Specific Process Knowledge/Characterization: Difference between revisions

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'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Characterization click here]'''  
'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Characterization click here]''' <br>
{{CC1}}
==Overview of characteristics and where to measure it==
{| {{table } }
|  width="50" align="center" style="background:#f0f0f0;"|
|  width="50" align="center" style="background:#f0f0f0;"|'''[[Specific_Process_Knowledge/Characterization/Optical_microscope| Optical Micro- scopes]]'''
|  width="50" align="center" style="background:#f0f0f0;"|'''[[Specific Process Knowledge/Characterization/SEM: Scanning Electron Microscopy|SEM (incl. EDX)]]'''
|  width="50" align="center" style="background:#f0f0f0;"|'''[[Specific Process Knowledge/Characterization/AFM: Atomic Force Microscopy|AFM]]'''
|  width="50" align="center" style="background:#f0f0f0;"|'''[[Specific Process Knowledge/Characterization/Profiler|Stylus profiler]]'''
|  width="50" align="center" style="background:#f0f0f0;"|'''[[Specific_Process_Knowledge/Characterization/Profiler#Optical_Profiler_(Sensofar_S_Neox)|Optical profiler]]'''
|  width="50" align="center" style="background:#f0f0f0;"|'''[[Specific_Process_Knowledge/Characterization/Optical_characterization#Filmtek_4000|Filmtek (reflec- tometer)]]'''
|  width="50" align="center" style="background:#f0f0f0;"|'''[[Specific_Process_Knowledge/Characterization/Optical_characterization#Ellipsometer|Ellip- someter]]'''
|  width="50" align="center" style="background:#f0f0f0;"|'''[[Specific_Process_Knowledge/Characterization/Thickness_Measurer|Thickness stylus]]'''
|  width="50" align="center" style="background:#f0f0f0;"|'''[[Specific_Process_Knowledge/Characterization/XPS|XPS]]'''
|  width="50" align="center" style="background:#f0f0f0;"|'''[[Specific_Process_Knowledge/Characterization/PL_mapper|PL mapper]]'''
|  width="50" align="center" style="background:#f0f0f0;"|'''[[Specific_Process_Knowledge/Characterization/4-Point_Probe|4-point probe]]'''
|  width="50" align="center" style="background:#f0f0f0;"|'''[[Specific_Process_Knowledge/Characterization/Probe_station|Probe station]]'''
|  width="50" align="center" style="background:#f0f0f0;"|'''[[Specific_Process_Knowledge/Characterization/XRD|XRD]]'''
|  width="50" align="center" style="background:#f0f0f0;"|'''[[Specific_Process_Knowledge/Characterization/Lifetime_scanner_MDPmap|Life time scanner]]'''
|  width="50" align="center" style="background:#f0f0f0;"|'''[[Specific_Process_Knowledge/Characterization/Drop_Shape_Analyzer|Drop shape analyser]]'''
|  width="50" align="center" style="background:#f0f0f0;"|'''[[Specific_Process_Knowledge/Characterization/Hardness_measurement|Hardness tester]]'''
|  width="50" align="center" style="background:#f0f0f0;"|'''[[Specific Process Knowledge/Characterization/Particle Scanner Takano|Particle scanner]]'''
|  width="50" align="center" style="background:#f0f0f0;"|'''IR-camera'''
|  width="50" align="center" style="background:#f0f0f0;"|'''[[Specific Process Knowledge/Characterization/III-V_ECV-profiler|III-V ECV-profiler]]'''
|  width="50" align="center" style="background:#f0f0f0;"|'''[[Specific Process Knowledge/Characterization/MicroSpectroPhotometer (Craic 20/30 PV)|Microspectrophotometer (Craic 20/30 PV)]]'''
|-
|-style="background:#DCDCDC;" align="center"
|align="left"| Breakdown voltage
|||||||||||||||||||||||||||||||||||||||
|-
|-style="background:#C0C0C0;" align="center"
|align="left"| Carrier density/doping profile
|||||||||||||||||||||||||||||||||||||x||


|-
|-style="background:#DCDCDC;" align="center"
|align="left"| Charge carrier life time||||||||||||||||||||||||||||x||||||||||||
|-
|-style="background:#C0C0C0;" align="center"
|align="left"| Contact angle hydrophobic/hydrophillic||||||||||||||||||||||||||||||x||||||||||
|-
|-style="background:#DCDCDC;" align="center"
|align="left"| Crystallinity||||||||||||||||||||||||||x||||||||||||||
|-
|-style="background:#C0C0C0;" align="center"
|align="left"| Deposition uniformity||||||||||x||x||x||||||||||||||||||||||||||
|-
|-style="background:#DCDCDC;" align="center"
|align="left"|[[Specific_Process_Knowledge/Characterization/Sample_imaging|Dimensions(in plane)]]||x||x||(x)||(x)||x||||||||||||||||||||||||||||||x
|-
|-style="background:#C0C0C0;" align="center"
|align="left"|[[Specific_Process_Knowledge/Characterization/Topographic_measurement|Dimensions(height)/Topography]]||(x)||(x)||x||x||x||||||||||||||||||||||||||||||
|-
|-style="background:#DCDCDC;" align="center"
|align="left"| Electrical conductivity||||||||||||||||||||||||x||||||||||||||||
|-
|-style="background:#C0C0C0;" align="center"
|align="left"| [[Specific_Process_Knowledge/Characterization/Element_analysis|Element analysis]]||||x||||||||||||||x||x  4)||||||x  4)||||||||||||||
|-
|-style="background:#DCDCDC;" align="center"
|align="left"| [[Specific_Process_Knowledge/Characterization/Stress_measurement|Film stress]]||||||||x||||||||||||||||||x  7)||||||||||||||
|-
|-style="background:#C0C0C0;" align="center"
|align="left"|[[Specific_Process_Knowledge/Characterization/Sample_imaging|Imaging]]||x||x||x||||x||||||||||||||||||||||||||||||x
|-
|-style="background:#DCDCDC;" align="center"
|align="left"| [[Specific_Process_Knowledge/Characterization/Hardness_measurement|Material Hardness]]||||||||||||||||||||||||||||||||x||||||||
|-
|-style="background:#C0C0C0;" align="center"
|align="left"| Band gap||||||||||||||x||||x||x||||||||||||||||||||
|-
|-style="background:#DCDCDC;" align="center"
|align="left"| Particles||x||x||x||||||||||||||||||||||||||||x||||||x
|-
|-style="background:#C0C0C0;" align="center"
|align="left"| Phase changes||||||||||||||||||||||||||||||||||||||||
|-
|-style="background:#DCDCDC;" align="center"
|align="left"| Reflectivity||||||||||||x||x||||||x 6)||||||||||||||||||||x
|-
|-style="background:#C0C0C0;" align="center"
|align="left"| [[Specific_Process_Knowledge/Characterization/Measurement_of_film_thickness_and_optical_constants|Refractive index]]||||||||||||x||x||||||||||||||||||||||||||
|-
|-style="background:#DCDCDC;" align="center"
|align="left"| Resistivity||||||||||||||||||||||x||||||||||||||||||
|-
|-style="background:#C0C0C0;" align="center"
|align="left"| Step coverage||x  1)||x  1)||||||||||||||||||||||||||||||||||||
|-
|-style="background:#DCDCDC;" align="center"
|align="left"| Surface roughness||||||x||x||x||||||||||||||||x||||||||||||||
|-
|-style="background:#C0C0C0;" align="center"
|align="left"| Thermal conductivity||||||||||||||||||||||||||||||||||||||||
|-
|-style="background:#DCDCDC;" align="center"
|align="left"| [[Specific_Process_Knowledge/Characterization/Measurement_of_film_thickness_and_optical_constants|Thin film thickness]]||x  1)||x  1)||x  2)||x  2)||x  ||x||x||||||x 5)||x  3)||||x||||||||||||||
|-
|-style="background:#C0C0C0;" align="center"
|align="left"| Voids in wafer bonding||x||||||||||||||||||x||||||||||||||||x||||
|-
|-style="background:#DCDCDC;" align="center"
|align="left"| [[Specific_Process_Knowledge/Characterization/Thickness_Measurer|Wafer thickness]]||x  1)||x  1)||||||||||||x||||||||||||||||||||||||
|-
|-style="background:#C0C0C0;" align="center"
|align="left"| Work function||||||||||||||||||x||||||||||||||||||||||
|-
|}


# Using the cross section method
# Using the create step method
# With known resistivity
# Composition information for crystalline materials
# Only single layer
# Good for characterization of VCSEL structures and DBR mirrors
# Only for crystalline films


== Choose characterization topic ==
== Choose characterization topic ==
*[[Specific Process Knowledge/Characterization/III-V_ECV-profiler|Carrier density (doping) profiler]]
*[[Specific_Process_Knowledge/Characterization/Drop_Shape_Analyzer|Contact angle measurement]]
*[[/Element analysis|Element analysis]]
*[[/Element analysis|Element analysis]]
*[[/Measurement of film thickness and optical constants|Measurement of film thickness and optical constants]]
*[[/Measurement of film thickness and optical constants|Film thickness and optical constants]]
*[[/PL Mapper|Photoluminescence mapping]]
*[[/Hardness measurement|Hardness measurement]]
*[[/PL mapper|Photoluminescence mapping]]
*[[/Four-Point_Probe|Four-Point Probe (Resistivity measurement)]] <!-- [[/Resistivity measurement|Resistivity measurement]] -->
*[[/Sample imaging|Sample imaging]]
*[[/Sample imaging|Sample imaging]]
*[[/Sample preparation|Sample preparation for inspection]]
*[[Specific Process Knowledge/Characterization/SEM: Scanning Electron Microscopy|Scanning Electron Microscopy]]
*[[/Stress measurement|Stress measurement]]
*[[/Stress measurement|Stress measurement]]
*[[/Thickness Measurer|Wafer thickness measurement]]
*[[/Thickness Measurer|Wafer thickness measurement]]
*[[/Topographic measurement|Topographic measurement]]
*[[/Topographic measurement|Topographic measurement]]
*[[Specific Process Knowledge/Characterization/XRD|X-ray diffraction]]  
*[[Specific_Process_Knowledge/Characterization/Drop_Shape_Analyzer|Contact angle measurement]]
*[[/Four-Point_Probe|Four-Point_Probe (Resistivity measurement)]] <!-- [[/Resistivity measurement|Resistivity measurement]] -->
*[[Specific Process Knowledge/III-V Process/characterisation/III-V ECV-profiler|Carrier density (doping) profiler]]
*[[Specific Process Knowledge/Characterization/SEM: Scanning Electron Microscopy|Scanning Electron Microscopy]]  
<!--
<!--
*[[/Other electrical measurements|Other electrical measurements]]
*[[/Other electrical measurements|Other electrical measurements]]
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== Choose equipment ==
== Choose equipment ==


*[[/SEM: Scanning Electron Microscopy |SEM LEO]]
===AFM===
*[[/SEM: Scanning Electron Microscopy |SEM JEOL]]
*[[/AFM: Atomic Force Microscopy|AFM - ''Atomic Force Microscopy'']]
*[[/SEM: Scanning Electron Microscopy |SEM Zeiss]]
 
*[[/SEM: Scanning Electron Microscopy |SEM Zeiss Supra 60 VP]]
===Electrical measurements===
*[[/4-Point Probe|4-Point Probe]]
*[[/Probe station|Probe station]]
*[[/III-V ECV-profiler|III-V ECV-profiler (Electrochemical Capacitance-Voltage carrier density profiler)]]


*[[/AFM: Atomic Force Microscopy|AFM - ''Atomic Force Microscopy'']]
===Element analysis===
*[[/SEM Supra 2|SEM with EDX]]
*[[/XPS|XPS tools ]]


===Optical and stylus profilers===
*[[/Profiler#Optical_Profiler_(Sensofar)|Optical Profiler (Sensofar)]]
*[[/Profiler#Optical_Profiler_(Sensofar)|Optical Profiler (Sensofar)]]
*[[/Profiler#Dektak XTA_new stylus profiler|Dektak XTA_new]]
*[[/Profiler#Dektak XTA_new stylus profiler|Dektak XTA stylus profiler]]
*[[/Profiler#Dektak _8 stylus _profiler|Dektak 8 stylus profiler]]
*[[/Profiler#Stylus Profiler (Tencor P17)|P17 stylus profiler from KLA-Tencor]]
*[[/Profiler#Dektak_III-V_Profiler|III V Profiler]]
*[[/Profiler#Dektak_III-V_Profiler|Dektak 3ST stylus profiler]]
*[[/Profiler#Stylus_Profiler:_Dektak150|Stylus Profiler:Dektak150]]


*[[/Optical microscope|Optical microscope]]
===Optical microscopes===
*[[/Optical microscope|Optical microscopes]]


===Optical characterization===
*[[/Optical characterization#Ellipsometer|Ellipsometer]]
*[[/Optical characterization#Ellipsometer|Ellipsometer]]
*[[/Optical characterization#Filmtek_4000|Filmtek 4000]]
*[[/Optical characterization#Filmtek_4000|Filmtek 4000]]
*[[/Optical characterization#Prism_Coupler|Prism Coupler]]
*[[/PL mapper|PL mapper - ''Photoluminescence mapper'']]
*[[/PL Mapper|PL mapper - ''Photoluminescence mapper'']]
*[[/Lifetime scanner MDPmap|Lifetime scanner MDPmap]]
 
===SEMs at DTU Nanolab - building 307/314===
<!-- *[[LabAdviser/CEN/Quanta 3D FIB/SEM|FIB-SEM FEI QUANTA 200 3D]] -->
*[[LabAdviser/CEN/Helios Nanolab 600|Dual Beam FEI Helios Nanolab 600]]
*[[LabAdviser/CEN/Nova NanoSEM 600|SEM FEI Nova 600 NanoSEM]]
*[[LabAdviser/CEN/Quanta FEG 200 ESEM|SEM FEI Quanta 200 ESEM FEG]]
<!-- *[[LabAdviser/CEN/Inspect S|SEM Inspect S]] -->


*[[/SIMS: Secondary Ion Mass Spectrometry#Atomika_SIMS|Atomika SIMS]]
===SEM's in building 346===
*[[/XPS#XPS-ThermoScientific|XPS-ThermoScientific ]]
*[[/SEM: Scanning Electron Microscopy |SEM Comparison page]]
*[[/SEM Supra 1|SEM Supra 1]]
*[[/SEM Supra 2|SEM Supra 2]]
*[[/SEM Supra 3|SEM Supra 3]]
*[[/SEM Tabletop 1|SEM Tabletop 1]]


*[[/Drop Shape Analyzer|Drop Shape Analyzer]]
===TEMs at DTU Nanolab - building 307/314===
*[[LabAdviser/CEN/Titan ATEM |Titan ATEM]]
*[[LabAdviser/CEN/Titan ETEM |Titan ETEM]]
*[[LabAdviser/CEN/Tecnai TEM |Tecnai TEM]]


*[[/4-Point Probe|4-Point Probe]]
===XRD===
*[[/XRD|General page on XRD]], page describing general info relevant to both our XRD's
*[[/XRD/XRD Powder|XRD Powder]], tabletop XRD for Bregg-Brentano measurements of powders
*[[/XRD/XRD SmartLab|XRD SmartLab]], advanced multipurpose instrument in the cleanroom


===Various===
*[[/Drop Shape Analyzer|Drop Shape Analyzer]]
*[[/Thickness Measurer|Thickness Measurer]]
*[[/Thickness Measurer|Thickness Measurer]]
*[[/Hardness measurement|Hardness tester]]
*[[/Particle Scanner Takano|Particle Scanner Takano]]


*[[/Probe station|Probe station]]
==Decommissioned equipment==
 
*[[/KLA-Tencor Surfscan 6420|KLA-Tencor Surfscan 6420]]
*[[/KLA-Tencor Surfscan 6420|KLA-Tencor Surfscan 6420]]
 
*[[/X-Ray Diffractometer|Phillips X-Ray Diffractometer that was owned by DTU Fotonik]]
*[[Specific Process Knowledge/III-V Process/characterisation/III-V ECV-profiler|III-V ECV-profiler (Electrochemical Capacitance-Voltage carrier density profiler)]]
*[[Specific Process Knowledge/III-V Process/characterisation/X-Ray Diffractometer |X-Ray Diffractometer ]]
*[[/X-Ray Diffractometer|X-Ray Diffractometer ]]
*[[/SEM: Scanning Electron Microscopy |SEM FEI - ''This instrument has been relocated to CEN'']]

Latest revision as of 13:37, 22 January 2024

Feedback to this page: click here
Unless otherwise stated, this page is written by DTU Nanolab internal

Overview of characteristics and where to measure it

Optical Micro- scopes SEM (incl. EDX) AFM Stylus profiler Optical profiler Filmtek (reflec- tometer) Ellip- someter Thickness stylus XPS PL mapper 4-point probe Probe station XRD Life time scanner Drop shape analyser Hardness tester Particle scanner IR-camera III-V ECV-profiler Microspectrophotometer (Craic 20/30 PV)
Breakdown voltage
Carrier density/doping profile x
Charge carrier life time x
Contact angle hydrophobic/hydrophillic x
Crystallinity x
Deposition uniformity x x x
Dimensions(in plane) x x (x) (x) x x
Dimensions(height)/Topography (x) (x) x x x
Electrical conductivity x
Element analysis x x x 4) x 4)
Film stress x x 7)
Imaging x x x x x
Material Hardness x
Band gap x x x
Particles x x x x x
Phase changes
Reflectivity x x x 6) x
Refractive index x x
Resistivity x
Step coverage x 1) x 1)
Surface roughness x x x x
Thermal conductivity
Thin film thickness x 1) x 1) x 2) x 2) x x x x 5) x 3) x
Voids in wafer bonding x x x
Wafer thickness x 1) x 1) x
Work function x
  1. Using the cross section method
  2. Using the create step method
  3. With known resistivity
  4. Composition information for crystalline materials
  5. Only single layer
  6. Good for characterization of VCSEL structures and DBR mirrors
  7. Only for crystalline films

Choose characterization topic

Choose equipment

AFM

Electrical measurements

Element analysis

Optical and stylus profilers

Optical microscopes

Optical characterization

SEMs at DTU Nanolab - building 307/314

SEM's in building 346

TEMs at DTU Nanolab - building 307/314

XRD

  • General page on XRD, page describing general info relevant to both our XRD's
  • XRD Powder, tabletop XRD for Bregg-Brentano measurements of powders
  • XRD SmartLab, advanced multipurpose instrument in the cleanroom

Various

Decommissioned equipment

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