Specific Process Knowledge/Back-end processing: Difference between revisions
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Back-end Processing are typical processes used to finish up your wafer/chip. This includes thinning and cutting out the wafer in chips that can be put on a carrier, a board or in a package, attaching the chip to the carrier and connecting it with wires to get electrical access to it. | Back-end Processing are typical processes used to finish up your wafer/chip. This includes thinning and cutting out the wafer in chips that can be put on a carrier, a board or in a package, attaching the chip to the carrier and connecting it with wires to get electrical access to it. | ||
These processes are | |||
These processes are usually carried out outside the clean room. | |||
== Choose an equipment == | == Choose an equipment == | ||
Revision as of 11:56, 5 September 2013
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Back-end Processing are typical processes used to finish up your wafer/chip. This includes thinning and cutting out the wafer in chips that can be put on a carrier, a board or in a package, attaching the chip to the carrier and connecting it with wires to get electrical access to it.
These processes are usually carried out outside the clean room.
Choose an equipment
- Chip/die mounting
- Wire bonding
- Wafer dicing/machining
- Molding