | ===Optical and stylus profilers=== | ||
*[[/Profiler#Optical_Profiler_(Sensofar)|Optical Profiler (Sensofar)]] | *[[/Profiler#Optical_Profiler_(Sensofar)|Optical Profiler (Sensofar)]] | ||
*[[/Profiler#Dektak XTA_new stylus profiler|Dektak | *[[/Profiler#Dektak XTA_new stylus profiler|Dektak XTA stylus profiler]] | ||
*[[/Profiler# | *[[/Profiler#Stylus Profiler (Tencor P17)|P17 stylus profiler from KLA-Tencor]] | ||
*[[/Profiler#Dektak_III-V_Profiler| | *[[/Profiler#Dektak_III-V_Profiler|Dektak 3ST stylus profiler]] | ||
*[[/Profiler#Stylus_Profiler:_Dektak150|Stylus Profiler:Dektak150]] | |||
===Optical microscopes=== | ===Optical microscopes=== | ||
*[[/Optical microscope|Optical microscopes]] | *[[/Optical microscope|Optical microscopes]] | ||
===Optical characterization=== | ===Optical characterization=== | ||
*[[/Optical characterization#Ellipsometer|Ellipsometer]] | *[[/Optical characterization#Ellipsometer|Ellipsometer]] | ||
*[[/Optical characterization#Filmtek_4000|Filmtek 4000]] | *[[/Optical characterization#Filmtek_4000|Filmtek 4000]] | ||
*[[/PL mapper|PL mapper - ''Photoluminescence mapper'']] | *[[/PL mapper|PL mapper - ''Photoluminescence mapper'']] | ||
*[[/Lifetime scanner MDPmap|Lifetime scanner MDPmap]] | *[[/Lifetime scanner MDPmap|Lifetime scanner MDPmap]] | ||
===SEMs at | ===SEMs at DTU Nanolab - building 307/314=== | ||
*[[LabAdviser/CEN/Quanta 3D FIB/SEM|FIB-SEM FEI QUANTA 200 3D]] | <!-- *[[LabAdviser/CEN/Quanta 3D FIB/SEM|FIB-SEM FEI QUANTA 200 3D]] --> | ||
*[[LabAdviser/CEN/Helios Nanolab 600|Dual Beam FEI Helios Nanolab 600]] | *[[LabAdviser/CEN/Helios Nanolab 600|Dual Beam FEI Helios Nanolab 600]] | ||
*[[LabAdviser/CEN/Nova NanoSEM 600|SEM FEI Nova 600 NanoSEM]] | *[[LabAdviser/CEN/Nova NanoSEM 600|SEM FEI Nova 600 NanoSEM]] | ||
*[[LabAdviser/CEN/Quanta FEG 200 ESEM|SEM FEI Quanta 200 ESEM FEG]] | *[[LabAdviser/CEN/Quanta FEG 200 ESEM|SEM FEI Quanta 200 ESEM FEG]] | ||
*[[LabAdviser/CEN/Inspect S|SEM Inspect S]] | <!-- *[[LabAdviser/CEN/Inspect S|SEM Inspect S]] --> | ||
=== | ===SEM's in building 346=== | ||
*[[/SEM: Scanning Electron Microscopy |SEM Comparison page]] | *[[/SEM: Scanning Electron Microscopy |SEM Comparison page]] | ||
*[[/SEM Supra 1|SEM Supra 1]] | *[[/SEM Supra 1|SEM Supra 1]] | ||
*[[/SEM Supra 2|SEM Supra 2]] | *[[/SEM Supra 2|SEM Supra 2]] | ||
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*[[/SEM Tabletop 1|SEM Tabletop 1]] | *[[/SEM Tabletop 1|SEM Tabletop 1]] | ||
===TEMs at | ===TEMs at DTU Nanolab - building 307/314=== | ||
*[[LabAdviser/CEN/Titan ATEM |Titan ATEM]] | *[[LabAdviser/CEN/Titan ATEM |Titan ATEM]] | ||
*[[LabAdviser/CEN/Titan ETEM |Titan ETEM]] | *[[LabAdviser/CEN/Titan ETEM |Titan ETEM]] | ||
*[[LabAdviser/CEN/Tecnai TEM |Tecnai TEM]] | *[[LabAdviser/CEN/Tecnai TEM |Tecnai TEM]] | ||
=== | ===XRD=== | ||
*[[/ | *[[/XRD|General page on XRD]], page describing general info relevant to both our XRD's | ||
*[[/ | *[[/XRD/XRD Powder|XRD Powder]], tabletop XRD for Bregg-Brentano measurements of powders | ||
*[[/ | *[[/XRD/XRD SmartLab|XRD SmartLab]], advanced multipurpose instrument in the cleanroom | ||
*[[/XRD/XRD SmartLab 9kW Rotating Anode|XRD SmartLab 9kW Rotating Anode]] multipurpose system outside the cleanroom | |||
===Various=== | ===Various=== | ||
*[[/Drop Shape Analyzer|Drop Shape Analyzer]] | *[[/Drop Shape Analyzer|Drop Shape Analyzer]] | ||
*[[/Thickness Measurer|Thickness Measurer]] | *[[/Thickness Measurer|Thickness Measurer]] | ||
*[[/Hardness measurement|Hardness tester]] | *[[/Hardness measurement|Hardness tester]] | ||
*[[/Particle Scanner Takano|Particle Scanner Takano]] | |||
==Decommissioned equipment== | |||
*[[/KLA-Tencor Surfscan 6420|KLA-Tencor Surfscan 6420]] | *[[/KLA-Tencor Surfscan 6420|KLA-Tencor Surfscan 6420]] | ||
*[[/X-Ray Diffractometer|X-Ray Diffractometer | *[[/X-Ray Diffractometer|Phillips X-Ray Diffractometer that was owned by DTU Fotonik]] | ||
Latest revision as of 10:52, 9 October 2024
Feedback to this page: click here
Unless otherwise stated, this page is written by DTU Nanolab internal
Overview of characteristics and where to measure it
| Optical Micro- scopes | SEM (incl. EDX) | AFM | Stylus profiler | Optical profiler | Filmtek (reflec- tometer) | Ellip- someter | Thickness stylus | XPS | PL mapper | 4-point probe | Probe station | XRD | Life time scanner | Drop shape analyser | Hardness tester | Particle scanner | IR-camera | III-V ECV-profiler | Microspectrophotometer (Craic 20/30 PV) | |
| Breakdown voltage | ||||||||||||||||||||
| Carrier density/doping profile | x | |||||||||||||||||||
| Charge carrier life time | x | |||||||||||||||||||
| Contact angle hydrophobic/hydrophillic | x | |||||||||||||||||||
| Crystallinity | x | |||||||||||||||||||
| Deposition uniformity | x | x | x | |||||||||||||||||
| Dimensions(in plane) | x | x | (x) | (x) | x | x | ||||||||||||||
| Dimensions(height)/Topography | (x) | (x) | x | x | x | |||||||||||||||
| Electrical conductivity | x | |||||||||||||||||||
| Element analysis | x | x | x 4) | x 4) | ||||||||||||||||
| Film stress | x | x 7) | ||||||||||||||||||
| Imaging | x | x | x | x | x | |||||||||||||||
| Material Hardness | x | |||||||||||||||||||
| Band gap | x | x | x | |||||||||||||||||
| Particles | x | x | x | x | x | |||||||||||||||
| Phase changes | ||||||||||||||||||||
| Reflectivity | x | x | x 6) | x | ||||||||||||||||
| Refractive index | x | x | ||||||||||||||||||
| Resistivity | x | |||||||||||||||||||
| Step coverage | x 1) | x 1) | ||||||||||||||||||
| Surface roughness | x | x | x | x | ||||||||||||||||
| Thermal conductivity | ||||||||||||||||||||
| Thin film thickness | x 1) | x 1) | x 2) | x 2) | x | x | x | x 5) | x 3) | x | ||||||||||
| Voids in wafer bonding | x | x | x | |||||||||||||||||
| Wafer thickness | x 1) | x 1) | x | |||||||||||||||||
| Work function | x |
- Using the cross section method
- Using the create step method
- With known resistivity
- Composition information for crystalline materials
- Only single layer
- Good for characterization of VCSEL structures and DBR mirrors
- Only for crystalline films
Choose characterization topic
- Carrier density (doping) profiler
- Contact angle measurement
- Element analysis
- Film thickness and optical constants
- Hardness measurement
- Photoluminescence mapping
- Four-Point Probe (Resistivity measurement)
- Sample imaging
- Sample preparation for inspection
- Scanning Electron Microscopy
- Stress measurement
- Wafer thickness measurement
- Topographic measurement
- X-ray diffraction
Choose equipment
AFM
Electrical measurements
- 4-Point Probe
- Probe station
- III-V ECV-profiler (Electrochemical Capacitance-Voltage carrier density profiler)
Element analysis
Optical and stylus profilers
- Optical Profiler (Sensofar)
- Dektak XTA stylus profiler
- P17 stylus profiler from KLA-Tencor
- Dektak 3ST stylus profiler
- Stylus Profiler:Dektak150
Optical microscopes
Optical characterization
SEMs at DTU Nanolab - building 307/314
SEM's in building 346
TEMs at DTU Nanolab - building 307/314
XRD
- General page on XRD, page describing general info relevant to both our XRD's
- XRD Powder, tabletop XRD for Bregg-Brentano measurements of powders
- XRD SmartLab, advanced multipurpose instrument in the cleanroom
- XRD SmartLab 9kW Rotating Anode multipurpose system outside the cleanroom