Specific Process Knowledge/Back-end processing: Difference between revisions
Jump to navigation
Jump to search
(New page: == Choose an equipment == *Wire bonder *anodic bonder *Wafer scriber *Saw *Polishing machine) |
No edit summary |
||
| Line 2: | Line 2: | ||
*Wire bonder | *Wire bonder | ||
* | *Anodic bonder | ||
*Wafer scriber | *Wafer scriber | ||
*Saw | *Saw | ||
*Polishing machine | *Polishing machine | ||
Revision as of 13:02, 2 October 2007
Choose an equipment
- Wire bonder
- Anodic bonder
- Wafer scriber
- Saw
- Polishing machine