Specific Process Knowledge: Difference between revisions

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<center><span style="background:Yellow">2nd Level - Process Topic</span></center>
'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge click here]'''
'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Etch/RIE_(Reactive_Ion_Etch) click here]'''




=== Choose the process topic you are interested in ===
=== Choose the process topic you are interested in: ===
*[[/Pattern Design|Pattern Design and Mask Fabrication]]


*[[/Back-end processing|Back-end processing]]
*[[/Back-end processing|Back-end processing]]
*[[/Bonding|Bonding]]


*[[/Characterization|Characterization]]
*[[/Characterization|Characterization]]
*[[/Direct Structure Definition|Direct Structure Definition]]
*[[/Doping|Doping]]


*[[/Etch|Etch]]
*[[/Etch|Etch]]
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*[[/Lithography|Lithography]]
*[[/Lithography|Lithography]]
<!--
*[[/Photolithography|Photolithography]]
-->


*[[/Thermal Process|Thermal Process]]
*[[/Thermal Process|Thermal Process]]
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*[[/Wafer and sample drying|Wafer and sample drying]]
*[[/Wafer and sample drying|Wafer and sample drying]]
*[[/Bonding|Wafer Bonding]]


*[[/Wafer cleaning|Wafer Cleaning]]
*[[/Wafer cleaning|Wafer Cleaning]]
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*[[/Wafer Information|Wafer Information]]
*[[/Wafer Information|Wafer Information]]


*[[/III-V Process|III-V Process]]
*[[/Overview of Fume Hoods|Overview of Fume Hoods]]
 
===The section below here is under construction [[Image:section under construction.jpg|70px]] ===
 
==Overview of sample processing==
{| class="wikitable collapsible" border="1" cellspacing="1" cellpadding="2"  align="left"
! Clean the sample [[File:cleaning.jpg|50px]]
|}
{| class="wikitable collapsible" border="1" cellspacing="1" cellpadding="2"  align="left"
! Drying Samples [[File:drying.jpg|50px]]
|}
 
{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
! Make a layer on the sample or Film Formation [[File:Making a layer 1.jpg|40px]]
|-
|Thermal Oxide growth
|
|-
|Physical Vapour Deposition
|
|-
|
|Sputter deposition
|-
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|Thermal deposition
|-
|
|E-beam evaporation
|-
|CVD
|
|-
|
|LPCVD
|-
|
|PECVD
|-
|Coating
|
|-
|
|Spin coating
|-
|
|Spray coating
|-
|Electroplating
|
|-
|Epitaxial growth
|
|-
|}
 
{| class="wikitable collapsible" border="1" cellspacing="1" cellpadding="2"  align="left"
! Thermal treatment of the sample [[File:Thermal treatment 1.jpg|50px]]
|}
{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
! Make a mask on the sample [[File:Making a mask 1.jpg|40px]]
|-
|Lithography
|-
|Imprinting
|-
|}
{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
! Transfer pattern into the sample
|-
|Wet etch
|-
|Dry etch
|-
|Lift-off
|-
|}
{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
! Direct structure definition
|-
|Imprinting
|-
|LASER machining
|-
|Lithographic definition
|-
|Polymer Injection molding
|-
|}
{| class="wikitable collapsible" border="1" cellspacing="1" cellpadding="2"  align="left"
! Bonding samples together
|}
{| class="wikitable collapsible" border="1" cellspacing="1" cellpadding="2"  align="left"
! Characterize the sample
|}
{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
! Back end of the sample
|-
|Chip/die mounting
|-
|Wire bonding
|-
|Dicing
|-
|}
 
==Overview of sample processing 2==
{| {{Table}}
|- valign="top"
 
|
{| class="wikitable collapsible" border="1" cellspacing="1" cellpadding="2"  align="left"
! [[image:cleaning.jpg|thumb|150px|Clean the sample]]
|}
|
{| class="wikitable collapsible" border="1" cellspacing="1" cellpadding="2"  align="left"
! [[image:drying.jpg|thumb|150px|Drying Samples ]]
|}
|
{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
! [[image:Making a layer 1.jpg|thumb|140px|Film Formation ]]
|-
|Thermal Oxide growth
|
|-
|Thin Film deposition
|
|-
|
|Sputter deposition
|-
|
|Thermal deposition
|-
|
|E-beam evaporation
|-
|CVD
|
|-
|
|LPCVD
|-
|
|PECVD
|-
|Coating
|
|-
|
|Spin coating
|-
|
|Spray coating
|-
|Electroplating
|
|-
|Epitaxial growth
|
|-
|}
|
{| class="wikitable collapsible" border="1" cellspacing="1" cellpadding="2"  align="left"
! [[image:Thermal treatment 1.jpg|thumb|150px|Thermal treatment of the sample ]]
|}
|-
|
{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
! [[image:Making a mask 1.jpg|thumb|140px|Make a mask on the sample ]]
|-
|Lithography
|-
|Imprinting
|-
|}
|
{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
! Transfer pattern into the sample
|-
|Wet etch
|-
|Dry etch
|-
|Lift-off
|-
|}
|
{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
! Direct structure definition
|-
|Imprinting
|-
|LASER machining
|-
|Lithographic definition
|-
|Polymer Injection molding
|-
|}
|
{| class="wikitable collapsible" border="1" cellspacing="1" cellpadding="2"  align="left"
! Bonding samples together
|}
|-
|
{| class="wikitable collapsible" border="1" cellspacing="1" cellpadding="2"  align="left"
! Characterize the sample
|}
|
{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
! Back end of the sample
|-
|Chip/die mounting
|-
|Wire bonding
|-
|Dicing
|-
|}
|
|
|-
|}
 
==Overview of sample processing 3==
{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
! [[image:Clean your sample.png|thumb|150px|Clean your sample]]
|-
!Entry page in LabAdviser
!Techniques
!Materials
|-
|[[Specific Process Knowledge/Wafer cleaning|Wafer cleaning]]
|Soap Sonic
|Removes dust and particles
|-
|
|7-up & Piranha
|Removes organics and alkali ions
|-
|
|RCA
|Two step process to remove organics and metals
|-
|
|5% HF
|Removes native oxide
|-
|
|IMEC
|Removing dust, organics and alkali ions and slightly polish the surface.
Make the surface hydrophillic
|-
|}
{| class="wikitable collapsible" border="1" cellspacing="1" cellpadding="2"  align="left"
! [[image:Dry your sample.png|thumb|150px|Dry your sample]]
|-
!Entry page in LabAdviser
!Techniques
!Materials
|-
|[[Specific Process Knowledge/Wafer and sample drying|Wafer and sample drying]]
|
|
|-
|
|
|
|-
|
|
|
|-
|
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|-
|}


{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
*[[/Cleanroom Chemicals|List of chemicals available in the cleanroom]]
! [[image:Create a film on your sample.png|thumb|150px|Create a layer/film on your sample]]
|-
!Entry page in LabAdviser
!Techniques
!Materials
|-
|[[Specific Process Knowledge/Thermal Process/Oxidation| Thermal Process/Oxidation]]
|Thermal oxidation
|Thermal SiO2
|-
|[[Specific Process Knowledge/Thin film deposition| Thin film deposition]]
|
|
|-
|
|Sputter deposition
|Si,SiO2,Si3N3,TiO2, metals
|-
|
|Thermal evaporation
|Al, ?
|-
|
|E-beam evaporation
|Metals
|-
|
|LPCVD
|Si3N4, SRN, SiO2, Si (poly and amorph)
|-
|
|PECVD
|Si3N4, SiO2, PBSG
|-
|
|Electroplating
|Ni
|-
|[[Specific Process Knowledge/Lithography/Coaters|Lithography/Coaters]]
|
|
|-
|
|Spin coating
|resists, polymers
|-
|
|Spray coating
|resists, polymers
|-
|Epitaxial growth
|MOCVD
|?
|-
|}
{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
! [[image:Dope your sample.png|thumb|150px|Dope your sample]]
|-
|-
!Entry page in LabAdviser
!Techniques
!Materials
|-
|[[Specific Process Knowledge/Thin film deposition/PECVD| Thin film deposition/PECVD]]
|PECVD
|Deposition of SiO2 or Si3N4 doped with P,B and Ge
|-
|[[Specific Process Knowledge/Thin film deposition/Furnace LPCVD PolySilicon|Thin film deposition/Furnace LPCVD PolySilicon]]
|LPCVD
|Deposition of PolySi doped with B or P
|-
|[[Specific Process Knowledge/Thermal Process/Dope with Boron|Thermal Process/Dope with Boron]]
|Predeposition and drive-in
|Doping Silicon wafers with boron
|-
|[[Specific Process Knowledge/Thermal Process/Dope with Phosphorus|Thermal Process/Dope with Phosphorus]]
|Predeposition and drive-in
|Doping Silicon wafers with phosphorus


|-
|Ionimplant
|
|?
|-
|}


{| class="wikitable collapsible" border="1" cellspacing="1" cellpadding="2"  align="left"
<!-- <HTML5video width="520" height="320" autoplay="true" loop="true">bunny</HTML5video> -->
! [[image:Thermal treat your sample.png|thumb|150px|Thermal treatment of your sample]]
|-
!Entry page in LabAdviser
!Techniques
!Materials
|-
|
|
|
|-
|
|
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|-
|
|
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|-
|
|
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|-
|}
{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
! [[image:Make a mask on your sample.png|thumb|150px|Make a mask on your sample]]
|-
!Entry page in LabAdviser
!Techniques
|-
|[[Specific Process Knowledge/Lithography| Lithography]]
|
|-
|
|Photolithography
|-
|
|Deep UV lithography
|-
|
|E-beam lithography
|-
|
|Imprinting
|-
|}
{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
! [[image:Transfer mask pattrn to your sample.png|thumb|150px|Transfer mask pattern to your sample]]
|-
!Entry page in LabAdviser
!Techniques
!Materials
|-
|[[Specific Process Knowledge/Etch| Etch]]
|
|
|-
|
|Wet etch
|Si,Glass,SiO2,Si3N4,Al,Cr,Ti,Au,Pt,InP,InGaAsP,GaAs/AlGaAs
|-
|
|Dry etch
|Any material
|-
|[[Specific Process Knowledge/Lithography/LiftOff| Lift-off]]
|
|?
|-
|}
{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
! [[image:Transfer mask pattrn to your sample.png|thumb|150px|Define your structure directly to your sample]]
|-
|Imprinting
|-
|LASER machining
|-
|Lithographic definition
|-
|Polymer Injection molding
|-
|}
{| class="wikitable collapsible" border="1" cellspacing="1" cellpadding="2" align="left"
! [[image:Bond your samples together.png|thumb|150px|Bond your samples together]]
|-
!Entry page in LabAdviser
!Techniques
!Materials
|-
|
|
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|-
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|-
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|-
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|-
|}
{| class="wikitable collapsible" border="1" cellspacing="1" cellpadding="2"  align="left"
! [[image:Characterize your sample.png|thumb|150px|Characterize your sample]]
|-
!Entry page in LabAdviser
!Techniques
!Materials
|-
|
|
|
|-
|
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|-
|
|
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|-
|
|
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|-
|}
{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
! [[image:Pack your sample (back-end).png|thumb|150px|Pack your sample (back-end)]]
|-
|Chip/die mounting
|-
|Wire bonding
|-
|Dicing
|-
|}

Latest revision as of 14:05, 28 June 2023

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Choose the process topic you are interested in:


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