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<center><span style="background:PaleGreen">3rd Level - Material/Methode</span></center>
'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Thin_film_deposition click here]'''
'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Etch/RIE_(Reactive_Ion_Etch) click here]'''
 
<i> Unless otherwise stated, this page is written by <b>DTU Nanolab internal</b></i>




== Choose material to deposit ==
== Choose material to deposit ==


=== Dielectrica ===
{| {{table}}
*[[/Deposition of Silicon Nitride|Silicon Nitride]] - ''Silicon nitride and silicon oxynitride''
| align="left" valign="top"  style="background:LightGray"|''' Semiconductors'''
*[[/Deposition of Silicon Oxide|Silicon Oxide]]
| align="left" valign="top" style="background:#DCDCDC"|''' Oxides'''
*[[/Deposition of Titanium Oxide|Titanium Oxide]]
| align="left" valign="top" style="background:LightGray"|''' Nitrides'''
| align="left" valign="top" style="background:#DCDCDC"|''' Carbon and Carbides'''
| align="left" valign="top" style="background:LightGray"|''' Metals'''
| align="left" valign="top" style="background:#DCDCDC"|''' Alloys'''
| align="left" valign="top" style="background:LightGray"|''' Transparent conductive oxides'''
| align="left" valign="top" style="background:#DCDCDC"|''' Polymers'''
| align="left" valign="top" style="background:LightGray"|''' Multilayers'''
|-valign="top"


=== Metals/elements ===
|style="background: LightGray"|
{| border="2" cellspacing="1" cellpadding="8"
[[/Deposition of Silicon|Silicon]] <br/>
|-
[[/Deposition of Germanium|Germanium]] <br/>
|
Period/Group
|IVB
|VB
|VIB
|VIIIB
|IB
|IIIA
|IVA
|-
|3
|.
|.
|.
|.
|.
|[[/Deposition of Aluminium|13 Al Aluminium]]
|[[/Deposition of Silicon|14 Si Silicon]]
|-
|4
|[[/Deposition of Titanium|22 Ti Titanium]]
|.
|[[/Deposition of Chromium|24 Cr Chromium]]
|[[/Deposition of Nickel|28 Ni Nickel]]
|[[/Deposition of Copper|29 Cu Copper]]
|.
|[[/Deposition of Germanium|32 Ge Germanium]]
|-
|5
|.
|.
|[[/Deposition of Molybdenum|42 Mo Molybdenum]]
|[[/Deposition of Palladium|46 Pd Palladium]]
|[[/Deposition of Silver|47 Ag Silver]]
|.
|[[/Deposition of Tin|50 Sn Tin]]
|-
|6
|.
|[[/Deposition of Tantalum|73 Ta Tantalum]]
|[[/Deposition of Tungsten|74 W Tungsten]]
|[[/Deposition of Platinum|78 Pt Platinum]]
|[[/Deposition of Gold|79 Au Gold]]
|.
|.
|-
|}


===Alloys===
|style="background: #DCDCDC"|
*[[/Deposition of TiW|TiW]] alloy (10%/90% by weight)
[[/Deposition of Alumina|Aluminium Oxide (Al<sub>2</sub>O<sub>3</sub>)]]<br/>
*[[/Deposition of NiCr|NiCr]] alloy
[[/Sputter deposition of oxides and other compounds|Barium titanate (BaTiO<sub>3</sub>)]]<br/>
*[[/Deposition of AlTi|AlTi]] alloy
[[/Sputter deposition of oxides and other compounds|Chromium Oxide (Cr<sub>2</sub>O<sub>3</sub>)]]<br/>
[[/Deposition of Hafnium Oxide|Hafnium Oxide (HfO<sub>2</sub>)]]<br/>
[[/Sputter deposition of oxides and other compounds|Magnesium Oxide (MgO)]]<br/>
[[/Sputter deposition of oxides and other compounds|Nickel Oxide (NiO)]]<br/>
[[/Deposition of Silicon Oxide|Silicon Oxide (SiO<sub>2</sub>)]]<br/>
[[/Deposition of Titanium Oxide|Titanium Oxide (TiO<sub>2</sub>)]]<br/>
[[/Sputter deposition of oxides and other compounds|Tantalum Oxide (Ta<sub>2</sub>O<sub>5</sub>)]]<br/>
[[/Sputter deposition of oxides and other compounds|Vanadium Oxide (VO<sub>x</sub>)]]<br/>
[[/Deposition of ZnO|Zinc Oxide (ZnO)]]<br/>




=== Polymers ===
|style="background: LightGray"|
*[[Specific Process Knowledge/Photolithography/SU8|SU8]]
[[/Deposition of Silicon Nitride|Silicon Nitride]] - ''and oxynitride'' <br/>
*Antistiction coating
[[/Deposition of Titanium Nitride|Titanium Nitride]] - ''conductive ceramics'' <br/>
*Topas
[[/Deposition of Niobium Titanium Nitride| Niobium Titanium Nitride]] - ''superconductors''<br/>
*PMMA
[[/Deposition of Aluminium Nitride| Aluminum Nitride (Al<sub>x</sub>N<sub>y</sub>)]]<br/>
[[/Deposition of Scandium Nitride| Scandium Nitride (Sc<sub>x</sub>N<sub>y</sub>)]]<br/>


== Choose deposition equipment ==


*[[/Alcatel|Alcatel]] - ''E-beam evaporator and sputter tool''
|style="background: #DCDCDC"|
*[[/Lesker|Lesker]] - ''Sputter tool''
[[/Deposition of Carbon|Carbon]] <br/>
*[[/Multisource_PVD|PVD co-sputter/evaporation]] - ''E-beam evaporator and multiple wafer tool''
<!-- [[/Deposition of Titanium Carbide|Titanium Carbide (TiC)]]<br/> -->
*[[/Wordentec|Wordentec]] - ''E-beam evaporator, sputter and thermal evaporator''
[[/Deposition of Silicon Carbide|Silicon Carbide (SiC)]]<br/>
*[[Specific Process Knowledge/III-V Process/thin film dep/physimeca|Physimeca]] - ''E-beam evaporator (III-V lab)''
[[/Sputter deposition of metals and alloys|Tantalum carbide (TaC<sub>x</sub>)]]<br/>
*[[Specific Process Knowledge/Etch/IBE&frasl;IBSD Ionfab 300|IBE/IBSD Ionfab 300]] - ''Sputter deposition of high quality optical layers and milling/etching''
*[[/Hummer|Hummer]] - ''Gold sputtering system''
*[[/PECVD|PECVD]] - ''Plasma Enhanced Chemical Vapor deposition''
*[[/Furnace LPCVD Nitride|Furnace LPCVD Nitride (4" and 6")]] - ''Deposition of silicon nitride''
*[[/Furnace LPCVD PolySilicon|Furnace LPCVD Polysilicon (4" and 6")]] - ''Deposition of polysilicon''
*[[/Furnace LPCVD TEOS|Furnace LPCVD TEOS (4")]] - ''Deposition of silicon oxide''
*[[/MVD|MVD]] - ''Molecular Vapor Deposition''
*[[/Black Magic PECVD|Black Magic PECVD]] - ''Black Magic PECVD (Carbon)''
*[[/Electroplating-Ni|Electroplating-Ni]] - ''Electrochemical deposition of nickel''




|style="background: LightGray"|
[[/Deposition of Aluminium|Aluminium]] <br/>
[[/Deposition of Chromium|Chromium]]<br/>
[[/Deposition of Copper|Copper]]<br/>
[[/Deposition of Gold|Gold]]<br/>
[[/Sputter deposition of metals and alloys|Iron]]<br/>
[[/Deposition of Magnesium|Magnesium]]<br/>
[[/Deposition of Molybdenum|Molybdenum]]<br/>
[[/Deposition of Nickel|Nickel]]<br/>
[[/Deposition of Niobium|Niobium]]<br/>
[[/Deposition of Palladium|Palladium]]<br/>
[[/Deposition of Platinum|Platinum]]<br/>
[[/Deposition of Ruthenium|Ruthenium]]<br/>
[[/Deposition of Silver|Silver]]<br/>
[[/Deposition of Tantalum|Tantalum]]<br/>
[[/Deposition of Tin|Tin]]<br/>
[[/Deposition of Titanium|Titanium]]<br/>
[[/Deposition of Tungsten|Tungsten]]<br/>
[[/Deposition of Zinc|Zinc]]<br/>
[[/Deposition of Scandium|Scandium]]<br/>


= !!!=


{| style="color: black;" width="100%"
| colspan="2" |
|-


| style="width: 50%"|
|style="background: #DCDCDC"|
[[/Sputter deposition of metals and alloys|AlCu]]<br/>
[[/Sputter deposition of metals and alloys|CuTi]]<br/>
[[/Sputter deposition of metals and alloys|FeMn]]<br/>
[[/Sputter deposition of metals and alloys|MnIr]]<br/>
[[/Cluster-based_multi-chamber_high_vacuum_sputtering_deposition_system#Process information|NbTi]] <br/>
[[/Deposition of NiFe|NiFe]]<br/>
[[/Deposition of NiV|NiV]] alloy <br/>
[[/Deposition of TiW|TiW]] alloy (10%/90% by weight) <br/>


{| style="color: black;" width="100%"
And an electroceramic:
| colspan="2" |
|-
| style="width: 40%"|


==[[Specific Process Knowledge/Lithography/UVLithography|UV Lithography]]==
[[/Sputter deposition of oxides and other compounds|YSZ]] (Yttrium stabilized zirconia)<br/>
[[/Gadolinium Cerium Oxide|Gd<sub>0.2</sub>Ce<sub>0.8</sub>O<sub>2</sub> (GCO)]]


===[[Specific Process Knowledge/Lithography/Pretreatment|Pretreatment]]===
|style="background: LightGray"|
*[[Specific Process Knowledge/Lithography/Pretreatment#HMDS|HMDS]]
[[/Deposition of ITO|ITO (Tin doped Indium Oxide)]]<br/>
*[[Specific Process Knowledge/Lithography/Pretreatment#BHF|BHF]]
[[/Deposition of AZO |AZO (Aluminum doped Zinc Oxide)]]<br/>
*[[Specific Process Knowledge/Lithography/Pretreatment#250_C_oven_for_pretreatment|250C Oven for Pretreatment]]


===[[Specific Process Knowledge/Lithography/Coaters|Coaters]]===
|style="background: #DCDCDC"|
*[[Specific Process Knowledge/Lithography/Coaters#SSE Spinner|SSE Spinner]]
[[Specific Process Knowledge/Lithography/SU-8|SU-8]]<br/>
*[[Specific Process Knowledge/Lithography/Coaters#Spin Track 1 + 2|Spin Track 1 + 2]]
[[Specific Process Knowledge/Thin film deposition/MVD#Processing on the MVD| Antistiction coating]] <br/>
*[[Specific Process Knowledge/Lithography/Coaters#KS Spinner|KS Spinner]]
Topas <br/>
*[[Specific Process Knowledge/Lithography/Coaters#Manual Spinner (Polymers)|Manual Spinner (Polymers)]]
PMMA
*[[Specific Process Knowledge/Lithography/Coaters#Manual Spinner 1 (Laurell)|Manual Spinner 1 (Laurell)]]
*[[Specific Process Knowledge/Lithography/Coaters#III-V Spinner|III-V Spinner]]
*[[Specific_Process_Knowledge/Lithography/Coaters/SprayCoater|Spray Coater]]


===[[Specific Process Knowledge/Lithography/UVExposure|UV Exposure]]===
|style="background: LightGray"|
*[[Specific Process Knowledge/Lithography/UVExposure#KS Aligner|KS Aligner]]
[[/Deposition of CrSi|CrSi bilayer]] <br/>
*[[Specific Process Knowledge/Lithography/UVExposure#Aligner-6inch|Aligner-6inch]]
|-
*[[Specific Process Knowledge/Lithography/UVExposure#III-V Aligner|III-V Aligner]]
|}
*[[Specific Process Knowledge/Lithography/UVExposure#Inclined UV lamp|Inclined UV lamp]]
| style="width: 40%"|


===[[Specific Process Knowledge/Lithography/Baking|Baking]]===
Oh no! My material is not on the list! Please contact the [mailto:thinfilm@nanolab.dtu.dk Thin Film group] if you would like to inquire about a material that is not mentioned here.
*[[Specific Process Knowledge/Lithography/Baking#Hotplates|Hotplates]]
*[[Specific Process Knowledge/Lithography/Baking#Ovens|Ovens]]


===[[Specific Process Knowledge/Lithography/Development|Development]]===
== Choose deposition equipment ==
*[[Specific Process Knowledge/Lithography/Development#Automatic Developer Bench for 4" and 6"|Developer Bench]]


===[[Specific Process Knowledge/Lithography/Strip|Strip]]===
*[[Specific Process Knowledge/Lithography/Strip#Plasma Asher 1|Plasma Asher 1]]
*[[Specific Process Knowledge/Lithography/Strip#Plasma Asher 2|Plasma Asher 2]]
*[[Specific Process Knowledge/Lithography/Strip#III-V Plasma Asher|III-V Plasma Asher]]
*[[Specific Process Knowledge/Lithography/Strip#Rough Acetone Strip|Rough Acetone Strip]]
*[[Specific Process Knowledge/Lithography/Strip#Fine Acetone Strip|Fine Acetone Strip]]


===[[Specific Process Knowledge/Lithography/LiftOff|Lift-off]]===
{| {{table}}
*[[Specific Process Knowledge/Lithography/LiftOff#LiftOffWetBench|Lift-off Wet Bench]]
| align="left" valign="top"  style="background:LightGray"|''' PVD - Physical vapor deposition'''
*[[Specific Process Knowledge/Lithography/LiftOff#LiftOff(4",6")|Lift-off (4", 6")]]
| align="left" valign="top" style="background:#DCDCDC;"|''' LPCVD - low pressure chemical vapor deposition'''
| align="left" valign="top" style="background:LightGray"|''' PECVD - plasma enhanced chemical vapor deposition'''
| align="left" valign="top" style="background:#DCDCDC;"|''' ALD - atomic layer deposition'''
| align="left" valign="top" style="background:LightGray"|''' Coaters - for polymers'''
| align="left" valign="top" style="background:#DCDCDC;"|''' Others'''


===[[Specific Process Knowledge/Lithography/WaferCleaning|Wafer Cleaning]]===
*[[Specific Process Knowledge/Lithography/WaferCleaning#Spindryers|Spin dryers]]


|}
| style="width: 50%"|
==[[Specific Process Knowledge/Lithography/DUVStepperLithography|DUV Stepper Lithography]]==
*[[Specific Process Knowledge/Lithography/DUVStepper#SÜSS Spinner-Stepper|SÜSS Spinner-Stepper]]
*[[Specific Process Knowledge/Lithography/DUVStepper#Process information|Process information]]
*[[Specific Process Knowledge/Lithography/DUVStepper#DUV Stepper FPA-3000EX4 from Canon|DUV Stepper FPA-3000EX4 from Canon]]
*[[Specific Process Knowledge/Lithography/DUVStepper#Process information|Process information]]
*[[Specific Process Knowledge/Lithography/DUVStepper#Overview of performance|Overview of performance]]


==[[Specific Process Knowledge/Lithography/EBeamLithography|E-Beam Lithography]]==
|-valign="top"
*[[Specific Process Knowledge/Lithography/EBeamLithography#Performance of the e-beam writer|Performance]]
|style="background: LightGray"|
*[[Specific Process Knowledge/Lithography/EBeamLithography#Getting started|Getting started]]
*[[/Cluster-based multi-chamber high vacuum sputtering deposition system|Sputter-system Metal-Oxide (PC1) and Sputter-system Metal-Nitride (PC3) ]] - ''Cluster-based multi-chamber high vacuum sputtering deposition system''
*[[Specific Process Knowledge/Lithography/EBeamLithography#E-beam resists and Process Flows|E-beam resists and Process Flows]]
*[[/Lesker|Lesker]] - ''Sputter tool''
*[[Specific Process Knowledge/Lithography/EBeamLithography#Proximity Error Correction|Proximity Error Correction]]
*[[/Wordentec|Wordentec]] - ''E-beam evaporator, sputter and thermal evaporator''
*[[Specific Process Knowledge/Lithography/EBeamLithography#Charging of non-conductive substrates|Charging of non-conductive substrates]]
*[[/thermalevaporator|Thermal evaporator]]  
*[[/Temescal|E-Beam Evaporator (Temescal)]]
*[[/10-pocket e-beam evaporator|E-Beam Evaporator (10 pockets)]]
*[[/Sputter coater#Sputter_coater_03_(Cressington)|Sputter coater 03]] - ''Gold sputtering system''
*[[/Sputter coater#Sputter_coater_04_(Agar Scientific)|Sputter coater 04]] - ''Gold sputtering system''


==[[Specific Process Knowledge/Lithography/NanoImprintLithography|NanoImprint Lithography]]==
<!--*[[/Sputter coater#The_Hummer_Sputter_coater|Sputter coater Hummer]] -<span style="color:Red"> (Decommissioned</span>) ''Gold sputtering system''
*[[Specific Process Knowledge/Lithography/NanoImprintLithography#Molecular Vapour Deposition|Molecular Vapour Deposition]]
*[[/Sputter coater#The_Balzer_Sputter_coater|Balzer Sputter coater]] -<span style="color:Red"> (Decommissioned</span>) ''Gold sputtering system''
*[[Specific Process Knowledge/Lithography/NanoImprintLithography#ObducatNIL|Obducat NIL]]
*[[/III-V Dielectric evaporator|III-V Dielectric evaporator]] -<span style="color:Red"> (Decommissioned</span>) ''E-beam evaporation tool''
*[[Specific Process Knowledge/Lithography/NanoImprintLithography#EVG NIL|EVG NIL]]
*[[/Alcatel|Alcatel]] - <span style="color:Red"> (Decommissioned</span>) ''E-beam evaporator and sputter tool''
 
*[[/Physimeca|Physimeca]] - ''E-beam evaporator''
==[[Specific Process Knowledge/Lithography/3DLithography|3D Lithography]]==
*[[/Multisource_PVD|PVD co-sputter/evaporation]] - <span style="color:Red"> (Decommissioned</span>) ''E-beam evaporator and multiple wafer tool'' -->
*[[Specific Process Knowledge/Lithography/3DLithography#2-Photon Polymerization|2-Photon Polymerization]]


|style="background: #DCDCDC"|
*[[Specific Process Knowledge/Thin film deposition/Furnace LPCVD Nitride|Furnace LPCVD Nitride (4" and 6")]] - ''Deposition of silicon nitride''
*[[/Furnace LPCVD PolySilicon|Furnace LPCVD Polysilicon (4" and 6")]] ''Deposition of polysilicon''
*[[/Furnace LPCVD TEOS|Furnace LPCVD TEOS (4")]] - ''Deposition of silicon oxide''
|style="background: LightGray"|
*[[/PECVD|PECVD]] - ''Plasma Enhanced Chemical Vapor deposition''
<!--*[[/DiamondCVD|Seki Diamond CVD]] - ''Microwave Plasma CVD for diamond Growth''-->
|style="background: #DCDCDC"|
*[[/ALD Picosun R200|ALD1]] - Atomic Layer Deposition (thermal)
*[[/ALD2 (PEALD)|ALD2 (PEALD)]] - Atomic Layer Deposition (thermal and plasma enhanced)
|style="background: LightGray"|
See the [[Specific Process Knowledge/Lithography/Coaters |Lithography/Coaters]] page for coating polymers
|style="background: #DCDCDC"|
*[[/MVD|MVD]] - ''Molecular Vapor Deposition''
*Electroplating of Ni, Cu, Au, etc. - ''Ask in the department of Mechanical Engineering''
*MOCVD - Epitaxial growth of InP, GaAs and other III-V materials - ''Ask DTU Electro if you are interested: [mailto:esem@dtu.dk Elizaveta Semenova] or [mailto:kryv@dtu.dk Kresten Yvind]''
|-
|}
|}

Latest revision as of 09:43, 29 August 2024

Feedback to this page: click here

Unless otherwise stated, this page is written by DTU Nanolab internal


Choose material to deposit

Semiconductors Oxides Nitrides Carbon and Carbides Metals Alloys Transparent conductive oxides Polymers Multilayers

Silicon
Germanium

Aluminium Oxide (Al2O3)
Barium titanate (BaTiO3)
Chromium Oxide (Cr2O3)
Hafnium Oxide (HfO2)
Magnesium Oxide (MgO)
Nickel Oxide (NiO)
Silicon Oxide (SiO2)
Titanium Oxide (TiO2)
Tantalum Oxide (Ta2O5)
Vanadium Oxide (VOx)
Zinc Oxide (ZnO)

Silicon Nitride - and oxynitride
Titanium Nitride - conductive ceramics
Niobium Titanium Nitride - superconductors
Aluminum Nitride (AlxNy)
Scandium Nitride (ScxNy)

Carbon
Silicon Carbide (SiC)
Tantalum carbide (TaCx)

Aluminium
Chromium
Copper
Gold
Iron
Magnesium
Molybdenum
Nickel
Niobium
Palladium
Platinum
Ruthenium
Silver
Tantalum
Tin
Titanium
Tungsten
Zinc
Scandium

AlCu
CuTi
FeMn
MnIr
NbTi
NiFe
NiV alloy
TiW alloy (10%/90% by weight)

And an electroceramic:

YSZ (Yttrium stabilized zirconia)
Gd0.2Ce0.8O2 (GCO)

ITO (Tin doped Indium Oxide)
AZO (Aluminum doped Zinc Oxide)

SU-8
Antistiction coating
Topas
PMMA

CrSi bilayer

Oh no! My material is not on the list! Please contact the Thin Film group if you would like to inquire about a material that is not mentioned here.

Choose deposition equipment

PVD - Physical vapor deposition LPCVD - low pressure chemical vapor deposition PECVD - plasma enhanced chemical vapor deposition ALD - atomic layer deposition Coaters - for polymers Others



  • PECVD - Plasma Enhanced Chemical Vapor deposition
  • ALD1 - Atomic Layer Deposition (thermal)
  • ALD2 (PEALD) - Atomic Layer Deposition (thermal and plasma enhanced)

See the Lithography/Coaters page for coating polymers

  • MVD - Molecular Vapor Deposition
  • Electroplating of Ni, Cu, Au, etc. - Ask in the department of Mechanical Engineering
  • MOCVD - Epitaxial growth of InP, GaAs and other III-V materials - Ask DTU Electro if you are interested: Elizaveta Semenova or Kresten Yvind
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