Specific Process Knowledge/Back-end processing: Difference between revisions
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Back-end (or Post-fab) Processing are typical processes used to finish up your wafer/chip. This includes thinning and cutting out the wafer in chips that can be put on a carrier, a board or in a package, attaching the chip to the carrier and connecting it with wires to get electrical access to it. | Back-end (or Post-fab) Processing are typical processes used to finish up your wafer/chip. This includes thinning and cutting out the wafer in chips that can be put on a carrier, a board or in a package, attaching the chip to the carrier and connecting it with wires to get electrical access to it. | ||
These processes are usually carried out outside the clean room. | These processes are usually carried out outside the clean room. At Danchip we have a laboratory called Packlab located in building 347 1.st floor. It is a class 1000 clean room | ||
== Choose an equipment == | == Choose an equipment == | ||
Revision as of 15:35, 6 February 2014
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Back-end (or Post-fab) Processing are typical processes used to finish up your wafer/chip. This includes thinning and cutting out the wafer in chips that can be put on a carrier, a board or in a package, attaching the chip to the carrier and connecting it with wires to get electrical access to it.
These processes are usually carried out outside the clean room. At Danchip we have a laboratory called Packlab located in building 347 1.st floor. It is a class 1000 clean room
Choose an equipment
- Chip/die mounting
- Wire bonding
- Wafer dicing/machining
- Molding
- X-ray inspection system
Choose processing method
| Lapping/polishing | Cutting | Milling | Die bonding | Wire bonding |
Choose material to be processed
| Dielectrica | Semiconductors | Metals | Polymers |