Specific Process Knowledge/Thin film deposition/Gadolinium Cerium Oxide/Gadolinium Cerium Oxide in Cluster Lesker PC1

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Revision as of 18:47, 7 February 2024 by Eves (talk | contribs) (Created page with "<i>This page is written by <b>Evgeniy Shkondin @DTU Nanolab</b> if nothing else is stated. <br> All images and photos on this page belongs to <b>DTU Nanolab</b>.<br> The fabrication and characterization described below were conducted in <b>2023</b> by <b>Patama Pholprasit</b> and <b>Evgeniy Shkondin, DTU Nanolab</b>.<br></i> =Sputtering of Gd<sub>0.2</sub>Ce<sub>0.8</sub>O<sub>2</sub> in Cluster Lesker (PC1)= This page describes <b>RF sputtering</b> method of Gadoliniu...")
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This page is written by Evgeniy Shkondin @DTU Nanolab if nothing else is stated.
All images and photos on this page belongs to DTU Nanolab.
The fabrication and characterization described below were conducted in 2023 by Patama Pholprasit and Evgeniy Shkondin, DTU Nanolab.

Sputtering of Gd0.2Ce0.8O2 in Cluster Lesker (PC1)

This page describes RF sputtering method of Gadolinium Cerium Oxide (Gd0.2Ce0.8O2) in Sputter-System Metal-Oxide(PC1) (Cluster Lesker).

Gadolinium-doped ceria (GDC) also known as gadolinia-doped ceria, gadolinium-doped cerium oxide (GCO) or cerium-gadolinium oxide (CGO), formula Gd0.2Ce0.8O2 is a ceramic electrolyte used in solid oxide fuel cells (SOFCs). It is an alternative to yttrium stabilized zirconium oxide. Material can be sputtered in our Cluster Lesker system. The results can vary depends on the applied method. Here we tested a 4 different cases: with and without additional oxygen, and with and without heating to 200°C. Since gadolinium-doped cerium oxide (GCO) is a ceramic material bonded to Cu backing plate a gentle ramp-up/down procedure needs to be implemented (max 0.3W/s). The applied power was 120W and pressure: 3 mTorr. Deposition time: 1800s


The 4 recipes are presented in 4 different cases:

  • case1: No oxygen was added to the chamber at room temperature.
  • case2: Small amount of oxygen added to the chamber at room temperature.
  • case3: No oxygen was added to the chamber at 200 °C temperature.
  • case4: Small amount of oxygen added to the chamber at 200 °C temperature.

More precise descriptions of recipes are presented in the following table below:

Recipe

Parameters Case 1 Case 2 Case 3 Case 4
mode Upstream Downstream Upstream Downstream
pressure (mTorr) 3 3 3 3
Power (W) 120 120 120 120
Ar flow (sccm) - 50 - 50
O2 flow (sccm) - 2 - 2
Temperature °C 25 25 200 200


Uniformity across 150 mm wafer

Results have been obtained for <100> 150 mm Si wafers with native oxide, based on ellipsometry study.

Case Temperature (°C) Added oxygen (sccm) Average thickness (nm) Minimum thickness (nm) Maximum thickness (nm) Standard deviation Uniformity (%) Deposition rate (nm/s)
case 1 RT - 45.53 43.97 47.80 1.1418 4.2075 0.025
case 2 RT 2 29.80 29.21 30.58 0.4722 2.3017 0.016
case 3 200 - 30.59 29.69 31.67 0.6150 3.2266 0.017
case 4 200 2 28.02 27.67 28.37 0.2436 1.2424 0.015


Optical functions

Results have been obtained for <100> 150 mm Si wafers with native oxide, based on ellipsometry study. Sellmeier model has been implemented for refractive index fitting.