Specific Process Knowledge/Back-end processing: Difference between revisions

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<!-- Under construction [[Image:section under construction.jpg|70px]] -->
<!-- Under construction [[Image:section under construction.jpg|70px]] -->
'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Back-end_processing click here]'''  
'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Back-end_processing click here]'''  
'''Unless anything else is stated, everything on this page, text and pictures are made by DTU Nanolab.'''


Back-end (or Post-fab) Processing are typical processes used to finish up your wafer/chip. This includes thinning and cutting out the wafer in chips that can be put on a carrier, a board or in a package, attaching the chip to the carrier and connecting it with wires to get electrical access to it.
Back-end (or Post-fab) Processing are typical processes used to finish up your wafer/chip. This includes thinning and cutting out the wafer in chips that can be put on a carrier, a board or in a package, attaching the chip to the carrier and connecting it with wires to get electrical access to it.
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**[[Specific Process Knowledge/Characterization/Profiler#Stylus_Profiler:_Dektak150|Stylus Profiler:Dektak150]]
**[[Specific Process Knowledge/Characterization/Profiler#Stylus_Profiler:_Dektak150|Stylus Profiler:Dektak150]]
* Chip/die mounting
* Chip/die mounting
**[[/Die Bonder|Die Bonder (eutectic metal)]]
**[[/Die Bonder|Die Bonder (eutectic metal)]] [[Image:section under construction.jpg|70px]] '''Will be temporary taken out of service during the PolyFabLab construction.'''
*Wire bonding
*Wire bonding
**[[/Wire Bonder|TPT Wire Bonder]]
**[[/Wire Bonder|TPT Wire Bonder]] [[Image:section under construction.jpg|70px]] '''Will be temporary taken out of service during the PolyFabLab construction.'''
**[[/Wire Bonder#Ball Wire Bonder K&S 4524|Ball Wire Bonder]]
**[[/Wire Bonder#Ball Wire Bonder K&S 4524|Ball Wire Bonder]]
*Wafer dicing/machining
*Wafer dicing/machining
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**[[/Focal Spot X-ray system|X-ray Focal Spot inspection system]]
**[[/Focal Spot X-ray system|X-ray Focal Spot inspection system]]
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*Pick & place
**[[/Micro transfer printer|Micro transfer printer]]


== Choose processing method ==
== Choose processing method ==
{| {{table}}
{| {{table}}
| align="left" valign="top" style="background:LightGray"|''' Lapping/polishing'''
| align="left" valign="top" style="background:LightGray"|''' Lapping/polishing'''
| align="left" valign="top"  style="background:LightGray"|''' Cutting'''
| align="left" valign="top"  style="background:LightGray"|''' Cutting/cleaving'''
| align="left" valign="top" style="background:#DCDCDC;"|''' Milling'''
| align="left" valign="top" style="background:#DCDCDC;"|''' Milling'''
| align="left" valign="top" style="background:LightGray"|''' Die bonding'''
| align="left" valign="top" style="background:LightGray"|''' Die bonding'''
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|style="background: LightGray"|
*[[/Die Bonder|Die Bonder (eutectic metal)]]
*[[/Die Bonder|Die Bonder (eutectic metal)]]
*[[/Die Bonder#Flip-chip bonder (glue attachment)|Flip-chip Bonder (glue)]]
<!-- *[[/Die Bonder#Flip-chip bonder (glue attachment)|Flip-chip Bonder (glue)]] -->
|style="background: LightGray"|
|style="background: LightGray"|
*[[/Wire Bonder|TPT Wire Bonder]]
*[[/Wire Bonder|TPT Wire Bonder]]

Latest revision as of 11:43, 8 September 2023

Feedback to this page: click here

Unless anything else is stated, everything on this page, text and pictures are made by DTU Nanolab.

Back-end (or Post-fab) Processing are typical processes used to finish up your wafer/chip. This includes thinning and cutting out the wafer in chips that can be put on a carrier, a board or in a package, attaching the chip to the carrier and connecting it with wires to get electrical access to it.

These processes are usually carried out a number of different places. We also have a laboratory called PackLab located in building 347 1st floor. It is a class 1000 cleanroom and in here we have equipment commonly used for back-end processing. Some equipment is further placed in the basement of building 346 and some on the 1st floor in building 346.

Note! Packlab will be closed from February/March 2023 to Q2 2024 due to the construction of our new PolyFabLab.
Some of the tools will find new temporary locations in building 346 or building 451. Please ask our staff for more information.


Below you can see a list of equipment for back-end processing that is available at DTU Nanolab.

Choose an equipment

Choose processing method

Lapping/polishing Cutting/cleaving Milling Die bonding Wire bonding
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