Specific Process Knowledge/Etch/Etching of Titanium: Difference between revisions

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|'''Batch size'''
|'''Batch size'''
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1-25 wafers at a time
1-5 4" in beaker
1-25 wafers at a time in PP-etch bath
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1-25 wafer at a time
1-5 4" wafer at a time
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|'''Size of substrate'''
|'''Etch bath'''
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|Beaker or PP-etch bath in the fume hood in cleanroom 2.
4" wafers
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4" wafers
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|'''Allowed materials'''
|'''Allowed materials'''
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No restrictions when used in beaker or PP-etch bath in the fume hood in cleanroom 2.  
No restrictions when used in beaker or PP-etch bath in the fume hood in cleanroom 2.  
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*Aluminium
No restrictions when used in beaker.
*Silicon
*Silicon Oxide
*Silicon Nitride
*Silicon Oxynitride
*Photoresist
*E-beam resist
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Revision as of 11:20, 11 February 2008

Etching of Titanium

Etching of Titanium is done wet at Danchip. We have two solutions for titanium etching:

  1. BHF
  2. Cold RCA1 (as stripper)

Do it by making your own set up in a beaker in a fume hood - preferably in cleanroom 2 or 4. BHF etching can also take place in the PP-etch bath in the fume hood in cleanroom 2.


Comparing the two solutions

BHF Cold RCA1
General description

Etch of titanium with or without photoresist mask.

Etch of titanium (as stripper)

Chemical solution HF:NHF NH3OH:H2O2:H2O - 1:1:5
Process temperature Room temperature Room temperature
Possible masking materials

Photoresist (1.5 µm AZ5214E)

None
Etch rate

Not known (it bubbles while etching)

Not known

Batch size

1-5 4" in beaker 1-25 wafers at a time in PP-etch bath

1-5 4" wafer at a time

Etch bath Beaker or PP-etch bath in the fume hood in cleanroom 2.
Allowed materials

No restrictions when used in beaker or PP-etch bath in the fume hood in cleanroom 2.

No restrictions when used in beaker.