Specific Process Knowledge/Etch/Etching of Titanium: Difference between revisions

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==Etching of Titanium==
==Etching of Titanium==
Etching of Titatium is done wet at Danchip. We have ?:
Etching of Titatium is done wet at Danchip making your own set up in a beaker in a fumehood - preferably in cleanroom 2 or 4 or in the PP-etch bath in the fumehood in cleanroom 2. We have ?:


# Standard BHF
# BHF  
# ?
#  




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{| border="1" cellspacing="0" cellpadding="4" align="left"
{| border="1" cellspacing="0" cellpadding="4" align="left"
!  
!  
! Aluminium Etch 1
! BHF
! Aluminium Etch 2
!  
|-  
|-  
|General description
|General description
|
|
Etch of pure aluminium
Etch of titanium with or without photoresist mask.
|
|
Etch of aluminium + 1.5% Si
Etch of
|-
|-
|Chemical solution
|Chemical solution
|H<math>_2</math>O:H<math>_3</math>PO<math>_4</math>  1:2
|HF:NH<math>_4</math>F  
|PES 77-19-04
|.
|-
|-
|Process temperature
|Process temperature
|50 <sup>o</sup>C
|Room temperature


|20 <sup>o</sup>C
|


|-
|-
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Photoresist (1.5 µm AZ5214E)
Photoresist (1.5 µm AZ5214E)
|
|
Photoresist (1.5 µm AZ5214E)
.
|-
|-
|Etch rate
|Etch rate
|
|
~100 nm/min (Pure Al)
?
|
|
~60(??) nm/min
?
|-
|-
|Batch size
|Batch size
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|Allowed materials
|Allowed materials
|
|
*Aluminium
No restrictions when used in beaker or PP-etch bath in the fumehood in cleanroom 2.
*Silicon
*Silicon Oxide
*Silicon Nitride
*Silicon Oxynitride
*Photoresist
*E-beam resist
|
|
*Aluminium
*Aluminium

Revision as of 10:53, 31 January 2008

Etching of Titanium

Etching of Titatium is done wet at Danchip making your own set up in a beaker in a fumehood - preferably in cleanroom 2 or 4 or in the PP-etch bath in the fumehood in cleanroom 2. We have ?:

  1. BHF


Comparing the two solutions

BHF
General description

Etch of titanium with or without photoresist mask.

Etch of

Chemical solution HF:NHF .
Process temperature Room temperature
Possible masking materials:

Photoresist (1.5 µm AZ5214E)

.

Etch rate

?

?

Batch size

1-25 wafers at a time

1-25 wafer at a time

Size of substrate

4" wafers

4" wafers

Allowed materials

No restrictions when used in beaker or PP-etch bath in the fumehood in cleanroom 2.

  • Aluminium
  • Silicon
  • Silicon Oxide
  • Silicon Nitride
  • Silicon Oxynitride
  • Photoresist
  • E-beam resist