Specific Process Knowledge/Back-end processing

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Back-end (or post-fab) Processing are typical processes used to finish up your wafer/chip. This includes thinning and cutting out the wafer in chips that can be put on a carrier, a board or in a package, attaching the chip to the carrier and connecting it with wires to get electrical access to it.

These processes are usually carried out outside the clean room.

Choose an equipment

• Chip/die mounting
  • Die Bonder (eutectic metal)
  • Flip-chip Bonder (glue)
• Wire bonding
  • TPT Wire Bonder
  • Ball Wire Bonder
• Wafer dicing/machining
  • Polisher/Lapper machine
  • Wafer Scriber
  • Disco Saw
  • Laser Micromachining Tool
  • Sandblasting (at DTU Nanotech).
• Molding
  • Polymer Injection Molder
• X-ray inspection system
  • Focal Spot X-ray system

Choose processing method

Lapping/polishing	Cutting	Milling	Die bonding	Wire bonding
Polisher/Lapper machine	Wafer Scriber Disco Saw Laser Micromachining Tool	Laser Micromachining Tool Nanotech milling lab	Die Bonder (eutectic metal) Flip-chip Bonder (glue)	TPT Wire Bonder Ball Wire Bonder

Choose material to be processed

Dielectrica	Semiconductors	Metals	Polymers
Borofloat glass (Pyrex) Fused silica (quartz)	Silicon III-V	Aluminium Nickel Steel	PMMA TOPAS Polystyrene Polycarbonate