Specific Process Knowledge/Back-end processing/Die Bonder: Revision history

6 March 2023

• curprev 15:5915:59, 6 March 2023‎ Jehan talk contribs‎ 2,714 bytes +126‎ No edit summary

23 March 2022

• curprev 13:1113:11, 23 March 2022‎ Kabi talk contribs‎ 2,588 bytes −477‎ →‎Equipment performance and process related parameters
• curprev 13:0713:07, 23 March 2022‎ Kabi talk contribs‎ 3,065 bytes −1,384‎ →‎Flip-chip bonder (glue attachment)

25 November 2019

• curprev 18:4018:40, 25 November 2019‎ Jmli talk contribs‎ 4,449 bytes −2‎ No edit summary
• curprev 18:3018:30, 25 November 2019‎ Jmli talk contribs‎ 4,451 bytes −16‎ No edit summary

21 November 2017

• curprev 17:4217:42, 21 November 2017‎ Jehan talk contribs‎ 4,467 bytes +24‎ →‎Process information
• curprev 17:4117:41, 21 November 2017‎ Jehan talk contribs‎ 4,443 bytes −4‎ →‎Process information
• curprev 17:4117:41, 21 November 2017‎ Jehan talk contribs‎ 4,447 bytes +28‎ →‎Process information
• curprev 17:3917:39, 21 November 2017‎ Jehan talk contribs‎ 4,419 bytes −1‎ No edit summary
• curprev 17:3817:38, 21 November 2017‎ Jehan talk contribs‎ 4,420 bytes 0‎ →‎Flip-chip bonder (glue attachment)
• curprev 17:3817:38, 21 November 2017‎ Jehan talk contribs‎ 4,420 bytes −11‎ →‎Die bonder (eutectic metal soldering)
• curprev 17:2917:29, 21 November 2017‎ Jehan talk contribs‎ 4,431 bytes −1‎ →‎Die bonder (eutectic metal soldering)
• curprev 17:2117:21, 21 November 2017‎ Jehan talk contribs‎ 4,432 bytes +90‎ →‎Die bonder (eutectic metal soldering)

24 March 2017

• curprev 15:4415:44, 24 March 2017‎ Jehan talk contribs‎ 4,342 bytes +333‎ →‎Die bonder (eutectic metal soldering)

14 May 2014

• curprev 14:2414:24, 14 May 2014‎ Kabi talk contribs‎ 4,009 bytes +55‎ →‎Die bonder (eutectic metal soldering)
• curprev 14:2314:23, 14 May 2014‎ Kabi talk contribs‎ 3,954 bytes +55‎ →‎Flip-chip bonder (glue attachment)
• curprev 14:2314:23, 14 May 2014‎ Kabi talk contribs‎ 3,899 bytes +77‎ →‎Flip-chip bonder (glue attachment)

5 February 2014

• curprev 16:3716:37, 5 February 2014‎ Kabi talk contribs‎ 3,822 bytes 0‎ →‎Equipment performance and process related parameters
• curprev 16:3616:36, 5 February 2014‎ Kabi talk contribs‎ 3,822 bytes +16‎ →‎Equipment performance and process related parameters
• curprev 16:3516:35, 5 February 2014‎ Kabi talk contribs‎ 3,806 bytes +22‎ →‎Flip-chip bonder (glue attachment)
• curprev 16:3316:33, 5 February 2014‎ Kabi talk contribs‎ 3,784 bytes −2‎ →‎Die bonder (eutectic metal soldering)
• curprev 16:3216:32, 5 February 2014‎ Kabi talk contribs‎ 3,786 bytes −1‎ →‎Flip-chip bonder (glue attachment)
• curprev 16:3116:31, 5 February 2014‎ Kabi talk contribs‎ 3,787 bytes +828‎ →‎Flip-chip bonder (glue attachment)
• curprev 16:1016:10, 5 February 2014‎ Kabi talk contribs‎ 2,959 bytes +1‎ →‎Flip-chip bonder (glue attachment)
• curprev 16:0916:09, 5 February 2014‎ Kabi talk contribs‎ 2,958 bytes +110‎ No edit summary
• curprev 16:0616:06, 5 February 2014‎ Kabi talk contribs‎ 2,848 bytes −16‎ No edit summary
• curprev 16:0116:01, 5 February 2014‎ Kabi talk contribs‎ 2,864 bytes 0‎ No edit summary

31 January 2014

• curprev 10:0110:01, 31 January 2014‎ Bghe talk contribs‎ 2,864 bytes +1‎ →‎Die bonder (eutectic metal soldering)
• curprev 10:0010:00, 31 January 2014‎ Bghe talk contribs‎ 2,863 bytes −102‎ →‎Die bonder (eutectic metal soldering)
• curprev 10:0010:00, 31 January 2014‎ Bghe talk contribs‎ 2,965 bytes +1‎ →‎Die bonder (eutectic metal soldering)
• curprev 10:0010:00, 31 January 2014‎ Bghe talk contribs‎ 2,964 bytes −45‎ →‎Die bonder (eutectic metal soldering)

24 January 2014

• curprev 15:4315:43, 24 January 2014‎ Kabi talk contribs‎ 3,009 bytes −1‎ →‎Flip-chip bonder (glue attachment)
• curprev 15:3215:32, 24 January 2014‎ Kabi talk contribs‎ 3,010 bytes +1‎ No edit summary
• curprev 15:2515:25, 24 January 2014‎ Kabi talk contribs‎ 3,009 bytes +100‎ No edit summary
• curprev 15:2315:23, 24 January 2014‎ Kabi talk contribs‎ 2,909 bytes −22‎ No edit summary
• curprev 15:2115:21, 24 January 2014‎ Kabi talk contribs‎ 2,931 bytes +10‎ →‎Flip-chip bonder (glue attachment)

5 September 2013

• curprev 11:4111:41, 5 September 2013‎ Jehan talk contribs‎ m 2,921 bytes −7‎ No edit summary

26 August 2013

• curprev 11:0911:09, 26 August 2013‎ Jehan talk contribs‎ 2,928 bytes −46‎ No edit summary

6 May 2013

• curprev 16:5916:59, 6 May 2013‎ Jehan talk contribs‎ 2,974 bytes +34‎ No edit summary
• curprev 16:5816:58, 6 May 2013‎ Jehan talk contribs‎ 2,940 bytes +304‎ No edit summary
• curprev 16:5616:56, 6 May 2013‎ Jehan talk contribs‎ 2,636 bytes +42‎ No edit summary
• curprev 16:2616:26, 6 May 2013‎ Jehan talk contribs‎ 2,594 bytes +16‎ No edit summary

• curprev 16:2216:22, 6 May 2013‎ Jehan talk contribs‎ 2,578 bytes +2,578‎ Created page with "'''Feedback to this page''': '''[mailto:danchipsupport@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://http://labadviser.danchip.dtu.dk/index.php?title=Specific_Proc..."