Specific Process Knowledge/Back-end processing: Difference between revisions
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== Choose an equipment == | == Choose an equipment == | ||
*[[/Die Bonder|Die Bonder (eutectic metal)]] | * Chip/die mounting | ||
*[[/Die Bonder#Flip-chip bonder (glue attachment)|Flip-chip Bonder (glue)]] | **[[/Die Bonder|Die Bonder (eutectic metal)]] | ||
*[[/Wire Bonder|TPT Wire Bonder]] | **[[/Die Bonder#Flip-chip bonder (glue attachment)|Flip-chip Bonder (glue)]] | ||
*[[/Wire Bonder#Ball Wire Bonder K&S 4524|Ball Wire Bonder]] | *Wire bonding | ||
* | **[[/Wire Bonder|TPT Wire Bonder]] | ||
*[[/ | **[[/Wire Bonder#Ball Wire Bonder K&S 4524|Ball Wire Bonder]] | ||
*[[/ | *Wafer dicing/machining | ||
*[[/ | **[[/Polishing machine|Polisher/Lapper machine]] | ||
*[[/Laser Micromachining Tool|Laser Micromachining Tool]] | **[[/Wafer Scriber|Wafer Scriber]] | ||
*[[/Sandblasting|Sandblasting (at DTU Nanotech).]] Sandblasting is a very fast way of structuring glass and can be used for e.g. making inlet holes in glass substrates for microfluidic devices | **[[/Disco Saw|Disco Saw]] | ||
**[[/Laser Micromachining Tool|Laser Micromachining Tool]] | |||
**[[/Sandblasting|Sandblasting (at DTU Nanotech).]] Sandblasting is a very fast way of structuring glass and can be used for e.g. making inlet holes in glass substrates for microfluidic devices | |||
*Molding | |||
**[[/Polymer Injection Molder|Polymer Injection Molder]] | |||
Revision as of 11:45, 5 September 2013
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Choose an equipment
- Chip/die mounting
- Wire bonding
- Wafer dicing/machining
- Polisher/Lapper machine
- Wafer Scriber
- Disco Saw
- Laser Micromachining Tool
- Sandblasting (at DTU Nanotech). Sandblasting is a very fast way of structuring glass and can be used for e.g. making inlet holes in glass substrates for microfluidic devices
- Molding