Specific Process Knowledge/Back-end processing/Die Bonder: Difference between revisions

Revision as of 16:09, 5 February 2014

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The Cammax EDB80 Die bonder is for placing and soldering dies onto a package or substrate.

The user manuals, user APVs, technical information and contact information can be found in LabManager:

The Die-bonder Cammax EDB-80

The Flip chip bonder

The user manuals, user APVs, technical information and contact information can be found in LabManager: Flip-chip Bonder in LabManager

Equipment		Die bonder	Flip-chip bonder
Purpose		Fine placement of dies Eutectic metal soldering	Fine placement of dies glue attachment
Performance		Low thermal resistance Always conducting	Medium or High thermal resistance Possibility of both conducting and isolating adhesives If an epoxy based adhesive is used the user is required to have the epoxy course.
Substrates	Allowed materials	Should be able to withstand the soldering temperature Typical materials are: Alumina (Al2O3), AluminumNitride (AlN)	Any that is compatible with the glue used

@@ Line 23: / Line 23: @@
 [[image:Flip_chip_Bonder_dr_Tresky.jpg|200x200px|right|thumb|The Flip chip bonder]]
+'''The user manuals, user APVs, technical information and contact information can be found in LabManager:'''
 <!-- give the link to the equipment info page in LabManager: -->
 [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=319 Flip-chip Bonder in LabManager]