Specific Process Knowledge/Characterization/XRD: Difference between revisions
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!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment | !colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment | ||
|style="background:WhiteSmoke; color:black"|<b>Equipment 1</b> | |style="background:WhiteSmoke; color:black"|<b>Equipment 1</b> | ||
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!style="background:silver; color:black;" align="center" width="60"|Purpose | !style="background:silver; color:black;" align="center" width="60"|Purpose | ||
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*Purpose 2 | *Purpose 2 | ||
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!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Performance | !style="background:silver; color:black" align="center" valign="center" rowspan="2"|Performance | ||
|style="background:LightGrey; color:black"|Response 1 | |style="background:LightGrey; color:black"| | ||
Response 1 | |||
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*Performance range 1 | *Performance range 1 | ||
*Performance range 2 | *Performance range 2 | ||
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|style="background:LightGrey; color:black"|Response 2 | |style="background:LightGrey; color:black"| | ||
Response 2 | |||
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*Performance range | *Performance range | ||
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!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameter range | !style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameter range | ||
|style="background:LightGrey; color:black"|Parameter 1 | |style="background:LightGrey; color:black"|Parameter 1 | ||
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*Range | *Range | ||
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|style="background:LightGrey; color:black"|Parameter 2 | |style="background:LightGrey; color:black"|Parameter 2 | ||
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*<nowiki>#</nowiki> 100 mm wafers | *<nowiki>#</nowiki> 100 mm wafers | ||
*<nowiki>#</nowiki> 150 mm wafers | *<nowiki>#</nowiki> 150 mm wafers | ||
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| style="background:LightGrey; color:black"|Allowed materials | | style="background:LightGrey; color:black"|Allowed materials | ||
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*Allowed material 1 | *Allowed material 1 | ||
*Allowed material 2 | *Allowed material 2 | ||
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Revision as of 13:46, 9 July 2018
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XRD SmartLab
The Rigaku SmartLab is an advanced XRD for measuring on thin films. All thin films can be measured without fixating the sample, as the system has a so called In-Plane arm.
File:Cluster1.jpg
Image(s) of the equipment(s)
The user manual(s), user APV(s), technical information, and contact information can be found in LabManager:
Process information
Link to process pages - e.g. one page for each material
Example:
- Etch of silicon using RIE
- Etch of silicon oxide using RIE
- Etch of silicon nitride using RIE
- Etch of photo resist using RIE
| Equipment | Equipment 1 | |
|---|---|---|
| Purpose |
| |
| Performance |
Response 1 |
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Response 2 |
| |
| Process parameter range | Parameter 1 |
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| Parameter 2 |
| |
| Substrates | Batch size |
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| Allowed materials |
| |