Specific Process Knowledge/Back-end processing/Die Bonder: Difference between revisions

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[[image:Die-bonder_Cammax_EDB-80.jpg|200x200px|thumb|The Die-bonder Cammax EDB-80 is placed in Danchip's Packlab building 347, 1. floor.]]
[[image:Die-bonder_Cammax_EDB-80.jpg|200x200px|thumb|The Die-bonder Cammax EDB-80 is placed in the Packlab in building 347, 1st floor.]]
[[image:DieBonderHeatingChuck.jpg|200x300px|thumb|Heating Chuck on the Die-bonder]]
[[image:DieBonderHeatingChuck.jpg|200x300px|thumb|Heating Chuck on the Die-bonder]]
== Die bonder (eutectic metal soldering) ==
== Die bonder (eutectic metal soldering) ==


The Cammax EDB80 Die bonder is for placing and soldering dies onto a package or substrate.  
The Cammax EDB80 Die bonder is for placing and soldering dies onto a package or substrate.  
[[Image:section under construction.jpg|70px]] ''Will be temporary taken out of service during the PolyFabLab construction.''


The bonder has a graphite heater element enabling fast heating to the melting point of the solder. To prevent oxidation of the solder and bonding surfaces it is possible to have a gas flow of formier gas (4-10% H2 in N2) over the sample. The machine also has a pick-up tool enabling accurate placement of the sample onto a carrier.
The bonder has a graphite heater element enabling fast heating to the melting point of the solder. To prevent oxidation of the solder and bonding surfaces it is possible to have a gas flow of formier gas (4-10% H2 in N2) over the sample. The machine also has a pick-up tool enabling accurate placement of the sample onto a carrier.
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<!-- give the link to the equipment info page in LabManager: -->
<!-- give the link to the equipment info page in LabManager: -->
[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=306 Die Bonder in LabManager]
[http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=306 Die Bonder in LabManager]


== Process information ==
== Process information ==
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== Flip-chip bonder (glue attachment) ==
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[[image:Flip_chip_Bonder_dr_Tresky.jpg|200x200px|right|thumb|The Flip chip bonder is placed in Danchip's Packlab building 347, 1. floor.]]
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The flip chip bonder can be used to place chips on a substrate with high precision. This way electrical contacts can be made between contact pads on the chip and substrate.
 
With a dispensing tool small amounts of solder paste or glue is dispensed on the substrate with high accuracy. The substrate could for example be a printed circuit board (PCB). After some experience with the machine, it is possible to place dots with different shapes and sizes on the surface. With a placement tool a chip can then be picked up upside down and by the use of a camera unit, it is possible to align the contacts on the chip to the solder/glue dots on the on the substrate before joining the two surfaces with a light pressure. The stack is subsequently cured and an underfill glue can be dispensed to enhance the bonding strength between chip and substrate.
 
The Flip Chip Bonder is placed in Danchip's Packlab building 347, 1. floor.
 
'''The user manuals, user APVs, technical information and contact information can be found in LabManager:'''
 
<!-- give the link to the equipment info page in LabManager: -->
[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=319 Flip-chip Bonder in LabManager]


==Equipment performance and process related parameters==
==Equipment performance and process related parameters==
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!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment  
!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment  
|style="background:WhiteSmoke; color:black"|<b>Die bonder</b>
|style="background:WhiteSmoke; color:black"|<b>Die bonder</b>
|style="background:WhiteSmoke; color:black"|<b>Flip-chip bonder</b>
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|-
!style="background:silver; color:black;" align="center" width="60"|Purpose  
!style="background:silver; color:black;" align="center" width="60"|Purpose  
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*Fine placement of dies
*Fine placement of dies
*Eutectic metal soldering
*Eutectic metal soldering
|style="background:WhiteSmoke; color:black"|
*Fine placement of dies
*Glue attachment
|-
|-
!style="background:silver; color:black;" align="center" width="60"|Performance
!style="background:silver; color:black;" align="center" width="60"|Performance
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*Low thermal resistance
*Low thermal resistance
*Always conducting
*Always conducting
|style="background:WhiteSmoke; color:black"|
*Medium or High thermal resistance
*Possibility of both conducting and isolating adhesives
*If an epoxy based adhesive is used the user is required to have the epoxy course.
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
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*Should be able to withstand the soldering temperature
*Should be able to withstand the soldering temperature
*Typical materials are: Alumina (Al2O3), AluminumNitride (AlN)
*Typical materials are: Alumina (Al2O3), AluminumNitride (AlN)
|style="background:WhiteSmoke; color:black"|
*Any that is compatible with the glue and temperature used
|-  
|-  
|}
|}


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Latest revision as of 15:59, 6 March 2023

Feedback to this page: click here

The Die-bonder Cammax EDB-80 is placed in the Packlab in building 347, 1st floor.
Heating Chuck on the Die-bonder

Die bonder (eutectic metal soldering)

The Cammax EDB80 Die bonder is for placing and soldering dies onto a package or substrate.

Section under construction.jpg Will be temporary taken out of service during the PolyFabLab construction.

The bonder has a graphite heater element enabling fast heating to the melting point of the solder. To prevent oxidation of the solder and bonding surfaces it is possible to have a gas flow of formier gas (4-10% H2 in N2) over the sample. The machine also has a pick-up tool enabling accurate placement of the sample onto a carrier.

The user manuals, user APVs, technical information and contact information can be found in LabManager:

Die Bonder in LabManager

Process information









Equipment performance and process related parameters

Equipment Die bonder
Purpose
  • Fine placement of dies
  • Eutectic metal soldering
Performance
  • Low thermal resistance
  • Always conducting
Substrates Allowed materials
  • Should be able to withstand the soldering temperature
  • Typical materials are: Alumina (Al2O3), AluminumNitride (AlN)


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