Specific Process Knowledge/Etch/DRIE-Pegasus/picoscope: Difference between revisions

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[[Category: Equipment |Etch DRIE]]
[[Category: Equipment |Etch DRIE]]
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= Process optimization using the Picoscope =
= Process optimization using the Picoscope =



Revision as of 13:23, 17 March 2020

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Process optimization using the Picoscope

The original standard recipes on Pegasus 1 differ in many ways. The second step of one of them is listed below:

Process A Step 2 parameters
Parameter Etch Dep
Gas flow (sccm) SF6 350 (1.5 s), 550 C4F8 200
Cycle time (secs) 7.0 4.0
Pressure (mtorr) 25 (1.5 s), 150 25
Coil power (W) 2800 2000
Platen power (W) 140 (1.5) 45 0
Common Temperature 20 degs

When running any recipe on theSPTS Pro software Using the SPTS Pro soft


4 cycles of the recipe PrD4 recorded with the Picoscope
4 cycles of the recipe PrD4 recorded with the SPTS software
4 cycles of the recipe Prcocess A recorded with the Picoscope
4 cycles of the recipe PrD4 recorded with the SPTS software