View source for Sputtering of Ti in Wordentec

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== Deposition rate ==

The deposition rate will change with the settings for pressure and power.  


'''Pressure 1*10<sup>-2</sup> mbar, Power 300 W'''

The rate in the [[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]] is established to be 1.7 Å/s (in the centre of the wafer, 1.3 Å/s at the edge) (data from before 2018).