Specific Process Knowledge/Back-end processing/Hot Embosser: Difference between revisions

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== Name of equipment ==
'''Unless anything else is stated, everything on this page, text and pictures are made by DTU Nanolab.'''


Write a short description of the equipment(s).
== Hot Embosser ==


[[image:Cluster1.jpg|200x200px|right|thumb|Image(s) of the equipment(s)]]
The Hot Embosser at DTU Nanolab is a hydraulic machine, a Collin Press P300 SV. It is located in the basement of building 346 (room 901). The device is typically made using variety of different polymer foils, as well as Graphene. A master pattern, called a shim, is usually fabricated in Si, but can also be fabricated in metals as well as other polymers. It is placed inside the machine between the pressure hot plates, and using a combination of heat and pressure patterned on to the foil. It is possible to replicate both small and large 2½D structures relatively fast.


[[image:hotembosser.jpg|200x200px|right|thumb|Location of the machine is the basement of building 346 room 901, photo: DTU Nanolab]]


'''The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in LabManager:'''  
'''The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in LabManager:'''  
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== Process information ==
== Process information ==


Link to process pages - e.g. one page for each material
At the moment there are no set processes for the machine. Each material demands different process parameters, depending on the type of process you are running. For development of process that fits your needs contact for the machine responsible personel, and we will assist you in designing the optimal process
 
Example:
*


==Equipment performance and process related parameters==
==Equipment performance and process related parameters==
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|style="background:LightGrey; color:black"|  
|style="background:LightGrey; color:black"|  
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Purpose 1
*Hot Embossing
*Purpose 2
*Chip Bonding
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Performance
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Performance
|style="background:LightGrey; color:black"|Response 1
|style="background:LightGrey; color:black"|Press Plates Temperature
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Performance range 1
*Temperatures close to the glass transition temperature of the polymer give the best results when it comes to pattern replication.
*Performance range 2
*Temperatures that are 5 degrees above the glass transition temperature of the polymer give the best results when bonding lids on top of chips. If bonding chip to lid, where the polymers are of different types/grades this rule will not apply
 
|-
|-
|style="background:LightGrey; color:black"|Response 2
|style="background:LightGrey; color:black"|Press Plates Pressure
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Performance range
*Pressures vary depending on the process. Typically when bonding chips lower pressures are preferred, when imprinting or embossing higher pressures give the best results
 
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameter range
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameter range
|style="background:LightGrey; color:black"|Parameter 1
|style="background:LightGrey; color:black"|Temperature
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Range
*0-285 degrees Celsius
 
|-
|-
|style="background:LightGrey; color:black"|Parameter 2
|style="background:LightGrey; color:black"|Pressure
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Range
*1.5-300 kN
   
   
|-
|-
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*<nowiki>#</nowiki> 100 mm wafers
*<nowiki>#</nowiki> 100 mm wafers
*<nowiki>#</nowiki> 150 mm wafers  
*<nowiki>#</nowiki> 150 mm wafers  
*<nowiki>#</nowiki> 200 mm wafers
*<nowiki>#</nowiki> odd sized samples, contact for the machine responsible personel
|-
|-
| style="background:LightGrey; color:black"|Allowed materials
| style="background:LightGrey; color:black"|Allowed materials
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Allowed material 1
*PMMA
*Allowed material 2
*TOPAS 5013-L10
*TOPAS 8007
*PC
*PP
*PCL
*SU8
*Graphene
*Metals (Al,Ni....)
*For other materials contact for machine responsible personel
|-  
|-  
|}
|}


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Latest revision as of 16:01, 27 March 2023

Feedback to this page: click here

Unless anything else is stated, everything on this page, text and pictures are made by DTU Nanolab.

Hot Embosser

The Hot Embosser at DTU Nanolab is a hydraulic machine, a Collin Press P300 SV. It is located in the basement of building 346 (room 901). The device is typically made using variety of different polymer foils, as well as Graphene. A master pattern, called a shim, is usually fabricated in Si, but can also be fabricated in metals as well as other polymers. It is placed inside the machine between the pressure hot plates, and using a combination of heat and pressure patterned on to the foil. It is possible to replicate both small and large 2½D structures relatively fast.

Location of the machine is the basement of building 346 room 901, photo: DTU Nanolab

The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in LabManager:

Hot Embosser in LabManager

Process information

At the moment there are no set processes for the machine. Each material demands different process parameters, depending on the type of process you are running. For development of process that fits your needs contact for the machine responsible personel, and we will assist you in designing the optimal process

Equipment performance and process related parameters

Equipment Equipment 1
Purpose
  • Hot Embossing
  • Chip Bonding
Performance Press Plates Temperature
  • Temperatures close to the glass transition temperature of the polymer give the best results when it comes to pattern replication.
  • Temperatures that are 5 degrees above the glass transition temperature of the polymer give the best results when bonding lids on top of chips. If bonding chip to lid, where the polymers are of different types/grades this rule will not apply
Press Plates Pressure
  • Pressures vary depending on the process. Typically when bonding chips lower pressures are preferred, when imprinting or embossing higher pressures give the best results
Process parameter range Temperature
  • 0-285 degrees Celsius
Pressure
  • 1.5-300 kN
Substrates Batch size
  • # small samples
  • # 50 mm wafers
  • # 100 mm wafers
  • # 150 mm wafers
  • # 200 mm wafers
  • # odd sized samples, contact for the machine responsible personel
Allowed materials
  • PMMA
  • TOPAS 5013-L10
  • TOPAS 8007
  • PC
  • PP
  • PCL
  • SU8
  • Graphene
  • Metals (Al,Ni....)
  • For other materials contact for machine responsible personel


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