Specific Process Knowledge/Back-end processing: Difference between revisions
Jump to navigation
Jump to search
No edit summary |
No edit summary |
||
| Line 1: | Line 1: | ||
== Choose an equipment == | == Choose an equipment == | ||
*[[/Die | *[[/Die Bonder|Die Bonder (eutectic metal)]] | ||
*[[/Wire Bonder|Wire | *[[/Flip-chip Bonder|Flip-chip Bonder (glue)]] | ||
*[[/Wire Bonder|TPT Wire Bonder]] | |||
*[[/Ball Wire Bonder|Ball Wire Bonder]] | |||
*[[/Wafer Scriber|Wafer Scriber]] | *[[/Wafer Scriber|Wafer Scriber]] | ||
*[[/Disco Saw|Disco Saw]] | *[[/Disco Saw|Disco Saw]] | ||
*[[/Polymer Injection Molder|Polymer Injection Molder]] | *[[/Polymer Injection Molder|Polymer Injection Molder]] | ||
*[[/Polishing machine| | *[[/Polishing machine|Polisher/Lapper machine]] | ||
*[[/Laser Micromachining Tool|Laser Micromachining Tool]] | *[[/Laser Micromachining Tool|Laser Micromachining Tool]] | ||
*[[/Sandblasting|Sandblasting (at DTU Nanotech).]] Sandblasting is a very fast way of structuring glass and can be used for e.g. making inlet holes in glass substrates for microfluidic devices | *[[/Sandblasting|Sandblasting (at DTU Nanotech).]] Sandblasting is a very fast way of structuring glass and can be used for e.g. making inlet holes in glass substrates for microfluidic devices | ||
Revision as of 15:12, 6 May 2013
Choose an equipment
- Die Bonder (eutectic metal)
- Flip-chip Bonder (glue)
- TPT Wire Bonder
- Ball Wire Bonder
- Wafer Scriber
- Disco Saw
- Polymer Injection Molder
- Polisher/Lapper machine
- Laser Micromachining Tool
- Sandblasting (at DTU Nanotech). Sandblasting is a very fast way of structuring glass and can be used for e.g. making inlet holes in glass substrates for microfluidic devices