Specific Process Knowledge/Back-end processing: Difference between revisions

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Back-end (or Post-fab) Processing are typical processes used to finish up your wafer/chip. This includes thinning and cutting out the wafer in chips that can be put on a carrier, a board or in a package, attaching the chip to the carrier and connecting it with wires to get electrical access to it.
Back-end (or Post-fab) Processing are typical processes used to finish up your wafer/chip. This includes thinning and cutting out the wafer in chips that can be put on a carrier, a board or in a package, attaching the chip to the carrier and connecting it with wires to get electrical access to it.


These processes are usually carried out outside the clean room. At Danchip we have a laboratory called Packlab located in building 347 1.st floor. It is a class 1000 cleanroom and in here we have equipment commonly used for back-end processing.  
These processes are usually carried out a number of different places at DTU Danchip. At Danchip we also have a laboratory called PackLab located in building 347 1.st floor. It is a class 1000 cleanroom and in here we have equipment commonly used for back-end processing. Some equipment is further placed in the basement of building 346 and some on the 1.st floor in building 346.
 
Below you can see a list of equipment for back-end processing that is available at DTU Danchip.  


== Choose an equipment ==
== Choose an equipment ==

Revision as of 15:44, 6 February 2014

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Back-end (or Post-fab) Processing are typical processes used to finish up your wafer/chip. This includes thinning and cutting out the wafer in chips that can be put on a carrier, a board or in a package, attaching the chip to the carrier and connecting it with wires to get electrical access to it.

These processes are usually carried out a number of different places at DTU Danchip. At Danchip we also have a laboratory called PackLab located in building 347 1.st floor. It is a class 1000 cleanroom and in here we have equipment commonly used for back-end processing. Some equipment is further placed in the basement of building 346 and some on the 1.st floor in building 346.

Below you can see a list of equipment for back-end processing that is available at DTU Danchip.

Choose an equipment

Choose processing method

Lapping/polishing Cutting Milling Die bonding Wire bonding

Choose material to be processed

Dielectrica Semiconductors Metals Polymers
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