Specific Process Knowledge/Thin film deposition/Deposition of TiW/Sputtering of TiW in Wordentec

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Sputtering of TiW

• Grain size of TiW sputtered in the Wordentec

Depending on the settings (pressure and power) during the sputtering process, the roughness and grain size of the deposited layer can be different. The deposition rate will also change with different settings as seen below in data from the now-decommissioned Wordentec sputter and evaporation system.

Power (W)	Pressure (mbar)	Rate at the center (Å/s)	Rate at the edge (Å/s)
150	$1*10^{-3}$	0.9	0.7
150	$1*10^{-2}$	1.3	1
300	$1*10^{-2}$	2.2	1.8
150	$5*10^{-2}$	1.3	1
250	$5*10^{-2}$	2.4	1.6

Deposition rates measured August-September 2008, KNIL.