Specific Process Knowledge/Back-end processing: Difference between revisions
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Revision as of 08:45, 21 August 2013
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Choose an equipment
- Die Bonder (eutectic metal)
- Flip-chip Bonder (glue)
- TPT Wire Bonder
- Ball Wire Bonder
- Wafer Scriber
- Disco Saw
- Polymer Injection Molder
- Polisher/Lapper machine
- Laser Micromachining Tool
- Sandblasting (at DTU Nanotech). Sandblasting is a very fast way of structuring glass and can be used for e.g. making inlet holes in glass substrates for microfluidic devices