Specific Process Knowledge/Etch/Etching of Titanium

Etching of Titanium

Etching of Titanium is done wet at Danchip making your own set up in a beaker in a fume hood - preferably in cleanroom 2 or 4 or in the PP-etch bath in the fume hood in cleanroom 2. We have ?:

1. BHF
2. Cold RCA1 (as stripper)

Comparing the two solutions

	BHF	Cold RCA1
General description	Etch of titanium with or without photoresist mask.	Etch of titanium (as stripper)
Chemical solution	HF:NH$_{4}$F	NH3OH:H2O2:H2O - 1:1:5
Process temperature	Room temperature	Room temperature
Possible masking materials	Photoresist (1.5 µm AZ5214E)	None
Etch rate	Not known (it bubbles while etching)	Not known
Batch size	1-25 wafers at a time	1-25 wafer at a time
Size of substrate	4" wafers	4" wafers
Allowed materials	No restrictions when used in beaker or PP-etch bath in the fume hood in cleanroom 2.	Aluminium Silicon Silicon Oxide Silicon Nitride Silicon Oxynitride Photoresist E-beam resist