Specific Process Knowledge/Back-end processing: Difference between revisions

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**[[/Focal Spot X-ray system|Focal Spot X-ray system]]
**[[/Focal Spot X-ray system|Focal Spot X-ray system]]


== Choose processing method ==
{| {{table}}
| align="left" valign="top" style="background:LightGray"|''' Lapping/polishing'''
| align="left" valign="top"  style="background:LightGray"|''' Cutting'''
| align="left" valign="top" style="background:#DCDCDC;"|''' Milling'''
| align="left" valign="top" style="background:LightGray"|''' Die bonding'''
| align="left" valign="top" style="background:LightGray"|''' Wire bonding'''
|-valign="top"
|style="background: LightGray"|
*[[/Polishing machine|Polisher/Lapper machine]]
|style="background: LightGray"|
*[[/Wafer Scriber|Wafer Scriber]]
*[[/Disco Saw|Disco Saw]]
*[[/Laser Micromachining Tool|Laser Micromachining Tool]]
|style="background: LightGray"|
*[[/Laser Micromachining Tool|Laser Micromachining Tool]]
*[http://portalen.dtu.dk/Institutter/DTU_Nanotech.aspx Nanotech milling lab]
|style="background: LightGray"|
*[[/Die Bonder|Die Bonder (eutectic metal)]]
*[[/Die Bonder#Flip-chip bonder (glue attachment)|Flip-chip Bonder (glue)]]
|style="background: LightGray"|
*[[/Wire Bonder|TPT Wire Bonder]]
*[[/Wire Bonder#Ball Wire Bonder K&S 4524|Ball Wire Bonder]]
|-
|}
== Choose material to be processed ==
== Choose material to be processed ==
{| {{table}}
{| {{table}}

Revision as of 16:19, 6 December 2013

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Back-end Processing are typical processes used to finish up your wafer/chip. This includes thinning and cutting out the wafer in chips that can be put on a carrier, a board or in a package, attaching the chip to the carrier and connecting it with wires to get electrical access to it.

These processes are usually carried out outside the clean room.

Choose an equipment

Choose processing method

Lapping/polishing Cutting Milling Die bonding Wire bonding

Choose material to be processed

Dielectrica Semiconductors Metals Polymers
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