Specific Process Knowledge/Etch/Etching of Silicon Oxide/SiO2 etch using ASE/tests CHF3+H2: Difference between revisions
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|<!--'''Process time'''--> 5:00 | |<!--'''Process time'''--> 5:00 | ||
|<!--'''Date'''--> 29/02<br>-2024 | |<!--'''Date'''--> 29/02<br>-2024 | ||
|<!--'''SEM picture'''--> [[File:Si3N4-pat2-chf3t2-250.png| | |<!--'''SEM picture'''--> [[File:Si3N4-pat2-chf3t2-250.png|170px]] [[File:Si3N4-pat2-chf3t2-500.png|170px]] [[File:Si3N4-pat2-chf3t2-1000.png|170px]] [[File:Si3N4-pat2-chf3t2-2000.png|170px]] | ||
|<!--'''Redeposition - top view'''--> [[File:SiN chf3.t2 sidewalls 01.png| | |<!--'''Redeposition - top view'''--> [[File:SiN chf3.t2 sidewalls 01.png|170px]] [[File:SiN chf3.t2 sidewalls 02.png|170px]] | ||
|<!--'''Etch rate in SiO2'''--> 250nm- 28,12 <br> <br> 500nm- 41,86 <br> <br> 1000nm- 66 <br> <br> 2000nm- 63,62 | |<!--'''Etch rate in SiO2'''--> 250nm- 28,12 <br> <br> 500nm- 41,86 <br> <br> 1000nm- 66 <br> <br> 2000nm- 63,62 | ||
|<!--'''Etch rate in resist'''--> 250nm- 23,26 <br> <br> 500nm- 22,60 <br> <br> 1000nm- 16,74 <br> <br> 2000nm- 15,34 | |<!--'''Etch rate in resist'''--> 250nm- 23,26 <br> <br> 500nm- 22,60 <br> <br> 1000nm- 16,74 <br> <br> 2000nm- 15,34 | ||
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|<!--'''Process time'''--> 5:00 | |<!--'''Process time'''--> 5:00 | ||
|<!--'''Date'''--> 29/02<br>-2024 | |<!--'''Date'''--> 29/02<br>-2024 | ||
|<!--'''SEM picture'''--> [[File:Si3N4 pat3 cf4lowcp- 250.png| | |<!--'''SEM picture'''--> [[File:Si3N4 pat3 cf4lowcp- 250.png|170px]] [[File:Si3N4 pat3 cf4lowcp- 500.png|170px]] [[File:Si3N4 pat3 cf4lowcp- 1000.png|170px]] [[File:Si3N4 pat3 cf4lowcp- 2000.png|170px]] | ||
|<!--'''Redeposition - top view'''--> [[File:SiN cf4lowcp sidewalls 01.png| | |<!--'''Redeposition - top view'''--> [[File:SiN cf4lowcp sidewalls 01.png|170px]] [[File:SiN cf4lowcp sidewalls 02.png|170px]] | ||
|<!--'''Etch rate in SiO2'''--> 250nm- 76,50 <br> <br> 500nm- 73,92 <br> <br> 1000nm- 73,94 <br> <br> 2000nm- 76,50 | |<!--'''Etch rate in SiO2'''--> 250nm- 76,50 <br> <br> 500nm- 73,92 <br> <br> 1000nm- 73,94 <br> <br> 2000nm- 76,50 | ||
|<!--'''Etch rate in resist'''--> 250nm- 44,98 <br> <br> 500nm- 33,52 <br> <br> 1000nm- 31,16 <br> <br> 2000nm- 25,66 | |<!--'''Etch rate in resist'''--> 250nm- 44,98 <br> <br> 500nm- 33,52 <br> <br> 1000nm- 31,16 <br> <br> 2000nm- 25,66 |
Revision as of 11:58, 20 March 2024
Tests performed with UV resist:
The tests were performed on a 100mm wafer patterned on MLA3, with 2.2um AZ5214E resist.
Tests performed with DUV resist:
The resist used was a negative DUV resist (UVN) with 915nm + 88nm BARC layer.
TEST OF TABLES DESIGN (WORK ON GOING):
SiN tests