Specific Process Knowledge/Back-end processing: Difference between revisions
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'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Back-end_processing click here]''' | '''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Back-end_processing click here]''' | ||
Back-end Processing are typical processes used to finish up your wafer/chip. This includes thinning and cutting out the wafer in chips that can be put on a carrier, a board or in a package, attaching the chip to the carrier and connecting it with wires to get electrical access to it. | |||
These processes are uasually carried out outside the clean room. | |||
== Choose an equipment == | == Choose an equipment == | ||
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**[[/Disco Saw|Disco Saw]] | **[[/Disco Saw|Disco Saw]] | ||
**[[/Laser Micromachining Tool|Laser Micromachining Tool]] | **[[/Laser Micromachining Tool|Laser Micromachining Tool]] | ||
**[[/Sandblasting|Sandblasting (at DTU Nanotech).]] | **[[/Sandblasting|Sandblasting (at DTU Nanotech).]] | ||
*Molding | *Molding | ||
**[[/Polymer Injection Molder|Polymer Injection Molder]] | **[[/Polymer Injection Molder|Polymer Injection Molder]] | ||
Revision as of 11:55, 5 September 2013
Feedback to this page: click here
Back-end Processing are typical processes used to finish up your wafer/chip. This includes thinning and cutting out the wafer in chips that can be put on a carrier, a board or in a package, attaching the chip to the carrier and connecting it with wires to get electrical access to it. These processes are uasually carried out outside the clean room.
Choose an equipment
- Chip/die mounting
- Wire bonding
- Wafer dicing/machining
- Molding