Specific Process Knowledge/Thin film deposition/thermalevaporator: Difference between revisions
| Line 12: | Line 12: | ||
It is not only usable for Al deposition. The thermal evaporator has room for two evaporation sources and thereby the possibility to make thin films of two different metals. At the moment not that many metals have been tested, so right now only Al and Ag can be evaporated. We have attempted to evaporate Au and Zn but these are not standard processes. If you would like to deposit these or other metals, please talk to the Thin Film group. | It is not only usable for Al deposition. The thermal evaporator has room for two evaporation sources and thereby the possibility to make thin films of two different metals. At the moment not that many metals have been tested, so right now only Al and Ag can be evaporated. We have attempted to evaporate Au and Zn but these are not standard processes. If you would like to deposit these or other metals, please talk to the Thin Film group. | ||
Compared to the Wordentec, the thermal evaporator is quicker to use if you only need to deposit on one wafer or on small samples, as it only takes about 15 minutes to pump down the chamber. You can also deposit thicker layers because the throw distance from source to sample is shorter, so the material use is more efficient: In the thermal evaporator, you get about 40-50 nm per metal pellet, whereas in the Wordentec you get about 15 nm per pellet. | Compared to the Wordentec, the thermal evaporator is quicker to use if you only need to deposit on one wafer or on small samples, as it only takes about 15 minutes to pump down the chamber. You can also deposit thicker layers because the throw distance from source to sample is shorter, so the material use is more efficient: In the thermal evaporator, you get about 40-50 nm per metal pellet, whereas in the Wordentec you get about 15 nm per pellet. However, the thickness uniformity is somewhat better in the Wordentec also because of the longer distance from source to sample. | ||
Revision as of 12:04, 31 October 2018
Feedback to this page: click here
Thermal evaporator- A system for deposition of metals
The main purpose of the thermal evaporator is to deposit Al for removing charging of the resist when doing EBL on isolating substrate.
It is not only usable for Al deposition. The thermal evaporator has room for two evaporation sources and thereby the possibility to make thin films of two different metals. At the moment not that many metals have been tested, so right now only Al and Ag can be evaporated. We have attempted to evaporate Au and Zn but these are not standard processes. If you would like to deposit these or other metals, please talk to the Thin Film group.
Compared to the Wordentec, the thermal evaporator is quicker to use if you only need to deposit on one wafer or on small samples, as it only takes about 15 minutes to pump down the chamber. You can also deposit thicker layers because the throw distance from source to sample is shorter, so the material use is more efficient: In the thermal evaporator, you get about 40-50 nm per metal pellet, whereas in the Wordentec you get about 15 nm per pellet. However, the thickness uniformity is somewhat better in the Wordentec also because of the longer distance from source to sample.
The user manual, APV, technical information and contact information can be found in LabManager:
Thermal Evaporator in LabManager
Process information
Materials for thermal evaporation
| Purpose | Deposition of metals |
|
|---|---|---|
| Performance | Film thickness |
|
| Deposition rate |
| |
| Thickness uniformity |
| |
| Pumpdown time |
| |
| Process parameter range | Process Temperature |
|
| Process pressure |
| |
| Substrates | Batch size |
|
| Substrate material allowed |
| |
| Material allowed on the substrate |
|