Specific Process Knowledge/Back-end processing: Difference between revisions

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*[[/Borofloat cutting and milling|Borofloat glass (Pyrex)]]
*[[/Borofloat back-end process|Borofloat glass (Pyrex)]]
*[[/Quartz cutting and milling|Fused silica (quartz)]]
*[[/Quartz back-end process|Fused silica (quartz)]]
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*[[/Silicon cutting and milling|Silicon]]
*[[/Silicon back-end process|Silicon]]
*[[/III-V lapping|III-V]]
*[[/III-V lapping|III-V]]
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*[[/Aluminium cutting and milling|Aluminium]]
*[[/Aluminium back-end process|Aluminium]]
*[[/Nickel cutting and milling|Nickel]]
*[[/Nickel back-end process|Nickel]]
*[[/Steel cutting and milling|Steel]]
*[[/Steel back-end process|Steel]]
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*[[/PMMA cutting and milling|PMMA]]
*[[/PMMA back-end process|PMMA]]
*[[/TOPAS cutting and milling|TOPAS]]
*[[/TOPAS back-end process|TOPAS]]
*[[/Polystyrene cutting and milling|Polystyrene]]
*[[/Polystyrene back-end process|Polystyrene]]
*[[/Polycarbonate cutting and milling|Polycarbonate]]
*[[/Polycarbonate back-end process|Polycarbonate]]
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Revision as of 16:25, 6 December 2013

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Back-end Processing are typical processes used to finish up your wafer/chip. This includes thinning and cutting out the wafer in chips that can be put on a carrier, a board or in a package, attaching the chip to the carrier and connecting it with wires to get electrical access to it.

These processes are usually carried out outside the clean room.

Choose an equipment

Choose processing method

Lapping/polishing Cutting Milling Die bonding Wire bonding

Choose material to be processed

Dielectrica Semiconductors Metals Polymers
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