Specific Process Knowledge/Back-end processing: Difference between revisions
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* X-ray inspection system | * X-ray inspection system | ||
**[[/Focal Spot X-ray system|X-ray Focal Spot inspection system]] | **[[/Focal Spot X-ray system|X-ray Focal Spot inspection system]] | ||
Revision as of 15:50, 25 February 2020
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Back-end (or Post-fab) Processing are typical processes used to finish up your wafer/chip. This includes thinning and cutting out the wafer in chips that can be put on a carrier, a board or in a package, attaching the chip to the carrier and connecting it with wires to get electrical access to it.
These processes are usually carried out a number of different places. We also have a laboratory called PackLab located in building 347 1st floor. It is a class 1000 cleanroom and in here we have equipment commonly used for back-end processing. Some equipment is further placed in the basement of building 346 and some on the 1st floor in building 346.
Below you can see a list of equipment for back-end processing that is available at DTU Nanolab.
Choose an equipment
- Stylus profilometer measurements
- Substrate/chip/die cleaning
- Chip/die mounting
- Wire bonding
- Wafer dicing/machining
- Molding
- X-ray inspection system
Choose processing method
| Lapping/polishing | Cutting | Milling | Die bonding | Wire bonding |