Specific Process Knowledge/Back-end processing/Die Bonder: Difference between revisions

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== Flip-chip bonder (glue attachment) ==
== Flip-chip bonder (glue attachment) ==


[[image:flip-chip-bonder.jpg|200x200px|right|thumb|The Flip-chip bonder (picture coming soon)]]
[[image:Flip chip Bonder dr Tresky.jpg|200x200px|right|thumb|The Flip-chip bonder (picture coming soon)]]


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Revision as of 15:21, 24 January 2014

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Die bonder (eutectic metal soldering)

The Cammax EDB80 Die bonder is for placing and soldering dies onto a package or substrate.

The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in LabManager:

The Die-bonder Cammax EDB-80

Die Bonder in LabManager

Process information

Flip-chip bonder (glue attachment)

The Flip-chip bonder (picture coming soon)

Flip-chip Bonder in LabManager (not there yet)

Equipment performance and process related parameters

Equipment Die bonder Flip-chip bonder
Purpose
  • Fine placement of dies
  • Eutectic metal soldering
  • Fine placement of dies
  • glue attachment
Performance
  • Low thermal resistance
  • Always conducting
  • Medium or High thermal resistance
  • Possibility of both conducting and isolating adhesives
  • If an epoxy based adhesive is used the user is required to have the epoxy course.
Substrates Allowed materials
  • Should be able to withstand the soldering temperature
  • Typical materials are: Alumina (Al2O3), AluminumNitride (AlN)
  • Any that is compatible with the glue used


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