Specific Process Knowledge: Difference between revisions

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<center><span style="background:Yellow">2nd Level - Process Topic</span></center>
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=== Choose the process topic you are interested in ===
=== Choose the process topic you are interested in: ===
*[[/Pattern Design|Pattern Design and Mask Fabrication]]


*[[/Back-end processing|Back-end processing]]
*[[/Back-end processing|Back-end processing]]
*[[/Bonding|Bonding]]


*[[/Characterization|Characterization]]
*[[/Characterization|Characterization]]


*[[/E-beam lithography|E-beam lithography]]
*[[/Direct Structure Definition|Direct Structure Definition]]
 
*[[/Doping|Doping]]


*[[/Etch|Etch]]
*[[/Etch|Etch]]
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*[[/Lithography|Lithography]]
*[[/Lithography|Lithography]]
<!--
*[[/Photolithography|Photolithography]]
-->


*[[/Thermal Process|Thermal Process]]
*[[/Thermal Process|Thermal Process]]
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*[[/Wafer and sample drying|Wafer and sample drying]]
*[[/Wafer and sample drying|Wafer and sample drying]]
*[[/Bonding|Wafer Bonding]]


*[[/Wafer cleaning|Wafer Cleaning]]
*[[/Wafer cleaning|Wafer Cleaning]]
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*[[/Wafer Information|Wafer Information]]
*[[/Wafer Information|Wafer Information]]


*[[/III-V Process|III-V Process]]
*[[/Overview of Fume Hoods|Overview of Fume Hoods]]


===This section is under construction [[Image:section under construction.jpg|70px]] ===
*[[/Cleanroom Chemicals|List of chemicals available in the cleanroom]]
Sample processing:
{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
!Clean the sample
|}
{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
!Drying Samples
|}


{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
!Make a layer on the sample
!
!
|-
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|Thermal Oxide growth
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|-
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|Thin Film deposition
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|-
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|Sputter deposition
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|Thermal deposition
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|E-beam evaporation
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|CVD
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|-
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|LPCVD
|-
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|PECVD
|-
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|Coating
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|-
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|Spin coating
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|Spray coating
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|Electroplating
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|-
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|Epitaxial growth
|-
|}


{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
<!-- <HTML5video width="520" height="320" autoplay="true" loop="true">bunny</HTML5video> -->
!Thermal treatment of the sample
|}
{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
!Make a mask on the sample
|}
**Lithography
**Imprinting
{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
!Transfer pattern into the sample
|}
**Wet etch
**Dry etch
**Lift-off
{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
!Direct structure definition
|}
**Imprinting
**LASER machining
**Lithographic definition
**Polymer Injection molding
{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left"
!Bonding samples together
|}
{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
!Characterize the sample
|}
{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
!Back end of the sample
|}
**Chip/die mounting
**Wire bonding
**Dicing

Latest revision as of 14:05, 28 June 2023

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