Specific Process Knowledge/Characterization: Difference between revisions

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'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Characterization click here]'''  
'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Characterization click here]''' <br>
{{CC1}}
==Overview of characteristics and where to measure it==


==Overview of characteristics and where to measure it==
{| {{table } }
{| {{table}}
|  width="10" align="center" style="writing-mode: vertical-lr; transform: rotate(180deg);background:#f0f0f0;"|  
|  width="50" align="center" style="background:#f0f0f0;"|  
|  width="10" align="center" style="writing-mode: vertical-lr; transform: rotate(180deg);background:#f0f0f0;"|[[Specific_Process_Knowledge/Characterization/Optical_microscope| Optical Micro- scopes]]
|  width="50" align="center" style="background:#f0f0f0;"|'''Micro- scopes'''
|  width="10" align="center" style="writing-mode: vertical-lr; transform: rotate(180deg);background:#f0f0f0;"|[[Specific Process Knowledge/Characterization/SEM: Scanning Electron Microscopy|SEM (incl. EDX)]]
|  width="50" align="center" style="background:#f0f0f0;"|'''SEM (incl. EDX)'''
|  width="10" align="center" style="writing-mode: vertical-lr; transform: rotate(180deg);background:#f0f0f0;"|[[Specific Process Knowledge/Characterization/AFM: Atomic Force Microscopy|AFM]]
|  width="50" align="center" style="background:#f0f0f0;"|'''AFM'''
|  width="10" align="center" style="writing-mode: vertical-lr; transform: rotate(180deg);background:#f0f0f0;"|[[Specific Process Knowledge/Characterization/Profiler|Stylus profiler]]
|  width="50" align="center" style="background:#f0f0f0;"|'''Stylus profiler'''
|  width="10" align="center" style="writing-mode: vertical-lr; transform: rotate(180deg);background:#f0f0f0;"|[[Specific_Process_Knowledge/Characterization/Profiler#Optical_Profiler_(Sensofar_S_Neox)|Optical profiler]]
|  width="50" align="center" style="background:#f0f0f0;"|'''Optical profiler'''
|  width="10" align="center" style="writing-mode: vertical-lr; transform: rotate(180deg);background:#f0f0f0;"|[[Specific_Process_Knowledge/Characterization/Optical_characterization#Filmtek_4000|Filmtek (reflec- tometer)]]
|  width="50" align="center" style="background:#f0f0f0;"|'''Filmtek (reflec- tometer)'''
|  width="10" align="center" style="writing-mode: vertical-lr; transform: rotate(180deg);background:#f0f0f0;"|[[Specific_Process_Knowledge/Characterization/Optical_characterization#Ellipsometer|Ellip- someter]]
|  width="50" align="center" style="background:#f0f0f0;"|'''Ellip- someter'''
|  width="10" align="center" style="writing-mode: vertical-lr; transform: rotate(180deg);background:#f0f0f0;"|[[Specific_Process_Knowledge/Characterization/Thickness_Measurer|Thickness stylus]]
|  width="50" align="center" style="background:#f0f0f0;"|'''Thickness stylus'''
|  width="10" align="center" style="writing-mode: vertical-lr; transform: rotate(180deg);background:#f0f0f0;"|[[Specific_Process_Knowledge/Characterization/XPS|XPS]]
|  width="50" align="center" style="background:#f0f0f0;"|'''XPS'''
|  width="10" align="center" style="writing-mode: vertical-lr; transform: rotate(180deg);background:#f0f0f0;"|[[Specific_Process_Knowledge/Characterization/PL_mapper|PL mapper]]
|  width="50" align="center" style="background:#f0f0f0;"|'''PL mapper'''
|  width="10" align="center" style="writing-mode: vertical-lr; transform: rotate(180deg);background:#f0f0f0;"|[[Specific_Process_Knowledge/Characterization/4-Point_Probe|4-point probe]]
|  width="50" align="center" style="background:#f0f0f0;"|'''4-point probe'''
|  width="10" align="center" style="writing-mode: vertical-lr; transform: rotate(180deg);background:#f0f0f0;"|[[Specific_Process_Knowledge/Characterization/Probe_station|Probe station]]
|  width="50" align="center" style="background:#f0f0f0;"|'''Probe station'''
|  width="10" align="center" style="writing-mode: vertical-lr; transform: rotate(180deg);background:#f0f0f0;"|[[Specific_Process_Knowledge/Characterization/XRD|XRD]]
|  width="50" align="center" style="background:#f0f0f0;"|'''XRD'''
|  width="10" align="center" style="writing-mode: vertical-lr; transform: rotate(180deg);background:#f0f0f0;"|[[Specific_Process_Knowledge/Characterization/Lifetime_scanner_MDPmap|Life time scanner]]
|  width="50" align="center" style="background:#f0f0f0;"|'''Life time scanner'''
|  width="10" align="center" style="writing-mode: vertical-lr; transform: rotate(180deg);background:#f0f0f0;"|[[Specific_Process_Knowledge/Characterization/Drop_Shape_Analyzer|Drop shape analyser]]
|  width="50" align="center" style="background:#f0f0f0;"|'''Drop shape analyser'''
|  width="10" align="center" style="writing-mode: vertical-lr; transform: rotate(180deg);background:#f0f0f0;"|[[Specific_Process_Knowledge/Characterization/Hardness_measurement|Hardness tester]]
|  width="50" align="center" style="background:#f0f0f0;"|'''Hardness tester'''
|  width="10" align="center" style="writing-mode: vertical-lr; transform: rotate(180deg);background:#f0f0f0;"|[[Specific Process Knowledge/Characterization/Particle Scanner Takano|Particle scanner]]
|  width="10" align="center" style="writing-mode: vertical-lr; transform: rotate(180deg);background:#f0f0f0;"|IR-camera
|  width="10" align="center" style="writing-mode: vertical-lr; transform: rotate(180deg);background:#f0f0f0;"|[[Specific Process Knowledge/Characterization/III-V_ECV-profiler|III-V ECV-profiler]]
|  width="10" align="center" style="writing-mode: vertical-lr; transform: rotate(180deg);background:#f0f0f0;"|[[Specific Process Knowledge/Characterization/MicroSpectroPhotometer (Craic 20/30 PV)|Microspectrophotometer (Craic 20/30 PV)]]
|-
|-style="background:#DCDCDC;" align="center"
|align="left"| Breakdown voltage
|||||||||||||||||||||||||||||||||||||||
|-
|-style="background:#C0C0C0;" align="center"
|align="left"| Carrier density/doping profile
|||||||||||||||||||||||||||||||||||||x||
 
|-
|-style="background:#DCDCDC;" align="center"
|align="left"| Charge carrier life time||||||||||||||||||||||||||||x||||||||||||
|-
|-style="background:#C0C0C0;" align="center"
|align="left"| Contact angle hydrophobic/hydrophillic||||||||||||||||||||||||||||||x||||||||||
|-
|-style="background:#DCDCDC;" align="center"
|align="left"| Crystallinity||||||||||||||||||||||||||x||||||||||||||
|-
|-
|-style="background:#C0C0C0;"
|-style="background:#C0C0C0;" align="center"
| Thin film thickness||x 1)||x   1)||x   2)||x  2)||x  ||x||x||||||||x  3)||||x||||||
|align="left"| Deposition uniformity||||||||||x||x||x||||||||||||||||||||||||||
|-
|-
|-style="background:#DCDCDC;"
|-style="background:#DCDCDC;" align="center"
| Defects||x||||||||||||||||||x||||||||||||
|align="left"|[[Specific_Process_Knowledge/Characterization/Sample_imaging|Dimensions(in plane)]]||x||x||(x)||(x)||x||||||||||||||||||||||||||||||x
|-
|-
|-style="background:#C0C0C0;"
|-style="background:#C0C0C0;" align="center"
| Wafer thickness||x 1)||x   1)||||||||||||x||||||||||||||||
|align="left"|[[Specific_Process_Knowledge/Characterization/Topographic_measurement|Dimensions(height)/Topography]]||(x)||(x)||x||x||x||||||||||||||||||||||||||||||
|-
|-
|-style="background:#DCDCDC;"
|-style="background:#DCDCDC;" align="center"
| Step coverage||x  1)||x  1)||||||||||||||||||||||||||||
|align="left"| Electrical conductivity||||||||||||||||||||||||x||||||||||||||||
|-
|-
|-style="background:#C0C0C0;"
|-style="background:#C0C0C0;" align="center"
| Particles||x||x||x||||||||||||||||||||||||||
|align="left"| [[Specific_Process_Knowledge/Characterization/Element_analysis|Element analysis]]||||x||||||||||||||x||x  4)||||||x  4)||||||||||||||
|-
|-
|-style="background:#DCDCDC;"
|-style="background:#DCDCDC;" align="center"
| Element analysis||||x||||||||||||||x||x  4)||||||x  4)||||||
|align="left"| [[Specific_Process_Knowledge/Characterization/Stress_measurement|Film stress]]||||||||x||||||||||||||||||x  7)||||||||||||||
|-
|-
|-style="background:#C0C0C0;"
|-style="background:#C0C0C0;" align="center"
| Surface roughness||||||x||x||x||||||||||||||||||||||
|align="left"|[[Specific_Process_Knowledge/Characterization/Sample_imaging|Imaging]]||x||x||x||||x||||||||||||||||||||||||||||||x
|-
|-
|-style="background:#DCDCDC;"
|-style="background:#DCDCDC;" align="center"
| Deposition uniformity||||||||||x||x||x||||||||||||||||||
|align="left"| [[Specific_Process_Knowledge/Characterization/Hardness_measurement|Material Hardness]]||||||||||||||||||||||||||||||||x||||||||
|-
|-
|-style="background:#C0C0C0;"
|-style="background:#C0C0C0;" align="center"
| Film stress||||||||x||||||||||||||||||x||||||
|align="left"| Band gap||||||||||||||x||||x||x||||||||||||||||||||
|-
|-
|-style="background:#DCDCDC;"
|-style="background:#DCDCDC;" align="center"
| Refractive index||||||||||||x||x||||||||||||||||||
|align="left"| Particles||x||x||x||||||||||||||||||||||||||||x||||||x
|-
|-
|-style="background:#C0C0C0;"
|-style="background:#C0C0C0;" align="center"
| Reflectivity||||||||||||x||x||||||(x)||||||||||||
|align="left"| Phase changes||||||||||||||||||||||||||||||||||||||||
|-
|-
|-style="background:#DCDCDC;"
|-style="background:#DCDCDC;" align="center"
| Resistivity||||||||||||||||||||||x||||||||||
|align="left"| Reflectivity||||||||||||x||x||||||x 6)||||||||||||||||||||x
|-
|-
|-style="background:#C0C0C0;"
|-style="background:#C0C0C0;" align="center"
| Breakdown voltage||||||||||||||||||||||||||||||||
|align="left"| [[Specific_Process_Knowledge/Characterization/Measurement_of_film_thickness_and_optical_constants|Refractive index]]||||||||||||x||x||||||||||||||||||||||||||
|-
|-
|-style="background:#DCDCDC;"
|-style="background:#DCDCDC;" align="center"
| Electrical conductivity||||||||||||||||||||||||x||||||||
|align="left"| Resistivity||||||||||||||||||||||x||||||||||||||||||
|-
|-
|-style="background:#C0C0C0;"
|-style="background:#C0C0C0;" align="center"
| Thermal conductivity||||||||||||||||||||||||||||||||
|align="left"| Step coverage||x  1)||x  1)||||||||||||||||||||||||||||||||||||
|-
|-
|-style="background:#DCDCDC;"
|-style="background:#DCDCDC;" align="center"
| Optical gap||||||||||||||x||||||x||||||||||||
|align="left"| Surface roughness||||||x||x||x||||||||||||||||x||||||||||||||
|-
|-
|-style="background:#C0C0C0;"
|-style="background:#C0C0C0;" align="center"
| Crystalinity||||||||||||||||||||||||||x||||||
|align="left"| Thermal conductivity||||||||||||||||||||||||||||||||||||||||
|-
|-
|-style="background:#DCDCDC;"
|-style="background:#DCDCDC;" align="center"
| Charge carrier life time||||||||||||||||||||||||||||x||||
|align="left"| [[Specific_Process_Knowledge/Characterization/Measurement_of_film_thickness_and_optical_constants|Thin film thickness]]||x  1)||x  1)||x  2)||x  2)||x  ||x||x||||||x 5)||x  3)||||x||||||||||||||
|-
|-
|-style="background:#C0C0C0;"
|-style="background:#C0C0C0;" align="center"
| Contact angle hydrofob/hydrofil||||||||||||||||||||||||||||||x||
|align="left"| Voids in wafer bonding||x||||||||||||||||||x||||||||||||||||x||||
|-
|-
|-style="background:#DCDCDC;"
|-style="background:#DCDCDC;" align="center"
| Material Hardness||||||||||||||||||||||||||||||||x
|align="left"| [[Specific_Process_Knowledge/Characterization/Thickness_Measurer|Wafer thickness]]||x  1)||x  1)||||||||||||x||||||||||||||||||||||||
|-
|-
|  
|-style="background:#C0C0C0;" align="center"
|align="left"| Work function||||||||||||||||||x||||||||||||||||||||||
|-
|}
|}


# Using the cross section method
# Using the cross section method
# Using the create step method
# Using the create step method
# With known resistivity
# With known resistivity
# Composition information
# Composition information for crystalline materials
# Only single layer
# Good for characterization of VCSEL structures and DBR mirrors
# Only for crystalline films


== Choose characterization topic ==
== Choose characterization topic ==
*[[Specific Process Knowledge/Characterization/III-V_ECV-profiler|Carrier density (doping) profiler]]
*[[Specific_Process_Knowledge/Characterization/Drop_Shape_Analyzer|Contact angle measurement]]
*[[/Element analysis|Element analysis]]
*[[/Element analysis|Element analysis]]
*[[/Measurement of film thickness and optical constants|Measurement of film thickness and optical constants]]
*[[/Measurement of film thickness and optical constants|Film thickness and optical constants]]
*[[/Hardness measurement|Hardness measurement]]
*[[/PL mapper|Photoluminescence mapping]]
*[[/PL mapper|Photoluminescence mapping]]
*[[/Four-Point_Probe|Four-Point Probe (Resistivity measurement)]] <!-- [[/Resistivity measurement|Resistivity measurement]] -->
*[[/Sample imaging|Sample imaging]]
*[[/Sample imaging|Sample imaging]]
*[[/Sample preparation|Sample preparation for inspection]]
*[[/Sample preparation|Sample preparation for inspection]]
*[[Specific Process Knowledge/Characterization/SEM: Scanning Electron Microscopy|Scanning Electron Microscopy]]
*[[/Stress measurement|Stress measurement]]
*[[/Stress measurement|Stress measurement]]
*[[/Hardness measurement|Hardness measurement]]
*[[/Thickness Measurer|Wafer thickness measurement]]
*[[/Thickness Measurer|Wafer thickness measurement]]
*[[/Topographic measurement|Topographic measurement]]
*[[/Topographic measurement|Topographic measurement]]
*[[Specific Process Knowledge/Characterization/XRD|X-ray diffraction]]  
*[[Specific_Process_Knowledge/Characterization/Drop_Shape_Analyzer|Contact angle measurement]]
*[[/Four-Point_Probe|Four-Point Probe (Resistivity measurement)]] <!-- [[/Resistivity measurement|Resistivity measurement]] -->
*[[Specific Process Knowledge/Characterization/III-V_ECV-profiler|Carrier density (doping) profiler]]
*[[Specific Process Knowledge/Characterization/SEM: Scanning Electron Microscopy|Scanning Electron Microscopy]]  
<!--
<!--
*[[/Other electrical measurements|Other electrical measurements]]
*[[/Other electrical measurements|Other electrical measurements]]
Line 112: Line 143:
===AFM===
===AFM===
*[[/AFM: Atomic Force Microscopy|AFM - ''Atomic Force Microscopy'']]
*[[/AFM: Atomic Force Microscopy|AFM - ''Atomic Force Microscopy'']]
===Electrical measurements===
*[[/4-Point Probe|4-Point Probe]]
*[[/Probe station|Probe station]]
*[[/III-V ECV-profiler|III-V ECV-profiler (Electrochemical Capacitance-Voltage carrier density profiler)]]


===Element analysis===
===Element analysis===
*[[/SIMS: Secondary Ion Mass Spectrometry#Atomika_SIMS|Atomika SIMS]]
*[[/SEM Supra 2|SEM with EDX]]
*[[/XPS#XPS-ThermoScientific|XPS-ThermoScientific ]]
*[[/XPS|XPS tools ]]


===Optical and stylus profilers===
===Optical and stylus profilers===
*[[/Profiler#Optical_Profiler_(Sensofar)|Optical Profiler (Sensofar)]]
*[[/Profiler#Optical_Profiler_(Sensofar)|Optical Profiler (Sensofar)]]
*[[/Profiler#Dektak XTA_new stylus profiler|Dektak XTA_new]]
*[[/Profiler#Dektak XTA_new stylus profiler|Dektak XTA stylus profiler]]
*[[/Profiler#Dektak _8 stylus _profiler|Dektak 8 stylus profiler]]
*[[/Profiler#Stylus Profiler (Tencor P17)|P17 stylus profiler from KLA-Tencor]]
*[[/Profiler#Dektak_III-V_Profiler|III V Profiler]]
*[[/Profiler#Dektak_III-V_Profiler|Dektak 3ST stylus profiler]]
'''Optical microscopes'''
*[[/Profiler#Stylus_Profiler:_Dektak150|Stylus Profiler:Dektak150]]
*[[/Optical microscope|Optical microscope]]
 
'''Optical characterization'''
===Optical microscopes===
*[[/Optical microscope|Optical microscopes]]
 
===Optical characterization===
*[[/Optical characterization#Ellipsometer|Ellipsometer]]
*[[/Optical characterization#Ellipsometer|Ellipsometer]]
*[[/Optical characterization#Filmtek_4000|Filmtek 4000]]
*[[/Optical characterization#Filmtek_4000|Filmtek 4000]]
*[[/Optical characterization#Prism_Coupler|Prism Coupler]]
*[[/PL mapper|PL mapper - ''Photoluminescence mapper'']]
*[[/PL mapper|PL mapper - ''Photoluminescence mapper'']]
*[[/Lifetime scanner MDPmap|Lifetime scanner MDPmap]]
*[[/Lifetime scanner MDPmap|Lifetime scanner MDPmap]]


 
===SEMs at DTU Nanolab - building 307/314===
===SEM's at CEN===
<!-- *[[LabAdviser/CEN/Quanta 3D FIB/SEM|FIB-SEM FEI QUANTA 200 3D]] -->
*[[LabAdviser/CEN/Quanta 3D FIB/SEM|FIB-SEM FEI QUANTA 200 3D]]
*[[LabAdviser/CEN/Helios Nanolab 600|Dual Beam FEI Helios Nanolab 600]]
*[[LabAdviser/CEN/Helios Nanolab 600|Dual Beam FEI Helios Nanolab 600]]
*[[LabAdviser/CEN/Nova NanoSEM 600|SEM FEI Nova 600 NanoSEM]]
*[[LabAdviser/CEN/Nova NanoSEM 600|SEM FEI Nova 600 NanoSEM]]
*[[LabAdviser/CEN/Quanta FEG 200 ESEM|SEM FEI Quanta 200 ESEM FEG]]
*[[LabAdviser/CEN/Quanta FEG 200 ESEM|SEM FEI Quanta 200 ESEM FEG]]
*[[LabAdviser/CEN/Inspect S|SEM Inspect S]]
<!-- *[[LabAdviser/CEN/Inspect S|SEM Inspect S]] -->


===SEM's at Danchip===
===SEM's in building 346===
*[[/SEM: Scanning Electron Microscopy |SEM Comparison page]]
*[[/SEM: Scanning Electron Microscopy |SEM Comparison page]]
*[[/SEM LEO|SEM LEO]]
*[[/SEM Supra 1|SEM Supra 1]]
*[[/SEM Supra 1|SEM Supra 1]]
*[[/SEM Supra 2|SEM Supra 2]]
*[[/SEM Supra 2|SEM Supra 2]]
Line 147: Line 183:
*[[/SEM Tabletop 1|SEM Tabletop 1]]
*[[/SEM Tabletop 1|SEM Tabletop 1]]


===TEM's at CEN===
===TEMs at DTU Nanolab - building 307/314===
*[[LabAdviser/CEN/Titan ATEM |Titan ATEM]]
*[[LabAdviser/CEN/Titan ATEM |Titan ATEM]]
*[[LabAdviser/CEN/Titan ETEM |Titan ETEM]]
*[[LabAdviser/CEN/Titan ETEM |Titan ETEM]]
*[[LabAdviser/CEN/Tecnai TEM |Tecnai TEM]]
*[[LabAdviser/CEN/Tecnai TEM |Tecnai TEM]]
===XRD===
*[[/XRD|General page on XRD]], page describing general info relevant to both our XRD's
*[[/XRD/XRD Powder|XRD Powder]], tabletop XRD for Bregg-Brentano measurements of powders
*[[/XRD/XRD SmartLab|XRD SmartLab]], advanced multipurpose instrument in the cleanroom
*[[/XRD/XRD SmartLab 9kW Rotating Anode|XRD SmartLab 9kW Rotating Anode]] multipurpose system outside the cleanroom


===Various===
===Various===
*[[/Drop Shape Analyzer|Drop Shape Analyzer]]
*[[/Drop Shape Analyzer|Drop Shape Analyzer]]
*[[/4-Point Probe|4-Point Probe]]
*[[/Thickness Measurer|Thickness Measurer]]
*[[/Thickness Measurer|Thickness Measurer]]
*[[/Hardness measurement|Hardness tester]]
*[[/Particle Scanner Takano|Particle Scanner Takano]]


*[[/Probe station|Probe station]]
==Decommissioned equipment==
 
*[[/KLA-Tencor Surfscan 6420|KLA-Tencor Surfscan 6420]]
*[[/KLA-Tencor Surfscan 6420|KLA-Tencor Surfscan 6420]]
*[[/III-V ECV-profiler|III-V ECV-profiler (Electrochemical Capacitance-Voltage carrier density profiler)]]
*[[/X-Ray Diffractometer|Phillips X-Ray Diffractometer that was owned by DTU Fotonik]]
*[[/X-Ray Diffractometer|X-Ray Diffractometer ]]
*[[/XRD|XRD SmartLab]]

Latest revision as of 10:52, 9 October 2024

Feedback to this page: click here
Unless otherwise stated, this page is written by DTU Nanolab internal

Overview of characteristics and where to measure it

Optical Micro- scopes SEM (incl. EDX) AFM Stylus profiler Optical profiler Filmtek (reflec- tometer) Ellip- someter Thickness stylus XPS PL mapper 4-point probe Probe station XRD Life time scanner Drop shape analyser Hardness tester Particle scanner IR-camera III-V ECV-profiler Microspectrophotometer (Craic 20/30 PV)
Breakdown voltage
Carrier density/doping profile x
Charge carrier life time x
Contact angle hydrophobic/hydrophillic x
Crystallinity x
Deposition uniformity x x x
Dimensions(in plane) x x (x) (x) x x
Dimensions(height)/Topography (x) (x) x x x
Electrical conductivity x
Element analysis x x x 4) x 4)
Film stress x x 7)
Imaging x x x x x
Material Hardness x
Band gap x x x
Particles x x x x x
Phase changes
Reflectivity x x x 6) x
Refractive index x x
Resistivity x
Step coverage x 1) x 1)
Surface roughness x x x x
Thermal conductivity
Thin film thickness x 1) x 1) x 2) x 2) x x x x 5) x 3) x
Voids in wafer bonding x x x
Wafer thickness x 1) x 1) x
Work function x



  1. Using the cross section method
  2. Using the create step method
  3. With known resistivity
  4. Composition information for crystalline materials
  5. Only single layer
  6. Good for characterization of VCSEL structures and DBR mirrors
  7. Only for crystalline films

Choose characterization topic

Choose equipment

AFM

Electrical measurements

Element analysis

Optical and stylus profilers

Optical microscopes

Optical characterization

SEMs at DTU Nanolab - building 307/314

SEM's in building 346

TEMs at DTU Nanolab - building 307/314

XRD

Various

Decommissioned equipment

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