Specific Process Knowledge/Etch/Etching of Silicon Oxide/SiO2 etch using ASE: Revision history

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curprev 12:5112:51, 18 March 2024‎ Mfarin talk contribs‎ 16,765 bytes +88‎ →‎Recent results - CHF3/H2 and CF4/H2

curprev 16:2916:29, 5 March 2024‎ Mfarin talk contribs‎ 16,677 bytes −13‎ →‎CF4/H2 chemistry - SiO2/SiN etch

curprev 15:3315:33, 26 January 2024‎ Mfarin talk contribs‎ 11,750 bytes +2‎ →‎CHF3/H2 chemistry - SiO2/SiN etch
curprev 15:3315:33, 26 January 2024‎ Mfarin talk contribs‎ 11,748 bytes +20‎ →‎CHF3/H2 chemistry - SiO2/SiN etch
curprev 15:3215:32, 26 January 2024‎ Mfarin talk contribs‎ 11,728 bytes +14‎ →‎CF4/H2 chemistry - SiO2/SiN etch
curprev 15:3115:31, 26 January 2024‎ Mfarin talk contribs‎ 11,714 bytes −3,221‎ →‎Results of Si wafer with AZ5214E mask - April 2023

curprev 13:4713:47, 3 October 2023‎ Mfarin talk contribs‎ 12,316 bytes +88‎ →‎SiO2/SiN etch with CF4/H2 chemistry

curprev 10:3210:32, 6 September 2023‎ Mfarin talk contribs‎ 12,228 bytes +12‎ →‎SiO2/SiN etch with CF4/H2 chemistry

curprev 10:2410:24, 1 September 2023‎ Mfarin talk contribs‎ 12,216 bytes +4‎ →‎SiO2 etch with CF4/H2 chemistry

curprev 16:2116:21, 30 May 2023‎ Mfarin talk contribs‎ 9,910 bytes +1‎ →‎SiO2 etch with resist mask on wafer with clamping and He backside cooling
curprev 16:2116:21, 30 May 2023‎ Mfarin talk contribs‎ 9,909 bytes +69‎ →‎SiO2 etch with resist mask on wafer with clamping and He backside cooling
curprev 16:2016:20, 30 May 2023‎ Mfarin talk contribs‎ 9,840 bytes −48‎ →‎SiO2 etch with resist mask on wafer with clamping and He backside cooling

curprev 09:4309:43, 24 May 2023‎ Mfarin talk contribs‎ 9,888 bytes +5‎ No edit summary

curprev 14:1514:15, 15 May 2023‎ Mfarin talk contribs‎ 9,883 bytes +61‎ →‎SiO2 etch with resist mask on wafer with clamping and He backside cooling

curprev 13:0713:07, 3 February 2023‎ Bghe talk contribs‎ 9,578 bytes −15‎ →‎SiO2 etch with resist mask on wafer with clamping and He backside cooling
curprev 13:0713:07, 3 February 2023‎ Bghe talk contribs‎ 9,593 bytes +12‎ No edit summary

curprev 19:1519:15, 19 January 2023‎ Bghe talk contribs‎ 9,581 bytes 0‎ →‎Results for the DOE
curprev 19:1419:14, 19 January 2023‎ Bghe talk contribs‎ 9,581 bytes 0‎ →‎Results for the DOE
curprev 19:1319:13, 19 January 2023‎ Bghe talk contribs‎ 9,581 bytes 0‎ →‎Results for the DOE
curprev 19:1319:13, 19 January 2023‎ Bghe talk contribs‎ 9,581 bytes +139‎ →‎Results for the DOE

curprev 16:4416:44, 17 January 2023‎ Bghe talk contribs‎ 9,442 bytes +51‎ →‎Results for the DOE

curprev 10:1510:15, 31 July 2021‎ Bghe talk contribs‎ 9,331 bytes +39‎ →‎Results when etching a piece of wafer on a Si carrier
curprev 10:1310:13, 31 July 2021‎ Bghe talk contribs‎ 9,292 bytes +14‎ →‎SiO2 etch with resist mask on wafer with clamping and He backside cooling
curprev 10:1210:12, 31 July 2021‎ Bghe talk contribs‎ 9,278 bytes +98‎ →‎SiO2 etch with resist mask on wafer with clamping and He backside cooling

curprev 08:5008:50, 13 January 2020‎ Bghe talk contribs‎ 9,180 bytes +138‎ →‎SiO2 etch with resist mask, sample on carrier (Si and Al carrier) in the ICP mode using C4F8/H2/He chemistry

curprev 22:3522:35, 25 November 2019‎ Jmli talk contribs‎ 9,042 bytes 0‎ →‎SiO2 etch with resist mask, sample on carrier (Si carrier) in the RIE mode using CF4/CHF3/H2 chemistry
curprev 22:0322:03, 25 November 2019‎ Jmli talk contribs‎ 9,042 bytes 0‎ →‎SiO2 etch with resist mask on wafer with clamping and He backside cooling
curprev 22:0222:02, 25 November 2019‎ Jmli talk contribs‎ 9,042 bytes −3‎ No edit summary

curprev 11:3111:31, 20 August 2019‎ Bghe talk contribs‎ 9,045 bytes +374‎ →‎The recommended recipe for SiO2 etch using a carrier is this

curprev 14:0914:09, 1 March 2019‎ Bghe talk contribs‎ 8,671 bytes −7‎ →‎Results when etching a piece of wafer on a Si carrier
curprev 14:0914:09, 1 March 2019‎ Bghe talk contribs‎ 8,678 bytes +82‎ →‎Results when etching a piece of wafer on a Si carrier

curprev 17:1517:15, 18 January 2019‎ Bghe talk contribs‎ 8,596 bytes 0‎ →‎Results when etching a piece of wafer on a Si carrier
curprev 17:1517:15, 18 January 2019‎ Bghe talk contribs‎ 8,596 bytes +169‎ →‎Results when etching a piece of wafer on a Si carrier
curprev 17:1117:11, 18 January 2019‎ Bghe talk contribs‎ 8,427 bytes +125‎ →‎SiO2 etch with resist mask on wafer with clamping and He backside cooling

curprev 09:0509:05, 17 January 2019‎ Bghe talk contribs‎ 8,302 bytes 0‎ →‎Results when etching a piece of wafer on a Si carrier
curprev 09:0309:03, 17 January 2019‎ Bghe talk contribs‎ 8,302 bytes 0‎ →‎The recommended recipe for SiO2 etch using a carrier is this

curprev 11:2211:22, 16 January 2019‎ Bghe talk contribs‎ 8,302 bytes −2‎ →‎SiO2 etch with resist mask on wafer with clamping and He backside cooling

curprev 15:4815:48, 6 April 2018‎ Bghe talk contribs‎ 3,297 bytes +204‎ →‎SiO2 etch with resist mask, sample on carrier (Si carrier) in the RIE mode using CF4/CFH3/H2 chemistry
curprev 15:4615:46, 6 April 2018‎ Bghe talk contribs‎ 3,093 bytes +159‎ →‎Development work: SiO2 etch with resist mask, sample on carrier (Si carrier)
curprev 14:0114:01, 6 April 2018‎ Bghe talk contribs‎ 2,934 bytes +878‎ →‎Development work: SiO2 etch with resist mask, sample on carrier (Si carrier)

curprev 09:5809:58, 24 January 2018‎ Bghe talk contribs‎ 407 bytes 0‎ →‎THIS PAGE IS UNDER CONSTRUCTION200px
curprev 09:5809:58, 24 January 2018‎ Bghe talk contribs‎ 407 bytes +57‎ No edit summary

curprev 09:5309:53, 24 January 2018‎ Bghe talk contribs‎ 350 bytes +350‎ Created page with "'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Etc..."

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