Specific Process Knowledge/Characterization/Profiler: Difference between revisions

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[[Category: Characterization|Profiler]]
[[Category: Characterization|Profiler]]


''All contents by DTU Nanolab staff unless otherwise noted.''


==Overview of the Nanolab profilers==
==Overview of the Nanolab profilers==
All the profilers are compared on the [[Specific Process Knowledge/Characterization/Topographic measurement#Comparison_of_stylus_profilers.2C_optical_profilers_and_AFMs_at_Nanolab|topographic measurement]] page.
All the profilers are compared on the [[Specific Process Knowledge/Characterization/Topographic measurement#Comparison_of_stylus_profilers.2C_optical_profilers_and_AFMs_at_Nanolab|topographic measurement]] page.


The sections below describe each profiler (Dektak stylus profilers and optical profilers) in more detail.
The sections below describe each profiler (stylus profilers and optical profilers) in more detail.


==Dektak XTA stylus profiler==
==Dektak XTA stylus profiler==
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The Dektak XTA stylus profiler from Brüker is used for profiling surfaces of samples with structures in the micro- and nanometer range. The size of the structures that can be measured is limited by the tip dimensions.
The Dektak XTA stylus profiler from Brüker is used for profiling surfaces of samples with structures in the micro- and nanometer range. The size of the structures that can be measured is limited by the tip dimensions.


A profile measurement can be done across a specific structure by using a high magnification camera to locate the structure. It is also possible to program the stylus to measure in several positions, defined with respect to some deskew points. [[Specific_Process_Knowledge/Characterization/Stress_measurement|Stress measurements]] of thin films can be done by measuring the wafer bow.
A profile measurement can be done across a specific structure by using a high magnification camera to locate the structure. It is also possible to program the stylus to measure in several positions, defined with respect to some deskew points. [[Specific_Process_Knowledge/Characterization/Stress_measurement|Stress measurements]] of thin films can be done by measuring the wafer bow. However, for predefined measurement programs or stress measurements, we recommend the P17 profiler - see next section.




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[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=304 Dektak XTA in LabManager]
[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=304 Dektak XTA in LabManager]


Info about measurement accuracy can be found [[/Stylus profiler measurement uncertainty|here]].


===Equipment performance and process related parameters Dektak XTA===
===Equipment performance and process related parameters===


[[image:Dektak XTA new.JPG|275x275px|right|thumb|Dektak XTA: positioned in cleanroom F-2.]]
[[image:Dektak XTA new.JPG|275x275px|right|thumb|Dektak XTA. Now in cleanroom C-1, at time of photo it was somewhere else.]]


{| border="2" cellspacing="0" cellpadding="10"  
{| border="2" cellspacing="0" cellpadding="10"  
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|style="background:LightGrey; color:black"|Resolution x y
|style="background:LightGrey; color:black"|Resolution x y
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
Down to 0.003 µm
Down to 0.003 µm theoretically, in practice limited by the tip radius
|-
|-
|style="background:LightGrey; color:black"|Resolution z
|style="background:LightGrey; color:black"|Resolution z
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|style="background:LightGrey; color:black"|Height accuracy z (95 % confidence)
|style="background:LightGrey; color:black"|Height accuracy z (95 % confidence)
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
~ 300 Å for the 65 kÅ range, ~ 0.17 µm for the intermediate ranges, and ~0.6 µm for the 1 mm range for well-defined steps that are easy to measure reproducibly ([[#Height measurement accuracy for the DektakXT|see below]])  
~ 2 % for a 1 µm step with the smallest measurement range and ~ 1 % for a 25 µm step ''for well-defined steps that are easy to measure'' (read about reducing and estimating the measurement uncertainty [[/Stylus profiler measurement uncertainty|here]])  
|-
|-
|style="background:LightGrey; color:black"|Max scan depth as a function of trench width W
|style="background:LightGrey; color:black"|Max scan depth as a function of trench width W
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| style="background:LightGrey; color:black"|Substrate materials allowed
| style="background:LightGrey; color:black"|Substrate materials allowed
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*In principle all materials
*All materials that do not stick to the tip or leave residues on the chuck
*For very soft polymers we recommend the Dektak 150, see below
|-  
|-  
|}
|}


===Height measurement accuracy for the DektakXT===
==Stylus Profiler (Tencor P17) ==
The accuracy of a height measurement with the profiler depends on the measurement settings, the sample, the instrument calibration and the resolution.


====Influence of measurement settings and sample====
The P17 Stylus Profiler from KLA Tencor is used in a similar manner to the Dektak XTA for profiling surfaces with structures in the micro- and submicrometer range as well as for measuring [[Specific_Process_Knowledge/Characterization/Stress_measurement|stress]].  
Both the force setting and the scan speed are important: Too high force may compress a soft material like Al, Au or some polymers, while too low force may lead to the stylus "jumping" over features, especially if the scan speed is high.  


If the scan speed is too low and you are measuring a small step <500 nm, you may experience drift in the measurement. Of course you also must make sure the feature you are measuring is wide enough for the stylus tip to reach the bottom (see the [http://labmanager.dtu.dk/d4Show.php?id=2346&mach=304 DektakXT manual], Figure 3 for details).
Compared to the DektakXT, the P17 has more advanced options for stress measurements: It allows the user to measure a stress map with up to 5° radial resolution. Programming and analyzing a sequence of predefined scans in fixed locations on a wafer is also easier and the manual for doing it much better for the P17 than for the DektakXT. A disadvantage of the P17 is that is can be hard to locate structures as the maximum field of view of the camera is 1x1.5 mm. We recommend having a map of the sample design available so you can easily locate the features of interest. Otherwise the P17 is easy to use, fast, and accurate, just like the DektakXT.


If the step is not well defined, you may have significant scatter in the step heights determined.
'''The user manual, quality control procedure and results, technical information and contact information can be found in LabManager:'''


====Influence of calibration standard uncertainty====
[http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=486 P17 page in LabManager]
Nanolab staff check the instrument's measurement accuracy with a standard step height of 9160 Å for the 65 kÅ range and 24.865 µm for the larger ranges. The 95 % confidence intervals for the standards are 300 Å for the 9160 Å standard and 0.15 µm for the 24.865 µm standard. If the control measurement is beyond the limit set in our Quality Control procedure, the instrument is calibrated and the users informed (see LabManager for details on the [http://labmanager.dtu.dk/d4Show.php?id=2493&mach=304 control instruction] and the [https://labmanager.dtu.dk/view_binary.php?type=data&mach=304 control measurement data]).


The size of the calibration standard confidence intervals mean that the measurement uncertainty is much more significant for very shallow steps below 500-1000 nm than for steps in the micron range: The 95 % confidence interval in the 65 kÅ range is obviously at least ± 300 Å, so measuring a 100-200 nm step will have a huge error percentage-wise. Note that this error (from the calibration standard) is systematic. The random error associated with repeated measurements is usually smaller (perhaps ± 5 nm). It may therefore make sense to measure shallow steps to be able to compare different samples even if the absolute numbers are not very reliable.
===Process information ===


====Total uncertainty budget====
*Info about [[/Stylus profiler measurement uncertainty|measurement accuracy]].
We can numerically estimate the accuracy of a measurement based on the error of the calibration combined with the error from the limits of the resolution and of the scatter of repeated measurements. You can seean uncertainty budget for the Dektak measurements here (made by Rebecca Ettlinger in 2020): [[:File:uncertainty budget dektaks.xlsx]]. It is based on the procedure described [https://www.nde-ed.org/GeneralResources/Uncertainty/Combined.htm here].


The error stemming from the uncertainty on the calibration standard dominates for all ranges except the 1 mm range, where the resolution also plays a role. This leads to the 95 % confidence intervals listed above in the table: just over 30 nm for the smallest range, about 0.17 µm for the medium ranges, and about 0.6 µm for the 1 mm range. As noted above, be aware that if you have a step height that is difficult to measure, the scatter of repeated measurements could easily lead to larger confidence intervals.
*Using the analysis software: [[Specific_Process_Knowledge/Characterization/Profiler/Apex software|Apex software access & tips]]


==Dektak 8 stylus profiler==
*Info about making [https://labmanager.dtu.dk/view_binary.php?fileId=4699 2D stress measurements] ''(requires login)''. Most users will want to make 3D stress measurements, which is described in the regular Nanolab manual for the P17, also found on LabManager. It counts as "3D" if you wish to make 2 perpendicular scans. A "2D" stress scan means a single line scan per wafer - the software does not even allow manual rotation of the stage for this type of scan.


[[image:Dektak 8 new position.JPG|275x275px|right|thumb|Dektak 8: positioned in cleanroom  F-2.]]
'''Acceptance test'''
*The acceptance test carried out for the P17: [[:File:Acceptance test p17 final_no-names.pdf]]
*Vendor's own [https://labmanager.dtu.dk/view_binary.php?fileId=5545 conformity test results] after installation ''(requires login)''.


The Dektak 8 stylus profiler is a product of Veeco Instruments. It is used for profiling surfaces of samples with structures in the micro- and nanometer range. The size of the structures that can be measured is limited by the tip dimensions.
===Equipment performance and process related parameters===


It can measure specific structures found with the help of a high magnification video camera or it can be programmed to measure several points defined with respect to some deskew points. It can also be used for [[Specific_Process_Knowledge/Characterization/Stress_measurement|stress measurements]] of thin films by measuring the wafer bow.
[[image:KLA-Tencor P17 profiler.jpg|275x275px|right|thumb|Front of the P17 profiler located in cleanroom F-2.]]
 
<br clear="all" />
 
'''The user manual, quality control procedure and results, technical information and contact information can be found in LabManager:'''
 
<!-- give the link to the equipment info page in LabManager: -->
[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=123  Dektak 8 in LabManager]
 
The original user manual can be obtained from the staff.
 
===Equipment performance and process related parameters Dektak 8 stylus profiler===


{| border="2" cellspacing="0" cellpadding="10"  
{| border="2" cellspacing="0" cellpadding="10"  
|-
|-
!style="background:silver; color:black;" align="left"|Purpose  
!style="background:silver; color:black;" align="left"|Purpose  
|style="background:LightGrey; color:black"|Profiler for measuring micro structures.||style="background:WhiteSmoke; color:black"|
|style="background:LightGrey; color:black"|Profiler for measuring microstructures||style="background:WhiteSmoke; color:black"|
*Single line profiles
*Single line profiles
*Wafer mapping
*Wafer mapping
*[[Specific_Process_Knowledge/Characterization/Stress_measurement|Stress measurements]] by measuring wafer bow
*[[Specific_Process_Knowledge/Characterization/Stress_measurement|Stress measurements]] by measuring the wafer bow
*Surface roughness on a line scan
*Surface roughness on a line scan
|-
|-
!style="background:silver; color:black" align="left" rowspan="6" valign="top" |Performance
!style="background:silver; color:black" align="left" rowspan="6" valign="top" |Performance
|style="background:LightGrey; color:black"|Scan range x y||style="background:WhiteSmoke; color:black"|
|style="background:LightGrey; color:black"|Scan range X Y
Line scan x: 50 µm to 100 mm
|style="background:WhiteSmoke; color:black"|
Line scan X: 20 µm to 200 mm in a single scan. No stitching.
 
Map scan XY: In principle any rectangle that can be inscribed in a 200 mm circle, but resolution is limited to max. 4 million points and scanning is slow. In practice to get good resolution scan a very small area (e.g., 100 x 500 µm)
|-
|-
|style="background:LightGrey; color:black"|Scan range z
|style="background:LightGrey; color:black"|Scan range Z
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
50 Å to 1 mm
50 nm to 900 µm. It is possible to measure smaller steps but not recommended as the results may not be accurate.
|-
|-
|style="background:LightGrey; color:black"|Resolution x y
|style="background:LightGrey; color:black"|Resolution X Y
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
Down to 0.067 µm
Down to 0.025 µm in theory, but the tip radius is 2 µm, so the meaningful resolution is at the same order of magnitude
|-
|-
|style="background:LightGrey; color:black"|Resolution z
|style="background:LightGrey; color:black"|Resolution Z
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
1 Å, 10 Å, 40 Å or 160 Å (for ranges 65 kÅ, 655 kÅ, 2620 kÅ and 1 mm respectively)
0.01 Å, 0.08 Å, or 0.6 Å according to the manufacturer for ranges 13 µm, 131 µm, and 1 mm. Note the smallest of these values are purely theoretical as they are far below the lab's noise level.
|-
|-
|style="background:LightGrey; color:black"|Height accuracy z (95 % confidence)
|style="background:LightGrey; color:black"|Height accuracy z (95 % confidence)
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
~ 300 Å for the 65 kÅ range, ~ 0.16 µm for the intermediate ranges, and ~0.6 µm for the 1 mm range for well-defined steps that are easy to measure ([[#Height measurement accuracy|see below]])
~ 2 % for the smallest range for a 1 micron step and ~ 1 % for a 25 micron step '''for well-defined steps that are easy to measure''' (read about reducing and estimating the measurement uncertainty [[/Stylus profiler measurement uncertainty|here]])
|-
|-
|style="background:LightGrey; color:black"|Max. scan depth as a function of trench width W
|style="background:LightGrey; color:black"|Max scan depth as a function of trench width W
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
1.2*(W[µm]-5µm)
0.87*(W[µm]-2µm) = tan(60<sup>o</sup>)/2*(W[µm]-2µm)
|-
(empirically validated by Nanolab staff)
|-
|-
!style="background:silver; color:black" align="left"|Hardware settings
!style="background:silver; color:black" align="left"|Hardware settings
|style="background:LightGrey; color:black"|Tip radius
|style="background:LightGrey; color:black"|Tip radius
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*5 µm, 45<sup>o</sup> cone
*2 µm 60<sup>o</sup> cone
|-
|-
!style="background:silver; color:black" align="left" rowspan="2" valign="top" |Performance
!style="background:silver; color:black" align="left" rowspan="5" valign="top" |Substrates
|style="background:LightGrey; color:black"|Substrate size
|style="background:LightGrey; color:black"|Substrate size
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Up to 8"
*Up to 8"
|-
|-
| style="background:LightGrey; color:black"|Substrate material allowed
| style="background:LightGrey; color:black"|Substrate materials allowed
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*In principle all materials
*All materials that do not stick to the tip or leave residues on the chuck.
*For very soft materials we recommend the Dektak150, see below.
|-  
|-  
|}
|}


=== Height measurement accuracy ===
==Optical Profiler (Sensofar S Neox) ==  
[[#Height measurement accuracy for the DektakXT|See above for the DektakXTA]] as the considerations for the Dektak 8 are the same, though the resolution and measurement repeatability is a tiny bit better for the Dektak 8 than for the DektakXTA.
{{CC-bghe2}}
[[image:IMG_4555.JPG|275x275px|right|thumb|Optical Profiler (Sensofar): positioned in the clean room C-1), {{photo1}}]]


==Optical Profiler (Sensofar)==
The Sensofar S Neox 3D Optical Profiler has a sensor head that combines confocal, interferometry and focus variation techniques  as well as thick and thin film measurement capabilities.


[[image:Optical_profiler_1.jpg|275x275px|right|thumb|Optical Profiler (Sensofar): positioned in the clean room F-2)]]
The Neox sensor head provides standard microscope imaging, confocal imaging, confocal profiling, PSI (Phase Shift Interferometry), CSI (Coherence Scanning Interferometry), Active illumination (Ai) Focus Variation and high resolution thin film thickness measurements on a single instrument.
 
The PLu Neox 3D Optical Profiler (from Sensofar) has a dual-technology sensor head that combines confocal and interferometry techniques as well as thick and thin film measurement capabilities.
 
The Neox sensor head provides standard microscope imaging, confocal imaging, confocal profiling, PSI (Phase Shift Interferometry), VSI (Vertical Scanning Interferometry) and high resolution thin film thickness measurements on a single instrument.


The main purpose is 3D topographic imaging of surfaces, step height measurements in smaller trenches/holes than can be obtained with standard stylus methods (i.e. with aspect ratios higher that 1:1), roughness measurements with larger FOV (Field Of View) than the AFM, but less horisontal resolution.
The main purpose is 3D topographic imaging of surfaces, step height measurements in smaller trenches/holes than can be obtained with standard stylus methods (i.e. with aspect ratios higher that 1:1), roughness measurements with larger FOV (Field Of View) than the AFM, but less horisontal resolution.
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For most samples the optical profiler provides fast and easy information without any sample preparation. However, it can be necessary to cover thin transparent layers (< 2 µm) with a thin layer of metal.
For most samples the optical profiler provides fast and easy information without any sample preparation. However, it can be necessary to cover thin transparent layers (< 2 µm) with a thin layer of metal.


The resolution is limited by the objectives and the pixel resolution. Also the depth of focus is limited, especially for higher magnifications.
The resolution is limited by the objectives and the pixel resolution.  
[[Image:3D examples.JPG|200px|right|thumb|From the Sensofar Metrology, used with permission]]


'''Analysis software:''' Free analysis software for visualizing and analyzing AFM and Optical profiler files (Sensofar) [http://gwyddion.net Gwyddion]
'''Analysis software:'''  
*Free analysis software for visualizing and analyzing AFM and Optical profiler files (Sensofar) [http://gwyddion.net Gwyddion]
*SensoView software from Sensfar want also be downloaded for all users: U:\Nlab\CleanroomDrive\_Equipment\Optical profiler Sensofar\SensoVIEW 1.6.0
*We have an extra license to the more advanced SensoMap software. As a user of the system you can access this by remote desktop here: DTU-8CC0321MFL. You log in using your DTU login.




'''The user manual, technical information and contact information can be found in LabManager:'''  
'''The user manual, technical information (SensoSCAN and SensoVIEW manuals) and contact information can be found in LabManager (requires login):'''  


[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=301 Optical profiler (Sensofar) info page in LabManager]
[http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=491 Optical profiler (Sensofar S Neox) info page in LabManager]




===Process Information===
===Process Information===
*[[/Optical Profiler (Sensofar) acceptance test|Results from the Optical Profiler (Sensofar) acceptance test]]
 
*[[Media:Plu neox 2010.pdf| Sensofar presentation on how the sensofar works]]
*[https://labmanager.dtu.dk/view_binary.php?fileId=5345| Sensofar presentation on how the sensofar works (for the previous system but the techniques are the same)] -requires login
*[[Media:PLu neox.pdf| Plu neox leaflet including specifications]]
*[https://labmanager.dtu.dk/view_binary.php?fileId=5346|S Neox leaflet including specifications] - requires login
*Acceptance measurements on the S Neox Sensofar: [[Media:Acceptance measurements on Nanolab samples.pdf]], measured at the acceptances test by Sensofar and Berit Herstrøm@ DTU Nanolab
*[[/Optical Profiler (Sensofar) acceptance test|Results from the Optical Profiler (Sensofar) acceptance test - for the previous system - expired!!]]


===Equipment performance and process related parameters===
===Equipment performance and process related parameters===
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*Step height measurements
*Step height measurements
*3D topographic measurements
*3D topographic measurements
*Thick and thin film thickness measurements in small spots (down to 4 µm)
*Thick and thin film thickness measurements in small spots
|-
|-
!style="background:silver; color:black;" align="left"|Posibilities  
!style="background:silver; color:black;" align="left"|Posibilities  
|style="background:LightGrey; color:black"|Confocal and interferometric profiling and reflectometry||style="background:WhiteSmoke; color:black"|
|style="background:LightGrey; color:black"|Confocal, interferometric and AI focus variation tophography and reflectometry
*Standard microscope imaging
*Standard microscope imaging
*Confocal imaging
*Confocal imaging
*Confocal profiling
*Confocal profiling
*PSI (Phase Shift Interferometry)
*PSI (Phase Shift Interferometry)
*VSI (Vertical Scanning Interferometry)
*CSI (Coherence Scanning Interferometry)
*Active illumination (Ai) Focus Variation
*High resolution thin film thickness measurement using reflectrometry  
*High resolution thin film thickness measurement using reflectrometry  
*Stitched scans  
*Stitched scans  
*Wafer mapping
*Wafer mapping  
|style="background:WhiteSmoke; color:black"|
 
[[image:Techniques overview.JPG|thumb|center|From the Sensofar S Neox 3D optical profiler brochure, used with permission]]
|-
|-
!style="background:silver; color:black" align="left"|Performance
!style="background:silver; color:black" align="left"|Performance
|style="background:LightGrey; color:black"|Depending on the objective chosen||style="background:WhiteSmoke; color:black"|
|style="background:LightGrey; color:black"|Depending on the objective chosen||style="background:WhiteSmoke; color:black"|
*See the performance of the different objectives here: [[image:Optical_Profiler_Table_2.jpg|27x27px|center|thumb]]
*See the performance of the different objectives here:  
[[image:Objectives01.JPG|600px|Objectives01.JPG]]
|-
|-
|-
|-
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| style="background:LightGrey; color:black"|Substrate materials allowed
| style="background:LightGrey; color:black"|Substrate materials allowed
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*In principle all materials
*In principle all materials as long as they are allowed in the cleanroom outside fumehoods - no liquids!
|-  
|-  
|}
|}


==Optical Profiler (Filmetrics)==
==Optical Profiler (Filmetrics)==
 
{{CC-bghe2}} <br>
[[image:Scanner without anotation.jpg|275x275px|right|thumb|Optical Profiler (Filmetrics): positioned in the basement (346-904)]]
[[image:Scanner without anotation.jpg|275x275px|right|thumb|Optical Profiler (Filmetrics): positioned in the basement (346-904), {{photo1}}]]


The Profilm3D optical profiler from Filmetrics uses white-light-interferometry (WLI) and phase-shifting-interferometry (PSI) to produce surface profiles and depth-of-field color images.
The Profilm3D optical profiler from Filmetrics uses white-light-interferometry (WLI) and phase-shifting-interferometry (PSI) to produce surface profiles and depth-of-field color images.
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'''The user manual, technical information and contact information can be found in LabManager:'''  
'''The user manual, technical information and contact information can be found in LabManager (requires login):'''  


[http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=467 Optical profiler (Filmetrics) info page in LabManager]
[http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=467 Optical profiler (Filmetrics) info page in LabManager]
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!style="background:silver; color:black" align="left"|Performance
!style="background:silver; color:black" align="left"|Performance
|style="background:LightGrey; color:black"|With the current 10x objective||style="background:WhiteSmoke; color:black"|
|style="background:LightGrey; color:black"|With the current 10x objective||style="background:WhiteSmoke; color:black"|
[[:File:Filmetrics Datasheet - Profilm3D Bh6.pdf|See here the data sheet for this instrument]]
[https://labmanager.dtu.dk/view_binary.php?fileId=4174 See here the data sheet for this instrument (requires login)]]
|-
|-
|-
|-
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[[image:III-V profiler.JPG|300x300px|right|thumb|The profiler placed in 346-904 (Dektak 3ST).]]
[[image:III-V profiler.JPG|300x300px|right|thumb|The profiler placed in 346-904 (Dektak 3ST).]]


The Dektak 3ST is intended for profile measurements on samples outside the cleanroom.  
The Dektak 3ST is intended for profile measurements on samples outside the cleanroom. It is located in the basement, building 346, room 904.  




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* polymer
* polymer
|}
|}


== Stylus Profiler: Dektak150 ==
== Stylus Profiler: Dektak150 ==




[[image:Dektak150.JPG|300x300px|right|thumb|Stylus profiler:Dektak150 placed in 347-183.]]
[[image:Dektak150.JPG|300x300px|right|thumb|Stylus profiler:Dektak150, currently located in building 451, room 913 (as of 2023).]]


The stylus profiler Dektak150 is intended for profile measurements on samples outside the cleanroom.  
The stylus profiler Dektak150 is intended for profile measurements on samples outside the cleanroom. The Dektak150 is especially well suited for measuring soft samples as it can be adjusted to apply lower force than the other stylus profilers at Nanolab.




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The computer is not connected to the network but data can be saved on a dedicated USB and transfered to a computer on the network.
The computer is not connected to the network but data can be saved on a dedicated USB and transfered to a computer on the network.
Info about measurement accuracy can be found [[/Stylus profiler measurement uncertainty|here]].


===Equipment performance and process related parameters===
===Equipment performance and process related parameters===
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|-
|-
!style="background:silver; color:black;" align="left"|Purpose  
!style="background:silver; color:black;" align="left"|Purpose  
|style="background:LightGrey; color:black"|Profiler for measuring micro structures||style="background:WhiteSmoke; color:black"|
|style="background:LightGrey; color:black"|Profiler for measuring micro structures|
|style="background:WhiteSmoke; color:black"|
*Single line profiles
*Single line profiles
*Surface roughness on a line scan
*Surface roughness on a line scan
|-
!style="background:silver; color:black;" align="left"|Location
|style="background:LightGrey; color:black"|Building 451, room 913
|style="background:WhiteSmoke; color:black"|
*North-East corner of the building, in the basement
*When you enter the building from the East, you enter directly into the basement.
|-
|-
!style="background:silver; color:black" align="left" rowspan="5" valign="top" |Performance
!style="background:silver; color:black" align="left" rowspan="5" valign="top" |Performance
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|style="background:LightGrey; color:black"|Resolution x y
|style="background:LightGrey; color:black"|Resolution x y
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Down to 0.003µm
Theoretically down to 0.003 µm (in practice the resolution is limited by the tip size)
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100mm
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Latest revision as of 16:36, 5 February 2024

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All contents by DTU Nanolab staff unless otherwise noted.

Overview of the Nanolab profilers

All the profilers are compared on the topographic measurement page.

The sections below describe each profiler (stylus profilers and optical profilers) in more detail.

Dektak XTA stylus profiler

The Dektak XTA stylus profiler from Brüker is used for profiling surfaces of samples with structures in the micro- and nanometer range. The size of the structures that can be measured is limited by the tip dimensions.

A profile measurement can be done across a specific structure by using a high magnification camera to locate the structure. It is also possible to program the stylus to measure in several positions, defined with respect to some deskew points. Stress measurements of thin films can be done by measuring the wafer bow. However, for predefined measurement programs or stress measurements, we recommend the P17 profiler - see next section.


The user manual, quality control procedure and results, technical information and contact information can be found in LabManager:

Dektak XTA in LabManager

Info about measurement accuracy can be found here.

Equipment performance and process related parameters

Dektak XTA. Now in cleanroom C-1, at time of photo it was somewhere else.
Purpose Profiler for measuring micro structures
  • Single line profiles
  • Wafer mapping
  • Stress measurements by measuring wafer bow
  • Surface roughness on a line scan
Performance Scan range x y

Line scan x: 50 µm to 55 mm in a single scan, up to 200 mm with stiching

Scan range z

50 Å to 1 mm

Resolution x y

Down to 0.003 µm theoretically, in practice limited by the tip radius

Resolution z

1 Å, 10 Å, 80 Å or 160 Å (for ranges 65 kÅ, 655 kÅ, 5240 kÅ and 1 mm respectively)

Height accuracy z (95 % confidence)

~ 2 % for a 1 µm step with the smallest measurement range and ~ 1 % for a 25 µm step for well-defined steps that are easy to measure (read about reducing and estimating the measurement uncertainty here)

Max scan depth as a function of trench width W

1.2*(W[µm]-5µm)

Hardware settings Tip radius
  • 5 µm 45o cone
Substrates Substrate size
  • Up to 6"
Substrate materials allowed
  • All materials that do not stick to the tip or leave residues on the chuck
  • For very soft polymers we recommend the Dektak 150, see below

Stylus Profiler (Tencor P17)

The P17 Stylus Profiler from KLA Tencor is used in a similar manner to the Dektak XTA for profiling surfaces with structures in the micro- and submicrometer range as well as for measuring stress.

Compared to the DektakXT, the P17 has more advanced options for stress measurements: It allows the user to measure a stress map with up to 5° radial resolution. Programming and analyzing a sequence of predefined scans in fixed locations on a wafer is also easier and the manual for doing it much better for the P17 than for the DektakXT. A disadvantage of the P17 is that is can be hard to locate structures as the maximum field of view of the camera is 1x1.5 mm. We recommend having a map of the sample design available so you can easily locate the features of interest. Otherwise the P17 is easy to use, fast, and accurate, just like the DektakXT.

The user manual, quality control procedure and results, technical information and contact information can be found in LabManager:

P17 page in LabManager

Process information

  • Info about making 2D stress measurements (requires login). Most users will want to make 3D stress measurements, which is described in the regular Nanolab manual for the P17, also found on LabManager. It counts as "3D" if you wish to make 2 perpendicular scans. A "2D" stress scan means a single line scan per wafer - the software does not even allow manual rotation of the stage for this type of scan.

Acceptance test

Equipment performance and process related parameters

Front of the P17 profiler located in cleanroom F-2.
Purpose Profiler for measuring microstructures
  • Single line profiles
  • Wafer mapping
  • Stress measurements by measuring the wafer bow
  • Surface roughness on a line scan
Performance Scan range X Y

Line scan X: 20 µm to 200 mm in a single scan. No stitching.

Map scan XY: In principle any rectangle that can be inscribed in a 200 mm circle, but resolution is limited to max. 4 million points and scanning is slow. In practice to get good resolution scan a very small area (e.g., 100 x 500 µm)

Scan range Z

50 nm to 900 µm. It is possible to measure smaller steps but not recommended as the results may not be accurate.

Resolution X Y

Down to 0.025 µm in theory, but the tip radius is 2 µm, so the meaningful resolution is at the same order of magnitude

Resolution Z

0.01 Å, 0.08 Å, or 0.6 Å according to the manufacturer for ranges 13 µm, 131 µm, and 1 mm. Note the smallest of these values are purely theoretical as they are far below the lab's noise level.

Height accuracy z (95 % confidence)

~ 2 % for the smallest range for a 1 micron step and ~ 1 % for a 25 micron step for well-defined steps that are easy to measure (read about reducing and estimating the measurement uncertainty here)

Max scan depth as a function of trench width W

0.87*(W[µm]-2µm) = tan(60o)/2*(W[µm]-2µm) (empirically validated by Nanolab staff)

Hardware settings Tip radius
  • 2 µm 60o cone
Substrates Substrate size
  • Up to 8"
Substrate materials allowed
  • All materials that do not stick to the tip or leave residues on the chuck.
  • For very soft materials we recommend the Dektak150, see below.

Optical Profiler (Sensofar S Neox)

Unless otherwise stated, all content in this section was done by Berit Herstrøm, DTU Nanolab

Optical Profiler (Sensofar): positioned in the clean room C-1), Photo: DTU Nanolab internal

The Sensofar S Neox 3D Optical Profiler has a sensor head that combines confocal, interferometry and focus variation techniques as well as thick and thin film measurement capabilities.

The Neox sensor head provides standard microscope imaging, confocal imaging, confocal profiling, PSI (Phase Shift Interferometry), CSI (Coherence Scanning Interferometry), Active illumination (Ai) Focus Variation and high resolution thin film thickness measurements on a single instrument.

The main purpose is 3D topographic imaging of surfaces, step height measurements in smaller trenches/holes than can be obtained with standard stylus methods (i.e. with aspect ratios higher that 1:1), roughness measurements with larger FOV (Field Of View) than the AFM, but less horisontal resolution.

For most samples the optical profiler provides fast and easy information without any sample preparation. However, it can be necessary to cover thin transparent layers (< 2 µm) with a thin layer of metal.

The resolution is limited by the objectives and the pixel resolution.

From the Sensofar Metrology, used with permission

Analysis software:

  • Free analysis software for visualizing and analyzing AFM and Optical profiler files (Sensofar) Gwyddion
  • SensoView software from Sensfar want also be downloaded for all users: U:\Nlab\CleanroomDrive\_Equipment\Optical profiler Sensofar\SensoVIEW 1.6.0
  • We have an extra license to the more advanced SensoMap software. As a user of the system you can access this by remote desktop here: DTU-8CC0321MFL. You log in using your DTU login.


The user manual, technical information (SensoSCAN and SensoVIEW manuals) and contact information can be found in LabManager (requires login):

Optical profiler (Sensofar S Neox) info page in LabManager


Process Information

Equipment performance and process related parameters

Equipment Optical profiler
Purpose 3D topographic imaging of surfaces.
  • 3D imaging of surfaces
  • Roughness measurements
  • Step height measurements
  • 3D topographic measurements
  • Thick and thin film thickness measurements in small spots
Posibilities Confocal, interferometric and AI focus variation tophography and reflectometry
  • Standard microscope imaging
  • Confocal imaging
  • Confocal profiling
  • PSI (Phase Shift Interferometry)
  • CSI (Coherence Scanning Interferometry)
  • Active illumination (Ai) Focus Variation
  • High resolution thin film thickness measurement using reflectrometry
  • Stitched scans
  • Wafer mapping
From the Sensofar S Neox 3D optical profiler brochure, used with permission
Performance Depending on the objective chosen
  • See the performance of the different objectives here:

Objectives01.JPG

Substrates Substrate size
  • Substrates no bigger than 150 mm x 150mm
Substrate materials allowed
  • In principle all materials as long as they are allowed in the cleanroom outside fumehoods - no liquids!

Optical Profiler (Filmetrics)

Unless otherwise stated, all content in this section was done by Berit Herstrøm, DTU Nanolab

Optical Profiler (Filmetrics): positioned in the basement (346-904), Photo: DTU Nanolab internal

The Profilm3D optical profiler from Filmetrics uses white-light-interferometry (WLI) and phase-shifting-interferometry (PSI) to produce surface profiles and depth-of-field color images.

The main purpose is 3D topographic imaging of surfaces, step height measurements and roughness measurements with larger FOV (Field Of View) than the AFM, but less horisontal resolution.

For most samples the optical profiler provides fast and easy information without any sample preparation. However, it can be necessary to cover thin transparent layers (< 2 µm) with a thin layer of metal.

The resolution is limited by the objective and the sampling resolution.


The user manual, technical information and contact information can be found in LabManager (requires login):

Optical profiler (Filmetrics) info page in LabManager


Equipment performance and process related parameters

Equipment Optical profiler
Purpose 3D topographic imaging of surfaces.
  • 3D imaging of surfaces
  • Roughness measurements
  • Step height measurements
  • 3D topographic measurements
Posibilities Interferometric profiling
  • Standard microscope imaging
  • PSI (Phase Shift Interferometry)
  • WLI (White light Interferometry)
  • Stitched scans
  • Wafer mapping
Performance With the current 10x objective

See here the data sheet for this instrument (requires login)]

Substrates Substrate size
  • Substrates no bigger than 100 mm x 100mm
Substrate materials allowed
  • In principle all materials

Dektak 3ST

The profiler placed in 346-904 (Dektak 3ST).

The Dektak 3ST is intended for profile measurements on samples outside the cleanroom. It is located in the basement, building 346, room 904.


The user manual, technical information and contact information can be found in LabManager:

Dektak 3ST (Dektak) in LabManager

The computer connected to the Dektak 3ST is pretty old and runs Windows 98 SE. It is not connected to the network but traces can be saved on either USB memory stick or floppy disk. The USB driver is an old universal driver and has been shown to work with small size USB sticks. However it did not work with an 8GB Kingston stick.

Equipment performance and process related parameters

Performance Vertical Range
  • 65 kÅ, 655 kÅ, 1310 kÅ
Scan length range
  • 50-50000 µm
Stylus track force
  • Recommended: 3-10 mg, depending on the softness of the surface
Scan speed ranges
  • High speed: 3s for 50µm to 50000µm
  • Medium speed: 12s for 50µm to 10000µm
  • Low speed: 50s
Materials Allowed substrate materials
  • III-V
  • Silicon
  • polymer

Stylus Profiler: Dektak150

Stylus profiler:Dektak150, currently located in building 451, room 913 (as of 2023).

The stylus profiler Dektak150 is intended for profile measurements on samples outside the cleanroom. The Dektak150 is especially well suited for measuring soft samples as it can be adjusted to apply lower force than the other stylus profilers at Nanolab.


The user manual, technical information and contact information can be found in LabManager:

Stylus profiler:Dektak150 in LabManager

The computer is not connected to the network but data can be saved on a dedicated USB and transfered to a computer on the network.

Info about measurement accuracy can be found here.

Equipment performance and process related parameters

Purpose Profiler for measuring micro structures|
  • Single line profiles
  • Surface roughness on a line scan
Location Building 451, room 913
  • North-East corner of the building, in the basement
  • When you enter the building from the East, you enter directly into the basement.
Performance Scan range x y

Line scan x: 50 µm to 55 mm in a single scan

Scan range z

50 Å to 1 mm

Resolution x y

Theoretically down to 0.003 µm (in practice the resolution is limited by the tip size)

Resolution z

1Å (@65kÅ), 10Å (@655 kÅ), 80 Å (@5240 kÅ), 160 Å (@1mm)

Maximum sample thickness

100 mm

Hardware settings Tip radius
  • 5 µm 45o cone
  • 0.2 µm 45o cone on request
Substrates Substrate size
  • Up to 6"
Substrate materials allowed
  • In principle all materials